| Steadily decreasing power loss of a double Schottky barrier originating from the dynamics of mobile ions with stable interface states Z Cheng, Z Hou, Y Wang, M Guo, K Wu, J Li, Y Lin Physical Review Applied 17 (3), 034042, 2022 | 27 | 2022 |
| Skin-core structure of thermally aged epoxy resin: Roles of oxidation and re-crosslinking Y Long, J Gao, Z Cheng, D Chen, K Wu, J Li, F Zhou Polymer Degradation and Stability 193, 109743, 2021 | 21 | 2021 |
| Effect of bipolar square wave voltage with varied frequencies on electrical tree growth in epoxy resin C Zhang, S Wang, H Fu, Z Cheng, J Li, J Xiang, C Li IEEE Transactions on Dielectrics and Electrical Insulation 28 (3), 806-814, 2021 | 18 | 2021 |
| Simultaneously enhanced thermal conductivity and breakdown performance of micro/nano-BN Co-doped epoxy composites C Zhang, J Xiang, S Wang, Z Yan, Z Cheng, H Fu, J Li Materials 14 (13), 3521, 2021 | 10 | 2021 |
| Power loss transition of stable ZnO varistor ceramics: Role of oxygen adsorption on the stability of interface states at the grain boundary Z Cheng, R Li, Y Long, J Li, S Li, K Wu Journal of Advanced Ceramics 12 (5), 972-983, 2023 | 9 | 2023 |
| A thermal network model considering thermal coupling effect and TIM degradation in IGBT modules X Zhang, Z Cheng, C Lv, X Sun, J Li, K Wu Energy Reports 9, 1073-1080, 2023 | 7 | 2023 |
| Revisiting the feasibility of distinguishing the long-term stability of MOVs by power loss K Wu, Z Hou, Z Cheng, Y Wang, R Li, Y Lin, J Li, S Li IEEE Transactions on Dielectrics and Electrical Insulation 29 (5), 1983-1990, 2022 | 6 | 2022 |
| Transient conduction of ZnO varistors under moderate time-varying voltages: Dynamics of interfacial charges of the double Schottky barrier Z Cheng, Z Hou, T Wu, Y Wang, R Li, Y Lin, J Li, S Li, K Wu Journal of Applied Physics 133 (5), 2023 | 5 | 2023 |
| Electrical tree propagation in epoxy resin under bipolar square wave field with varied frequencies C Zhang, H Fu, J Xiang, Z Cheng, S Wang, J Li 2020 International Symposium on Electrical Insulating Materials (ISEIM), 458-461, 2020 | 4 | 2020 |
| Surface corona aging of epoxy resin under bipolar square wave field with varied frequencies J Xiang, C Zhang, H Fu, Z Cheng, L Xin, X Zhang, S Wang, J Li 2020 IEEE International Conference on High Voltage Engineering and …, 2020 | 4 | 2020 |
| Electrical tree characteristics of epoxy resin under bipolar square wave voltage H Fu, C Zhang, J Xiang, Z Cheng, S Wang, J Li 2020 IEEE 3rd International Conference on Dielectrics (ICD), 142-145, 2020 | 4 | 2020 |
| Split dynamic mechanical relaxation of an inhomogeneous dielectric and the insights into its anomalous characteristics Y Long, J Li, Z Cheng, J Gao, K Wu, F Zhou Materials Letters 310, 131488, 2022 | 3 | 2022 |
| A direct bonding copper degradation monitoring method for insulated gate bipolar transistor modules: Boundary‐dependent thermal network combined with feedback control X Zhang, Z Cheng, X Sun, K Wu, J Li High Voltage 8 (6), 1264-1274, 2023 | 2 | 2023 |
| Effect of Thermal Cycle Ageing on the Breakdown Performance of Epoxy and Its Micro-composites Y Long, Z Cheng, Z Yan, D Chen, J Li, J Hu, K Wang, H Xia, S Wang 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena …, 2021 | 2 | 2021 |
| Anomalous decreasing power loss of ZnO varistor ceramics during the dc aging: phenomena, insights and perspectives J Li, Z Cheng, S Li, K Wu 2022 9th International Conference on Condition Monitoring and Diagnosis (CMD …, 2022 | 1 | 2022 |
| Study on the decrease of power loss during dc degradation of zinc oxide varistor ceramics Z Hou, Y Zheng, M Guo, Y Wang, Z Cheng, K Wu, J Li, S Li 2021 International Conference on Electrical Materials and Power Equipment …, 2021 | 1 | 2021 |
| Role of Micro-nano Hexagonal Boron Nitride Coordination on Thermal Conductivity and Breakdown Strength of Epoxy Composites Z Cheng, J Xiang, C Zhang, H Fu, L Xin, X Zhang, S Wang, J Li 2020 IEEE International Conference on High Voltage Engineering and …, 2020 | 1 | 2020 |
| Transition from non-Arrhenius to Arrhenius Aging of ZnO Ceramics R Li, Z Cheng, A Gao, K Wu, J Li, Z Tang 2023 IEEE 4th International Conference on Electrical Materials and Power …, 2023 | | 2023 |
| A Non-destructive Condition Assessment Method for DBC Substrate: Dielectric Measurement Z Cheng, Y Long, K Wu, C Zhang, H Fu, S Wang, J Li, S Wang 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena …, 2021 | | 2021 |
