| Design issues and considerations for low-cost 3-D TSV IC technology G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ... IEEE Journal of Solid-State Circuits 46 (1), 293-307, 2010 | 393 | 2010 |
| Improved thermal performance of AlGaN/GaN HEMTs by an optimized flip-chip design J Das, H Oprins, H Ji, A Sarua, W Ruythooren, J Derluyn, M Kuball, ... IEEE transactions on electron devices 53 (11), 2696-2702, 2006 | 93 | 2006 |
| Interconnect metals beyond copper: Reliability challenges and opportunities K Croes, C Adelmann, CJ Wilson, H Zahedmanesh, OV Pedreira, C Wu, ... 2018 IEEE International Electron Devices Meeting (IEDM), 5.3. 1-5.3. 4, 2018 | 69 | 2018 |
| High-efficiency polymer-based direct multi-jet impingement cooling solution for high-power devices T Wei, H Oprins, V Cherman, J Qian, I De Wolf, E Beyne, M Baelmans IEEE Transactions on Power Electronics 34 (7), 6601-6612, 2018 | 61 | 2018 |
| Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack H Oprins, VO Cherman, B Vandevelde, G Van der Plas, P Marchal, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 1081-1088, 2012 | 42 | 2012 |
| Temperature dependent electrical characteristics of through-si-via (TSV) interconnections G Katti, A Mercha, M Stucchi, Z Tokei, D Velenis, J Van Olmen, ... 2010 IEEE International Interconnect Technology Conference, 1-3, 2010 | 42 | 2010 |
| High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler T Tiwei, H Oprins, V Cherman, G Van der Plas, I De Wolf, E Beyne, ... 2017 IEEE International Electron Devices Meeting (IEDM), 32.5. 1-32.5. 4, 2017 | 40 | 2017 |
| Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip TW Wei, H Oprins, V Cherman, G Van der Plas, I De Wolf, E Beyne, ... Applied thermal engineering 152, 308-318, 2019 | 39 | 2019 |
| Compact thermal modeling of hot spots in advanced 3D-stacked ICs C Torregiani, H Oprins, B Vandevelde, E Beyne, I De Wolf 2009 11th Electronics Packaging Technology Conference, 131-136, 2009 | 39 | 2009 |
| Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems TW Wei, H Oprins, V Cherman, E Beyne, M Baelmans Applied Thermal Engineering 164, 114535, 2020 | 38 | 2020 |
| Influence of field-plate configuration on power dissipation and temperature profiles in AlGaN/GaN on silicon HEMTs V Sodan, H Oprins, S Stoffels, M Baelmans, I De Wolf IEEE Transactions on Electron Devices 62 (8), 2416-2422, 2015 | 38 | 2015 |
| Thermal analysis of hot spots in advanced 3D-stacked structures C Torregiani, B Vandevelde, H Oprins, E Beyne, I De Wolf 2009 15th International Workshop on Thermal Investigations of ICs and …, 2009 | 37 | 2009 |
| Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling H Oprins, J Danneels, B Van Ham, B Vandevelde, M Baelmans Microelectronics Journal 39 (7), 966-974, 2008 | 35 | 2008 |
| On-chip liquid cooling with integrated pump technology H Oprins, G Van der Veken, CCS Nicole, CJM Lasance, M Baelmans IEEE Transactions on Components and Packaging Technologies 30 (2), 209-217, 2007 | 35 | 2007 |
| Si Trench Around Drain (STAD) technology of GaN-DHFETs on Si substrate for boosting power performance P Srivastava, H Oprins, M Van Hove, J Das, PE Malinowski, B Bakeroot, ... 2011 International Electron Devices Meeting, 19.6. 1-19.6. 4, 2011 | 32 | 2011 |
| Thermal modelling of silicon photonic ring modulator with substrate undercut D Coenen, H Oprins, Y Ban, F Ferraro, M Pantouvaki, J Van Campenhout, ... Journal of Lightwave Technology 40 (13), 4357-4363, 2022 | 31 | 2022 |
| Practical chip-centric electro-thermal simulations R Gillon, P Joris, H Oprins, B Vandevelde, A Srinivasan, R Chandra 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008 | 31 | 2008 |
| Fast and distributed thermal model for thermal modeling of GaN power devices V Sodan, S Stoffels, H Oprins, S Decoutere, F Altmann, M Baelmans, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 30 | 2018 |
| Low-cost energy-efficient on-chip hotspot targeted microjet cooling for high-power electronics T Wei, H Oprins, V Cherman, E Beyne, M Baelmans IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 29 | 2019 |
| Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips H Oprins, V Cherman, M Stucchi, B Vandevelde, G Van der Plas, ... 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management …, 2011 | 27 | 2011 |
Ingrid De Wolfimec AND KU Leuven在 imec.be 的电子邮件经过验证
