| 3D free space thermally actuated micromirror device J Singh, T Gan, A Agarwal, S Liw Sensors and Actuators A: Physical 123, 468-475, 2005 | 84 | 2005 |
| Method of forming through-wafer interconnects for vertical wafer level packaging CP Sankarapillai, R Nagarajan, M Soundarapandian US Patent 7,183,176, 2007 | 60 | 2007 |
| Observation of Metal-Layer Stress on Si Nanowires in Gate-All-Around High- /Metal-Gate Device Structures N Singh, WW Fang, SC Rustagi, KD Budharaju, SHG Teo, S Mohanraj, ... IEEE Electron Device Letters 28 (7), 558-561, 2007 | 51 | 2007 |
| Reliability studies of a through via silicon stacked module for 3D microsystem packaging SW Yoon, D Witarsa, SYL Lim, V Ganesh, AGK Viswanath, TC Chai, ... 56th Electronic Components and Technology Conference 2006, 5 pp., 2006 | 34 | 2006 |
| A novel electrostatic microactuator for large deflections in MEMS applications J Singh, A Agarwal, M Soundarapandian Thin Solid Films 504 (1-2), 64-68, 2006 | 27 | 2006 |
| A vertical wafer level packaging using through hole filled via interconnects by lift off polymer method for mems and 3d stacking applications CS Premachandran, RNS Mohanraj, CS Choong, MK Iyer Proceedings Electronic Components and Technology, 2005. ECTC'05., 1094-1098, 2005 | 23 | 2005 |
| Monolithic integration of PMUT on CMOS MS Pandian, AK Kantimahanti US Patent 10,322,929, 2019 | 21 | 2019 |
| Monolithical AlN PMUT on pre-processed CMOS substrate J Mufioz, F Torres, A Uranga, V Tsanov, N Bamiol, E Marigó, ... 2018 IEEE International Frequency Control Symposium (IFCS), 1-3, 2018 | 16 | 2018 |
| Through wafer copper via for silicon based SiP application D Witarsa, M Soundarapandian, SW Yoon, V Kripesh, TK Weng, ... 2005 7th Electronic Packaging Technology Conference 1, 6 pp., 2005 | 16 | 2005 |
| Estimation of SAW velocity and coupling coefficient in multilayered piezo-substrates AlN/SiO2/Si AF Malik, V Jeoti, M Fawzy, A Iqbal, Z Aslam, MS Pandian, E Marigo 2016 6th International Conference on Intelligent and Advanced Systems (ICIAS …, 2016 | 14 | 2016 |
| Squared PMUT with enhanced pressure sensitivities E Ledesma, I Zamora, F Torres, A Uranga, V Tzanov, N Barniol, E Marigó, ... Proceedings 2 (13), 925, 2018 | 13 | 2018 |
| Effect of passivation on frit glass bonding method for wafer level hermetic sealing on MEMS devices SC Chong, XL Zhang, S Mohanraj, CS Premachandran, N Ranganathan Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003 | 13 | 2003 |
| Thin film piezoelectric devices integrated on CMOS MS Pandian, EM Ferrer, WS Tay, V Madhaven, AK Kantimahanti, ... 2016 Symposium on Piezoelectricity, Acoustic Waves, and Device Applications …, 2016 | 12 | 2016 |
| Dual-clock with single and monolithical 0-level vacuum packaged MEMS-on-CMOS resonator A Uranga, G Sobreviela, N Barniol, E Marigo, C Tay-Wee-Song, ... 2015 28th IEEE International Conference on Micro Electro Mechanical Systems …, 2015 | 12 | 2015 |
| Mid-air haptic feedback enabled by aluminum nitride PMUTs M Billen, EM Ferrer, MS Pandian, X Rottenberg, V Rochus 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems …, 2022 | 11 | 2022 |
| Design and simulation of 20MHz oscillator using CMOS-MEMS beam resonators AA Zainuddin, J Karim, AN Nordin, MS Pandian, S Khan RSM 2013 IEEE Regional Symposium on Micro and Nanoelectronics, 45-49, 2013 | 11 | 2013 |
| Monolithic BAW oscillator with conventional QFN packaging E Marigó, M Soundara-Pandian, J Bin, J Din, NSB Roslan, A Fawzy, ... 2019 Joint Conference of the IEEE International Frequency Control Symposium …, 2019 | 10 | 2019 |
| Effect of process parameters on sidewall roughness in polymeric optical waveguides SK Pani, CC Wong, K Sudharsanam, SG Mhaisalkar, V Lim, S Mohanraj, ... Thin solid films 462, 471-476, 2004 | 10 | 2004 |
| Above-IC 300 Mhz AIN SAW oscillator A Uranga, G Sobreviela, E Marigó, M Soundara-Pandian, N Barniol 2017 19th International Conference on Solid-State Sensors, Actuators and …, 2017 | 8 | 2017 |
| A 10-bit linearity current-controlled ring oscillator with rolling regulation for smart sensing M Dei, J Sacristán, E Marigó, M Soundara, L Terés, F Serra-Graells 2017 IEEE International Symposium on Circuits and Systems (ISCAS), 1-4, 2017 | 6 | 2017 |
Eloi Marigó FerrerUniversitat Autònoma de Barcelona在 uab.cat 的电子邮件经过验证
