| High-cycle fatigue life prediction for Pb-free BGA under random vibration loading D Yu, A Al-Yafawi, TT Nguyen, S Park, S Chung Microelectronics Reliability 51 (3), 649-656, 2011 | 179 | 2011 |
| Characterizing the mechanical properties of actual SAC105, SAC305, and SAC405 solder joints by digital image correlation TT Nguyen, D Yu, SB Park Journal of Electronic Materials 40 (6), 1409-1415, 2011 | 75 | 2011 |
| Dynamic responses of PCB under product-level free drop impact D Yu, JB Kwak, S Park, J Lee Microelectronics Reliability 50 (7), 1028-1038, 2010 | 63 | 2010 |
| Influence of fastening methods on the dynamic response and reliability assessment of pcbs in cellular phones under free drop S Park, A Al-Yafawi, D Yu, JB Kwak, J Lee, NS Goo 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 41 | 2008 |
| Finite element based fatigue life prediction for electronic components under random vibration loading D Yu, A Al-Yafawi, S Park, S Chung 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 39 | 2010 |
| Dynamic Analysis of Thin Glass under Ball Drop Impact with New Metrics L Xue, CR Coble, H Lee, D Yu, S Chaparala, SB Park ASME 2013 International Technical Conference and Exhibition on Packaging and …, 2013 | 19 | 2013 |
| Random vibration test for electronic assemblies fatigue life estimation A Al-Yafawi, S Patil, D Yu, S Park, J Pitarresi, N Goo 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 19 | 2010 |
| Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling Y Da, H Lee, S Park Journal of electronic packaging 134 (4), 2012 | 15 | 2012 |
| Effect of damping and air cushion on dynamic responses of PCB under product level free drop impact S Park, D Yu, A Al-Yafawi, J Kwak, J Lee 2009 59th Electronic Components and Technology Conference, 1256-1262, 2009 | 13 | 2009 |
| Flexible displays with strengthened pad area D Yu, JW Choi, SH Kim, V Gupta, YB Park US Patent 9,660,004, 2017 | 10 | 2017 |
| Solder joint reliability in underfilled flip chip package with a consideration of chip-package-interaction (CPI) JB Kwak, D Yu, TT Nguyen, S Park International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 10 | 2011 |
| Effect of shield-can design on dynamic responses of PCB under board level drop impact D Yu, JB Kwak, S Park, S Chung, JY Yoon ASME International Mechanical Engineering Congress and Exposition 43789, 305-310, 2009 | 10 | 2009 |
| Dynamics behavior of flat glass panels under impact conditions: Experiments and numerical modeling S Chaparala, L Xue, D Yu, S Park Journal of the Society for Information Display 23 (3), 97-106, 2015 | 9 | 2015 |
| Effect of Shield-Can on Dynamic Response of Board-Level Assembly D Yu, J Kwak, S Park, S Chung, JY Yoon Journal of Electronic Packaging 134 (3), 031010, 2012 | 7 | 2012 |
| Effect of shield-can for drop/shock behavior of board level assembly J Kwak, D Yu, S Park, S Chung, JY Yoon, KW Jang 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 7 | 2010 |
| Reliability assessment of electronic components under random vibration loading A Al-Yafawi, D Yu, S Park, J Pitarresi, S Chung 2009 59th Electronic Components and Technology Conference, 431-436, 2009 | 6 | 2009 |
| An Experimental and Numerical Study of the Dynamic Fracture of Glass L Xue, Y Niu, H Lee, D Yu, S Chaparala, SB Park ASME 2013 International Technical Conference and Exhibition on Packaging and …, 2013 | 5 | 2013 |
| An Experimental and Numerical Study of the Behavior of the Glass Edge under Ball Drop Impact L Xue, D Liu, H Lee, D Yu, S Chaparala, SB Park ASME 2013 International Technical Conference and Exhibition on Packaging and …, 2013 | 5* | 2013 |
| Display with hybrid column spacer structures CH Tai, C Chen, D Yu, EA Dorjgotov, SU Choi, SCF Jiang, TW Cha, ... US Patent 10,690,970, 2020 | 4 | 2020 |
| Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling D Yu, T Nguyen, HH Lee, N Goo, SB Park International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 3 | 2011 |
