| Food‐materials‐based edible supercapacitors X Wang, W Xu, P Chatterjee, C Lv, J Popovich, Z Song, L Dai, MYS Kalani, ... Advanced Materials Technologies 1 (3), 1600059, 2016 | 118 | 2016 |
| Development of visible-light responsive and mechanically enhanced “smart” UCST interpenetrating network hydrogels Y Xu, O Ghag, M Reimann, P Sitterle, P Chatterjee, E Nofen, H Yu, ... Soft matter 14 (1), 151-160, 2018 | 36 | 2018 |
| Integrated voltage regulator efficiency improvement using coaxial magnetic composite core inductors K Bharath, K Radhakrishnan, MJ Hill, P Chatterjee, H Hariri, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1286-1292, 2021 | 25 | 2021 |
| Thermal and mechanical properties of poly (N‐isopropylacrylamide)‐based hydrogels as a function of porosity and medium change P Chatterjee, A Dai, H Yu, H Jiang, LL Dai Journal of Applied Polymer Science 132 (45), 2015 | 18 | 2015 |
| Pyrrole-based poly (ionic liquids) as efficient stabilizers for formation of hollow multi-walled carbon nanotubes particles P Chatterjee, EM Nofen, W Xu, C Hom, H Jiang, LL Dai Journal of colloid and interface science 504, 140-148, 2017 | 14 | 2017 |
| Thin film barrier seed metallization in magnetic-plugged through hole inductor K Darmawikarta, S Pietambaram, S Gaan, SRS Boyapati, P Chatterjee, ... US Patent 11,443,885, 2022 | 12 | 2022 |
| 3D Microelectronic packaging: from architectures to applications Y Li, D Goyal Springer Nature, 2020 | 9 | 2020 |
| Controlled morphology of thin film silicon integrated with environmentally responsive hydrogels P Chatterjee, Y Pan, EC Stevens, T Ma, H Jiang, LL Dai Langmuir 29 (21), 6495-6501, 2013 | 9 | 2013 |
| Magnetic inductor structures for package devices P Chatterjee, J Zhao, S Vadlamani, Y Wang, R Jain, AJ Brown, LA Link, ... US Patent 11,335,632, 2022 | 5 | 2022 |
| Methods of embedding magnetic structures in substrates S Vadlamani, P Chatterjee, RA May, RS Jain, LA Link, AJ Brown, KO Lee US Patent 11,251,113, 2022 | 5 | 2022 |
| Substrate embedded heat pipe RA May, K Darmawikarta, R Jain, L May, M Moussallem, P Chatterjee US Patent App. 16/209,861, 2020 | 5 | 2020 |
| Enabling magnetic films in inductors integrated into semiconductor packages K Darmawikarta, S Pietambaram, P Chatterjee, SRS Boyapati, WL Jen US Patent 11,270,959, 2022 | 4 | 2022 |
| Edible supercapacitors H Jiang, P Chatterjee, W Xu, X Wang US Patent 10,468,203, 2019 | 4 | 2019 |
| Coreless organic packages with embedded die and magnetic inductor structures AJ Brown, R Jain, P Chatterjee, LA Link, S Vadlamani US Patent 10,700,021, 2020 | 3 | 2020 |
| Electronic substrates having embedded magnetic material using photo-imagable dielectric layers S Vadlamani, P Chatterjee, LA Link, AJ Brown US Patent 11,289,263, 2022 | 2 | 2022 |
| Electronic substrates having embedded dielectric magnetic material to form inductors AJ Brown, P Chatterjee, LA Link, S Vadlamani US Patent 11,189,409, 2021 | 2 | 2021 |
| In-plane inductors in ic packages BC Marin, T Ibrahim, P Chatterjee, H Hariri, Y Deng, S PIETAMBARAM US Patent App. 16/804,317, 2021 | 2 | 2021 |
| Fundamentals of advanced materials and processes in organic substrate technology S Shi, P Tortorici, S Vadlamani, P Chatterjee 3D Microelectronic Packaging: From Architectures to Applications, 397-429, 2021 | 2 | 2021 |
| Coreless electronic substrates having embedded inductors S Pietambaram, P Tadayon, K Darmawikarta, T Ibrahim, P Chatterjee US Patent App. 17/192,187, 2022 | 1 | 2022 |
| Environmentally Responsive Hydrogels: Development and Integration with Hard Materials P Chatterjee Arizona State University, 2015 | 1 | 2015 |
Hanqing Jiang（姜汉卿）Professor of Mechanical Engineering在 westlake.edu.cn 的电子邮件经过验证
