| High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles Y Zuo, S Carter-Searjeant, M Green, L Mills, SH Mannan Materials Letters 276, 128260, 2020 | 33 | 2020 |
| Effect of different sizes of Cu nanoparticles on the shear strength of Cu-Cu joints Y Zuo, J Shen, H Xu, R Gao Materials Letters 199, 13-16, 2017 | 30 | 2017 |
| Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle Y Zuo, J Shen, Y Hu, R Gao Journal of Materials Processing Technology 253, 27-33, 2018 | 29 | 2018 |
| Influence of Cu micro/nano-particles mixture and surface roughness on the shear strength of Cu-Cu joints Y Zuo, J Shen, J Xie, L Xiang Journal of Materials Processing Technology 257, 250-256, 2018 | 28 | 2018 |
| Quasi-in-situ observation of the grain growth and grain boundary movement in sintered Cu nanoparticle interconnects Y Zuo, C Zhao, A Robador, M Wickham, SH Mannan Acta Materialia 236, 118135, 2022 | 24 | 2022 |
| Effects of phenolic resin addition on the electrical conductivity and mechanical strength of nano-copper paste formed Cu-Cu joints R Gao, J Shen, F Xie, Y Zuo, D Wu Journal of Electronic Materials 46, 6388-6394, 2017 | 21 | 2017 |
| Low temperature Cu joining by in situ reduction-sintering of CuO nanoparticle for high power electronics Y Zuo, S Carter-Searjeant, M Green, L Mills, SH Mannan Advanced Powder Technology 31 (10), 4135-4144, 2020 | 17 | 2020 |
| Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging Y Zuo, A Robador, M Wickham, SH Mannan Corrosion Science 209, 110713, 2022 | 6 | 2022 |
| Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods Z Jin, YA Shen, Y Zuo, YC Chan, SH Mannan, H Nishikawa Scientific Reports 11 (1), 8668, 2021 | 2 | 2021 |
| Low temperature Cu-Cu bonding by sintering Cu nanoparticles for power electronics Y Zuo, SH Mannan, M Green King's College London, 2022 | | 2022 |
| The voids growth path on Sn-Ag thin film under high current density Z Jin, YA Shen, Y Zuo, SH Mannan, H Nishikawa 2021 International Conference on Electronics Packaging (ICEP), 115-116, 2021 | | 2021 |
| Semi In-Situ Observation on Void Formation in Electromigrated Sn-Ag Film and its Prediction by Random-Walk Simulation Z Jin, YA Shen, Y Zuo, YC Chan, SH Mannan, H Nishikawa Yang and Chan, YC and Mannan, SH and Nishikawa, Hiroshi, Semi In-Situ …, 2020 | | 2020 |
| Comparative study of how additives affect sintered silver microstructure in die-attach applications M Lo, SA Paknejad, H Borrill, WK Kong, A Addo-Kwabena, M Saidoune, ... Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (HiTen …, 2019 | | 2019 |
Samjid H. MannanKing's College London在 kcl.ac.uk 的电子邮件经过验证
Samjid H. MannanKing's College London在 kcl.ac.uk 的电子邮件经过验证