| Relationship between EDM parameters and surface crack formation HT Lee, TY Tai Journal of Materials Processing Technology 142 (3), 676-683, 2003 | 449 | 2003 |
| Influence of interfacial intermetallic compound on fracture behavior of solder joints HT Lee, MH Chen, HM Jao, TL Liao Materials Science and Engineering: A 358 (1-2), 134-141, 2003 | 307 | 2003 |
| Study of surface integrity using the small area EDM process with a copper–tungsten electrode HT Lee, FC Hsu, TY Tai Materials Science and Engineering: A 364 (1-2), 346-356, 2004 | 196 | 2004 |
| Influence of intermetallic compounds on the adhesive strength of solder joints HT Lee, MH Chen Materials Science and Engineering: A 333 (1-2), 24-34, 2002 | 185 | 2002 |
| Reliability of Sn–Ag–Sb lead-free solder joints HT Lee, HS Lin, CS Lee, PW Chen Materials Science and Engineering: A 407 (1-2), 36-44, 2005 | 134 | 2005 |
| Shear strength and interfacial microstructure of Sn–Ag–xNi/Cu single shear lap solder joints YH Lee, HT Lee Materials Science and Engineering: A 444 (1-2), 75-83, 2007 | 101 | 2007 |
| Effects of filler metal composition on joining properties of alloy 690 weldments TY Kuo, HT Lee Materials Science and Engineering: A 338 (1-2), 202-212, 2002 | 95 | 2002 |
| Characteristic analysis of EDMed surfaces using the Taguchi approach HT Lee, JP Yur Materials and Manufacturing Processes 15 (6), 781-806, 2000 | 93 | 2000 |
| Dissimilar welding of nickel-based Alloy 690 to SUS 304L with Ti addition HT Lee, SL Jeng, CH Yen, TY Kuo Journal of Nuclear Materials 335 (1), 59-69, 2004 | 90 | 2004 |
| Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints HT Lee, YH Lee Materials science and engineering: A 419 (1-2), 172-180, 2006 | 72 | 2006 |
| Characteristics of dissimilar welding of alloy 690 to 304L stainless steel HT Lee, SL Jeng Science and Technology of welding and joining 6 (4), 225-234, 2001 | 69 | 2001 |
| The effects of peak temperature and cooling rate on the susceptibility to intergranular corrosion of alloy 690 by laser beam and gas tungsten arc welding HT Lee, JL Wu Corrosion Science 51 (3), 439-445, 2009 | 62 | 2009 |
| Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints HT Lee, MH Chen, HM Jao, CJ Hsu Journal of electronic materials 33, 1048-1054, 2004 | 56 | 2004 |
| The study of EDM hole-drilling method for measuring residual stress in SKD11 tool steel HT Lee, WP Rehbach, FC Hsu, TY Tai, E Hsu Journal of materials processing technology 149 (1-3), 88-93, 2004 | 56 | 2004 |
| Numerical and experimental investigation into effect of temperature field on sensitization of Alloy 690 butt welds fabricated by gas tungsten arc welding and laser beam welding HT Lee, C Te Chen, JL Wu Journal of materials processing Technology 210 (12), 1636-1645, 2010 | 54 | 2010 |
| Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5 Ag solder HT Lee, YF Chen Journal of Alloys and Compounds 509 (5), 2510-2517, 2011 | 53 | 2011 |
| Development of fine-grained structure and the mechanical properties of nickel-based Superalloy 718 HT Lee, WH Hou Materials Science and Engineering: A 555, 13-20, 2012 | 50 | 2012 |
| Effects of Nb on the microstructure and corrosive property in the Alloy 690–SUS 304L weldment SL Jeng, HT Lee, WP Rehbach, TY Kuo, TE Weirich, JP Mayer Materials Science and Engineering: A 397 (1-2), 229-238, 2005 | 50 | 2005 |
| The microstructure and fracture behavior of the dissimilar alloy 690-SUS 304L joint with various Nb addition HT Lee, SL Jeng, TY Kuo Metallurgical and Materials Transactions A 34, 1097-1105, 2003 | 48 | 2003 |
| The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM HT Lee, SY Hu, TF Hong, YF Chen Journal of electronic materials 37, 867-873, 2008 | 44 | 2008 |
