| Nanometer-scale heterogeneous interfacial sapphire wafer bonding for enabling plasmonic-enhanced nanofluidic mid-infrared spectroscopy J Xu, Z Ren, B Dong, X Liu, C Wang, Y Tian, C Lee ACS nano 14 (9), 12159-12172, 2020 | 76 | 2020 |
| Volatile organic compounds sensing based on Bennet doubler-inspired triboelectric nanogenerator and machine learning-assisted ion mobility analysis J Zhu, Z Sun, J Xu, RD Walczak, JA Dziuban, C Lee Science Bulletin 66 (12), 1176-1185, 2021 | 61 | 2021 |
| Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O 3 activation J Xu, C Wang, T Wang, Y Wang, Q Kang, Y Liu, Y Tian RSC advances 8 (21), 11528-11535, 2018 | 55 | 2018 |
| Glass-on-LiNbO3 heterostructure formed via a two-step plasma activated low-temperature direct bonding method J Xu, C Wang, Y Tian, B Wu, S Wang, H Zhang Applied Surface Science 459, 621-629, 2018 | 51 | 2018 |
| Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5G Z Ren, J Xu, X Le, C Lee Micromachines 12 (8), 946, 2021 | 48 | 2021 |
| Direct bonding of silicon and quartz glass using VUV/O3 activation and a multistep low-temperature annealing process J Xu, C Wang, T Wang, Y Liu, Y Tian Applied Surface Science 453, 416-422, 2018 | 38 | 2018 |
| Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics J Xu, Y Du, Y Tian, C Wang International Journal of Optomechatronics 14 (1), 94-118, 2020 | 32 | 2020 |
| Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature J Xu, C Wang, D Li, J Cheng, Y Wang, C Hang, Y Tian Ceramics International 45 (3), 4094-4098, 2019 | 29 | 2019 |
| A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation C Wang, J Xu, S Guo, Q Kang, Y Wang, Y Wang, Y Tian Applied Surface Science 471, 196-204, 2019 | 27 | 2019 |
| Direct bonding of high dielectric oxides for high-performance transistor applications J Xu, C Wang, X Ji, Q An, Y Tian, T Suga Scripta Materialia 178, 307-312, 2020 | 23 | 2020 |
| Direct homo/heterogeneous bonding of silicon and glass using vacuum ultraviolet irradiation in air C Wang, J Xu, X Qi, Y Liu, Y Tian, C Wang, T Suga Journal of The Electrochemical Society 165 (4), H3093, 2018 | 19 | 2018 |
| Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning C Wang, J Xu, X Zeng, Y Tian, C Wang, T Suga Japanese Journal of Applied Physics 57 (2S1), 02BD02, 2017 | 18 | 2017 |
| VUV/O3 activated direct heterogeneous bonding towards high-performance LiNbO3-based optical devices J Xu, C Wang, R Zhang, J Cheng, G Li, J Xiang, Y Tian Applied Surface Science 495, 143576, 2019 | 17 | 2019 |
| Low-temperature direct bonding of Si and quartz glass using the APTES modification J Xu, C Wang, S Zhou, R Zhang, Y Tian Ceramics International 45 (13), 16670-16675, 2019 | 17 | 2019 |
| Communication—defect-free direct bonding for high-performance glass-on-LiNbO3 devices J Xu, C Wang, B Wu, Y Tian, X Qi Journal of the Electrochemical Society 165 (14), B727, 2018 | 10 | 2018 |
| Direct heterogeneous bonding of SiC to Si, SiO2, and glass for high-performance power electronics and bio-MEMS J Xu, C Wang, Q Kang, S Zhou, Y Tian 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1266-1271, 2019 | 7 | 2019 |
| VUV/O3activated bonder for low-temperature direct bonding of Si-based materials J Xu, C Wang, X Qi, B Wu, S Zhou, Y Tian 2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018 | 2 | 2018 |
| Low-temperature direct bonding of silicon to quartz glass wafer via sequential wet chemical surface activation C Wang, J Xu, X Zeng, Y Tian, C Wang, T Suga 2017 5th International Workshop on Low Temperature Bonding for 3D …, 2017 | 1 | 2017 |
| A novel surface humidity controlled bonder for low-temperature wafer bonding C Wang, J Xu, Y Liu, Y Tian, C Wang, T Suga 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 1 | 2016 |
| Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing J Xu, Z Ren, B Dong, C Wang, Y Tian, C Lee Advanced MEMS/NEMS Fabrication and Sensors, 187-215, 2022 | | 2022 |
Chengkuo LeeGlobalFoundries Chair Professor in Eng., ECE Department, National University of Singapore在 nus.edu.sg 的电子邮件经过验证
