| Improving the thermoelectric properties of half-Heusler TiNiSn through inclusion of a second full-Heusler phase: microwave preparation and spark plasma sintering of TiNi 1+ x Sn CS Birkel, JE Douglas, BR Lettiere, G Seward, N Verma, Y Zhang, ... Physical Chemistry Chemical Physics 15 (18), 6990-6997, 2013 | 138 | 2013 |
| Interaction of yttrium disilicate environmental barrier coatings with calcium-magnesium-iron alumino-silicate melts DL Poerschke, JH Shaw, N Verma, FW Zok, CG Levi Acta Materialia 145, 451-461, 2018 | 106 | 2018 |
| Phase stability and property evolution of biphasic Ti–Ni–Sn alloys for use in thermoelectric applications JE Douglas, CS Birkel, N Verma, VM Miller, MS Miao, GD Stucky, ... Journal of Applied Physics 115 (4), 2014 | 95 | 2014 |
| Characterization of phase transformation behaviour and microstructural development of electroless Ni–B coating S Pal, N Verma, V Jayaram, SK Biswas, Y Riddle Materials Science and Engineering: A 528 (28), 8269-8276, 2011 | 76 | 2011 |
| Severe wear of a near eutectic aluminium–silicon alloy A Mahato, N Verma, V Jayaram, SK Biswas Acta Materialia 59 (15), 6069-6082, 2011 | 38 | 2011 |
| Enhancement of thermoelectric properties in the Nb–Co–Sn half-Heusler/Heusler system through spontaneous inclusion of a coherent second phase MLC Buffon, G Laurita, N Verma, L Lamontagne, L Ghadbeigi, DL Lloyd, ... Journal of Applied Physics 120 (7), 2016 | 36 | 2016 |
| Micromechanisms of damage nucleation during contact deformation of columnar multilayer nitride coatings N Verma, S Cadambi, V Jayaram, SK Biswas Acta Materialia 60 (6-7), 3063-3073, 2012 | 33 | 2012 |
| Grain boundary driven Plateau–Rayleigh instability in multilayer nanocrystalline thin film: A phase-field study T Chakrabarti, N Verma, S Manna Materials & Design 119, 425-436, 2017 | 29 | 2017 |
| Microstructure Evolution of Biphasic TiNi1+x Sn Thermoelectric Materials N Verma, JE Douglas, S Krämer, TM Pollock, R Seshadri, CG Levi Metallurgical and Materials Transactions A 47, 4116-4127, 2016 | 19 | 2016 |
| Effects of ternary alloy additions on the microstructure of highly immiscible Cu alloys subjected to severe plastic deformation: An evaluation of the effective temperature model N Verma, N Pant, JA Beach, J Ivanisenko, Y Ashkenazy, S Dillon, ... Acta Materialia 170, 218-230, 2019 | 18 | 2019 |
| Nanoscratch behavior of metallic glass/crystalline nanolayered composites M Abboud, A Motallebzadeh, N Verma, S Özerinç JOM 71, 593-601, 2019 | 18 | 2019 |
| The influence of Zr layer thickness on contact deformation and fracture in a ZrN–Zr multilayer coating N Verma, V Jayaram Journal of Materials Science 47, 1621-1630, 2012 | 18 | 2012 |
| Structural and electronic properties of molecular beam epitaxially grown Ni1+ xTiSn films AD Rice, JK Kawasaki, N Verma, DJ Pennachio, BD Schultz, ... Journal of Crystal Growth 467, 71-76, 2017 | 17 | 2017 |
| Role of interface curvature on stress distribution under indentation for ZrN/Zr multilayer coating N Verma, V Jayaram Thin Solid Films 571, 283-289, 2014 | 13 | 2014 |
| Detailed investigation of contact deformation in ZrN/Zr multiplayer—understanding the role of volume fraction, bilayer spacing, and morphology of interfaces N Verma, V Jayaram Journal of Materials Research 28 (22), 3146-3156, 2013 | 13 | 2013 |
| Phase evolution in two-phase alloys during severe plastic deformation N Pant, N Verma, Y Ashkenazy, P Bellon, RS Averback Acta Materialia 210, 116826, 2021 | 9 | 2021 |
| Strengthening of nanocrystalline Al using grain boundary solute additions: Effects of thermal annealing and ion irradiation SE Kim, N Verma, S Özerinç, S Jana, S Das, P Bellon, RS Averback Materialia 26, 101564, 2022 | 5 | 2022 |
| Mechanism and Modeling of Contact Damage in ZrN-Zr and TiAIN-TiN Multilayer Hard Coatings N Verma | 2 | 2018 |
| Laccase and peroxidase mimetic CuxO-ZnO microstructures for optical biosensing applications S Singh, A Jangir, S Jain, N Verma, B Sharma Journal of Materials Research 38 (15), 3638-3654, 2023 | 1 | 2023 |
| Stimuli-responsive and self-healing supramolecular Zn (ii)–guanosine metal–organic gel for Schottky barrier diode application S Singh, AK Sharma, HM Gade, V Agarwal, R Nasani, N Verma, ... Soft Matter 20 (5), 1025-1035, 2024 | | 2024 |
Ram SeshadriFred and Linda R. Wudl Distinguished Professor of Materials Science at UC Santa Barbara在 mrl.ucsb.edu 的电子邮件经过验证
