| Analysis of effect of tool geometry on plastic flow during friction stir spot welding using particle method S Hirasawa, H Badarinarayan, K Okamoto, T Tomimura, T Kawanami Journal of materials processing technology 210 (11), 1455-1463, 2010 | 195 | 2010 |
| Apparatus and method for performing heat treatment on semiconductor wafers S Hirasawa, T Torii, T Watanabe, T Komatsu, K Honma, A Sakai, ... US Patent 5,001,327, 1991 | 107 | 1991 |
| Heat sink studs having enhanced boiling surfaces for cooling of microelectronic components W Nakayama, T Nakajima, S Hirasawa ASME paper, 89-100, 1984 | 106 | 1984 |
| Optimized performance of condensers with outside condensing surfaces Y Mori, K Hijikata, S Hirasawa, W Nakayama | 102 | 1981 |
| Effect of surface tension on condensate motion in laminar film condensation (study of liquid film in a small trough) H Shigeki, H Kunio, M Yasuo, N Wataru International Journal of Heat and Mass Transfer 23 (11), 1471-1478, 1980 | 84 | 1980 |
| Thermophysical properties and thermal characteristics of phase change emulsion for thermal energy storage media T Kawanami, K Togashi, K Fumoto, S Hirano, P Zhang, K Shirai, ... Energy 117, 562-568, 2016 | 77 | 2016 |
| Heat transfer apparatus W Nakayama, T Nakajima, S Hirasawa, A Kohno, T Takenaka US Patent 4,619,316, 1986 | 77 | 1986 |
| Heat transfer from tube banks to air/water mist flow N Wataru, K Heikichi, H Shigeki International journal of heat and mass transfer 31 (2), 449-460, 1988 | 56 | 1988 |
| Reduction of heat loss from solar thermal collector by diminishing natural convection with high-porosity porous medium S Hirasawa, R Tsubota, T Kawanami, K Shirai Solar Energy 97, 305-313, 2013 | 51 | 2013 |
| Apparatus for cooling integrated circuit chips W Nakayama, S Hirasawa, T Nakajima US Patent 4,694,378, 1987 | 46 | 1987 |
| Cooling device with thermally separated electronic parts on a monolithic substrate N Nakazato, S Hirasawa, S Masukawa, H Kuwahara US Patent 5,793,611, 1998 | 42 | 1998 |
| Semiconductor apparatus and semiconductor package H Ohta, N Ishitsuka, A Yaguchi, S Kawai, N Owada, S Hirasawa US Patent 5,229,643, 1993 | 33 | 1993 |
| Evaluation of fundamental performance on magnetocaloric cooling with active magnetic regenerator T Kawanami, S Hirano, K Fumoto, S Hirasawa Applied thermal engineering 31 (6-7), 1176-1183, 2011 | 29 | 2011 |
| Vapor-condensing, heat-transfer wall K Fujie, W Nakayama, T Daikoku, S Hirasawa, K Kakizaki US Patent 4,166,498, 1979 | 29 | 1979 |
| Analysis of drying shrinkage and flow due to surface tension of spin-coated films on topographic substrates S Hirasawa, Y Saito, H Nezu, N Ohashi, P Maruyama IEEE transactions on semiconductor manufacturing 10 (4), 438-444, 1997 | 28 | 1997 |
| Direct measurement of localized joule heating in silicon devices by means of newly developed high resolution IR microscopy A Yasuda, H Yamaguchi, Y Tanabe, N Owada, S Hirasawa 29th Annual Proceedings Reliability Physics 1991, 245-249, 1991 | 25 | 1991 |
| Temperature distribution in semiconductor wafers heated in a vertical diffusion furnace S Hirasawa, S Kieda, T Watanabe, T Torii, T Takagaki, T Uchino IEEE transactions on semiconductor manufacturing 6 (3), 226-232, 1993 | 24 | 1993 |
| Effect of surface tension on laminar film condensation along a vertical plate with a small leading radius S Hirasawa, K Hijikata, Y Mori, W Nakayama International Heat Transfer Conference Digital Library, 1978 | 24 | 1978 |
| Computer simulation of material flow induced by thermal deformation In phase-change recording films S Okamine, S Hirasawa, M Terao, Y Miyauchi Optical Data Storage 1663, 315-321, 1992 | 22 | 1992 |
| Temperature measuring method using thermal expansion and an apparatus for carrying out the same T Nakata, S Hirasawa, Y Saito, T Ninomiya, M Nomoto US Patent 5,645,351, 1997 | 21 | 1997 |
