| Benefits of new CoolSiCTM MOSFET in HybridPACKTM Drive package for electrical drive train applications W Jakobi, A Uhlemann, M Thoben, C Schweikert, C Strenger, AP Pai, ... CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018 | 44 | 2018 |
| A new behavioral model for accurate loss calculations in power semiconductors AP Pai, T Reiter, M Maerz PCIM Europe 2016; International Exhibition and Conference for Power …, 2016 | 20 | 2016 |
| A calorimetrie method for measuring power losses in power semiconductor modules AP Pai, T Reiter, O Vodyakho, I Yoo, M Maerz 2017 19th European Conference on Power Electronics and Applications (EPE'17 …, 2017 | 14 | 2017 |
| Mission profile analysis and calorimetric loss measurement of a SiC hybrid module for main inverter application of electric vehicles AP Pai, T Reiter, M Maerz 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP), 1-5, 2017 | 14 | 2017 |
| An improved behavioral model for loss calculations in automotive inverters AP Pai, T Reiter, M Maerz EEHE 2016 Wiesloch; Proceedings of, 412-427, 2016 | 9 | 2016 |
| Characteristics of a SiC MOSFET-based double side cooled high performance power module for automotive traction inverter applications AP Pai, M Ebli, T Simmet, A Lis, M Beninger-Bina 2022 IEEE Transportation Electrification Conference & Expo (ITEC), 831-836, 2022 | 8 | 2022 |
| Efficiency investigation of full-SiC versus Si-based automotive inverter power modules at equal commutation speed AP Pai, T Reiter, M Maerz PCIM Europe 2018; International Exhibition and Conference for Power …, 2018 | 7 | 2018 |
| Characterization and mission profile analysis of a SiC hybrid module for main inverter application of electric vehicles AP Pai, T Reiter, M Maerz EEHE 2017 Bamberg; Proceedings of Haus Der Technik, 2017 | 7 | 2017 |
| Novel thermal management strategy for improved inverter reliability in electric vehicles E Trancho, E Ibarra, P Prieto, A Arias, A Lis, AP Pai Applied Sciences 10 (22), 8024, 2020 | 6 | 2020 |
| Computer controlled intrusion-detector and automatic firing-unit for border security KP Vittal, A Pai, A Shenoy, CHS Rao 2010 Second International Conference on Computer and Network Technology, 289-293, 2010 | 6 | 2010 |
| Impact of Silicon Carbide based Power Modules on Mission Profile Efficiency of Automotive Traction Inverters AP Pai Shaker, 2020 | 4 | 2020 |
| Performance Investigation of Semiconductor Devices using Commutation-speed based methodology for the application of Boost Power Factor Correction B Parkash, AP Pai, W Tian, R Kennel Advances in Science, Technology and Engineering Systems Journal 4 (1), 258-267, 2019 | 4 | 2019 |
| Mission Profile Analysis of a SiC Hybrid Module for Automotive Traction Inverters and its Experimental Power-loss Validation with Electrical and Calorimetric Methods AP Pai, T Reiter, O Vodyakho, M Maerz ASTES Journal 3 (1), 2018 | 4 | 2018 |
| Adaptive switching-loss-optimized space-vector modulation for three-level neutral-point-clamped converters HAB Siddique, AP Pai, RW De Doncker 2015 17th European Conference on Power Electronics and Applications (EPE'15 …, 2015 | 4 | 2015 |
| SiC MOSFET-Based High Performance Double Side Cooled Module and Compact Cooler for High Power-Density Automotive Inverter Applications AP Pai, A Widhalm, M Ebli, M Kurz, M La Foresta, MF Osorio 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP), 1-6, 2022 | 2 | 2022 |
| Power semiconductor module with rivet or press fit pin and method for fabricating the same AP Pai, T Hong, A Lis, OM Kreiter, M Rose US Patent App. 17/875,929, 2023 | 1 | 2023 |
| Optimal Selection of Power Semiconductor Technology for On-board Charger (OBC) Applications and Experimental Verification for a 2.5 kW Classical AP Pai, L Holzmann, S Kampl PCIM Europe digital days 2020; International Exhibition and Conference for …, 2020 | 1 | 2020 |
| Lead adapters for semiconductor package AP Pai, T Karczewski, A Lis US Patent 12,113,000, 2024 | | 2024 |
| Adaptive Artificial Neural Networks for Power Loss Prediction in SiC MOSFETs G Di Nuzzo, AP Pai, YC Su 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1-8, 2024 | | 2024 |
| High-Performance Double Side Cooled Power Module for Auto-motive Traction Inverter Applications MK Moghaddam, AP Pai PCIM Asia 2022; International Exhibition and Conference for Power …, 2022 | | 2022 |
