| Enhanced strength in bulk graphene–copper composites K Chu, C Jia physica status solidi (a) 211 (1), 184-190, 2014 | 331 | 2014 |
| Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles K Chu, Z Liu, C Jia, H Chen, X Liang, W Gao, W Tian, H Guo Journal of Alloys and Compounds 490 (1-2), 453-458, 2010 | 322 | 2010 |
| Fabrication and effective thermal conductivity of multi-walled carbon nanotubes reinforced Cu matrix composites for heat sink applications K Chu, Q Wu, C Jia, X Liang, J Nie, W Tian, G Gai, H Guo Composites Science and Technology 70 (2), 298-304, 2010 | 308 | 2010 |
| Two-dimensional (2D)/2D Interface Engineering of a MoS2/C3N4 Heterostructure for Promoted Electrocatalytic Nitrogen Fixation K Chu, Y Liu, Y Li, Y Guo, Y Tian ACS applied materials & interfaces 12 (6), 7081-7090, 2020 | 283 | 2020 |
| Thermal properties of graphene/metal composites with aligned graphene K Chu, X Wang, Y Li, D Huang, Z Geng, X Zhao, H Liu, H Zhang Materials & Design 140, 85-94, 2018 | 271 | 2018 |
| Largely enhanced thermal conductivity of graphene/copper composites with highly aligned graphene network K Chu, X Wang, F Wang, Y Li, D Huang, H Liu, W Ma, F Liu, H Zhang Carbon 127, 102-112, 2018 | 262 | 2018 |
| Unveiling the Synergy of O‐Vacancy and Heterostructure over MoO3‐x/MXene for N2 Electroreduction to NH3 K Chu, Y Luo, P Shen, X Li, Q Li, Y Guo Advanced Energy Materials, 2103022, 2023 | 244 | 2023 |
| Multi-functional Mo-doping in MnO2 nanoflowers toward efficient and robust electrocatalytic nitrogen fixation K Chu, Y Liu, Y Li, Y Guo, Y Tian, H Zhang Applied Catalysis B: Environmental 264, 118525, 2020 | 237 | 2020 |
| Efficient electrocatalytic N 2 reduction on CoO quantum dots K Chu, Y Liu, Y Li, H Zhang, Y Tian Journal of Materials Chemistry A 7 (9), 4389-4394, 2019 | 230 | 2019 |
| Interface and mechanical/thermal properties of graphene/copper composite with Mo2C nanoparticles grown on graphene K Chu, F Wang, Y Li, X Wang, D Huang, Z Geng Composites Part A: Applied Science and Manufacturing 109, 267-279, 2018 | 223 | 2018 |
| Interface design of graphene/copper composites by matrix alloying with titanium K Chu, F Wang, X Wang, Y Li, Z Geng, D Huang, H Zhang Materials & design 144, 290-303, 2018 | 217 | 2018 |
| Tandem Electrocatalytic Nitrate Reduction to Ammonia on MBenes G Zhang, X Li, K Chen, Y Guo, D Ma, K Chu Angewandte Chemie International Edition, 2023 | 214 | 2023 |
| Interface structure and strengthening behavior of graphene/CuCr composites K Chu, F Wang, Y Li, X Wang, D Huang, H Zhang Carbon 133, 127-139, 2018 | 209 | 2018 |
| Thermal properties of carbon nanotube–copper composites for thermal management applications K Chu, H Guo, C Jia, F Yin, X Zhang, X Liang, H Chen Nanoscale research letters 5, 868-874, 2010 | 193 | 2010 |
| Filling the nitrogen vacancies with sulphur dopants in graphitic C3N4 for efficient and robust electrocatalytic nitrogen reduction K Chu, Q Li, Y Liu, J Wang, Y Cheng Applied Catalysis B: Environmental 267, 118693, 2020 | 189 | 2020 |
| Fe-doping induced morphological changes, oxygen vacancies and Ce 3+–Ce 3+ pairs in CeO 2 for promoting electrocatalytic nitrogen fixation K Chu, Y Cheng, Q Li, Y Liu, Y Tian Journal of Materials Chemistry A 8 (12), 5865-5873, 2020 | 188 | 2020 |
| Graphene defect engineering for optimizing the interface and mechanical properties of graphene/copper composites K Chu, J Wang, Y Liu, Z Geng Carbon 140, 112-123, 2018 | 188 | 2018 |
| Improvement of interface and mechanical properties in carbon nanotube reinforced Cu–Cr matrix composites K Chu, C Jia, L Jiang, W Li Materials & Design 45, 407-411, 2013 | 185 | 2013 |
| On the thermal conductivity of Cu–Zr/diamond composites K Chu, C Jia, H Guo, W Li Materials & Design 45, 36-42, 2013 | 176 | 2013 |
| Electronically Coupled SnO2 Quantum Dots and Graphene for Efficient Nitrogen Reduction Reaction K Chu, Y Liu, Y Li, J Wang, H Zhang ACS applied materials & interfaces 11 (35), 31806-31815, 2019 | 171 | 2019 |
Hu ZhangProfessor, University of Science and Technology Beijing在 ustb.edu.cn 的电子邮件经过验证
