No flow underfill B Haba, I Mohammed, E Chau, SI Lee, K Desai US Patent 8,697,492, 2014 | 82 | 2014 |
Void formation study of flip chip in package using no-flow underfill S Lee, MJ Yim, RN Master, CP Wong, DF Baldwin Georgia Institute of Technology, 2008 | 38 | 2008 |
Sensitivity analysis of Pb free reflow profile parameters toward flip chip on silicon assembly yield, reliability and intermetallic compound characteristics Z Li, S Lee, BJ Lewis, PN Houston, DF Baldwin, G Stout, T Tessier, ... Electronic Components and Technology Conference (ECTC), 2010 Proceedings …, 2010 | 15 | 2010 |
Void formation mechanism of flip chip in package using no-flow underfill S Lee, MJ Yim, D Baldwin Journal of Electronic Packaging 131 (3), 031014, 2009 | 15 | 2009 |
Comprehensive Comparative Analysis of Microstructure of Sn-Ag-Cu (SAC) Solder Joints by Traditional Reflow and Thermo-Compression Bonding (TCB) Processes J Hah, Y Kim, P Fernandez-Zelaia, S Hwang, S Lee, L Christie, P Houston, ... Available at SSRN 3339472, 2019 | 13 | 2019 |
Assembly Yields Characterization of High IO Density, Fine Pitch Flip Chip in Package Using No-Flow Underfill S Lee, DF Baldwin, R Master, S Parthasarathy Electronic Components and Technology Conference, 2007. ECTC'07. Proceedings …, 2007 | 13 | 2007 |
Void Formation Study of High I/O Density and Fine Pitch Flip Chip in Package Using No-Flow Underfill S Lee, R Master, DF Baldwin, S Parthasarathy Surface Mount Technology Association International Conference, Orlando, FL …, 2007 | 12 | 2007 |
Comprehensive study of lead-free reflow process for a 3-D flip chip on silicon package Z Li, S Lee, JL Evans, DF Baldwin IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 11 | 2011 |
Heterogeneous void nucleation study in flip chip assembly process using no-flow underfill S Lee, DF Baldwin Journal of Electronic Packaging 136 (1), 011005, 2014 | 10 | 2014 |
A numerical study of void nucleation and growth in a flip chip assembly process S Lee, HM Zhou, DF Baldwin Modelling and Simulation in Materials Science and Engineering 18 (6), 065005, 2010 | 10 | 2010 |
Assembly yields characterization and failure analysis of flip chip in package using no-flow underfill S Lee, R Master, DF Baldwin International Wafer Level Packaging Congress, 169-175, 2007 | 10 | 2007 |
Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages S Lee 3D Microelectronic Packaging, 157-203, 2017 | 9 | 2017 |
Near void-free assembly development of flip chip using no-flow underfill S Lee, MJ Yim, RN Master, CP Wong, DF Baldwin IEEE Transactions on Electronics Packaging Manufacturing 32 (2), 106-114, 2009 | 9 | 2009 |
Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill Z Li, S Lee, BJ Lewis, PN Houston, DF Baldwin, EA Stout, TG Tessier, ... Journal of Microelectronics and Electronic Packaging 7 (3), 146-151, 2010 | 7 | 2010 |
Assembly yield characterization and void formation study on high I/O density and fine pitch flip chip in package using no-flow underfill S Lee, MJ Yim, R Master, CP Wong, DF Baldwin Surface Mount Technology Association International Conference, Orlando, FL …, 2008 | 7 | 2008 |
Translation solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid B Fennell, S Lee, DF Baldwin Journal of Electronic Packaging 132 (4), 041013, 2010 | 6 | 2010 |
Flipped die stack R Katkar, S McGrath, AS Prabhu, S Lee, L Wang, H Shen US Patent 9,825,002, 2017 | 5 | 2017 |
Fundamental study of underfill void formation in flip chip assembly S Lee Georgia Institute of Technology, 2009 | 5 | 2009 |
Wetting dynamics of eutectic and lead-free solders with various reflow conditions and surface finish metallizations SC Kang, C Kim, J Muncy, M Schmidt, S Lee, D Baldwin Electronic Components and Technology Conference, 2005. Proceedings. 55th …, 2005 | 5 | 2005 |
Microstructures of Pb-Free Solder Joints by Reflow and Thermo-Compression Bonding (TCB) Processes Y Kim, J Hah, P Fernandez-Zelaia, S Lee, L Christie, P Houston, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2349-2358, 2019 | 4 | 2019 |