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Sangil Lee
Sangil Lee
未知所在单位机构
没有经过验证的电子邮件地址
标题
引用次数
引用次数
年份
No flow underfill
B Haba, I Mohammed, E Chau, SI Lee, K Desai
US Patent 8,697,492, 2014
822014
Void formation study of flip chip in package using no-flow underfill
S Lee, MJ Yim, RN Master, CP Wong, DF Baldwin
Georgia Institute of Technology, 2008
382008
Sensitivity analysis of Pb free reflow profile parameters toward flip chip on silicon assembly yield, reliability and intermetallic compound characteristics
Z Li, S Lee, BJ Lewis, PN Houston, DF Baldwin, G Stout, T Tessier, ...
Electronic Components and Technology Conference (ECTC), 2010 Proceedings …, 2010
152010
Void formation mechanism of flip chip in package using no-flow underfill
S Lee, MJ Yim, D Baldwin
Journal of Electronic Packaging 131 (3), 031014, 2009
152009
Comprehensive Comparative Analysis of Microstructure of Sn-Ag-Cu (SAC) Solder Joints by Traditional Reflow and Thermo-Compression Bonding (TCB) Processes
J Hah, Y Kim, P Fernandez-Zelaia, S Hwang, S Lee, L Christie, P Houston, ...
Available at SSRN 3339472, 2019
132019
Assembly Yields Characterization of High IO Density, Fine Pitch Flip Chip in Package Using No-Flow Underfill
S Lee, DF Baldwin, R Master, S Parthasarathy
Electronic Components and Technology Conference, 2007. ECTC'07. Proceedings …, 2007
132007
Void Formation Study of High I/O Density and Fine Pitch Flip Chip in Package Using No-Flow Underfill
S Lee, R Master, DF Baldwin, S Parthasarathy
Surface Mount Technology Association International Conference, Orlando, FL …, 2007
122007
Comprehensive study of lead-free reflow process for a 3-D flip chip on silicon package
Z Li, S Lee, JL Evans, DF Baldwin
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
112011
Heterogeneous void nucleation study in flip chip assembly process using no-flow underfill
S Lee, DF Baldwin
Journal of Electronic Packaging 136 (1), 011005, 2014
102014
A numerical study of void nucleation and growth in a flip chip assembly process
S Lee, HM Zhou, DF Baldwin
Modelling and Simulation in Materials Science and Engineering 18 (6), 065005, 2010
102010
Assembly yields characterization and failure analysis of flip chip in package using no-flow underfill
S Lee, R Master, DF Baldwin
International Wafer Level Packaging Congress, 169-175, 2007
102007
Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages
S Lee
3D Microelectronic Packaging, 157-203, 2017
92017
Near void-free assembly development of flip chip using no-flow underfill
S Lee, MJ Yim, RN Master, CP Wong, DF Baldwin
IEEE Transactions on Electronics Packaging Manufacturing 32 (2), 106-114, 2009
92009
Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill
Z Li, S Lee, BJ Lewis, PN Houston, DF Baldwin, EA Stout, TG Tessier, ...
Journal of Microelectronics and Electronic Packaging 7 (3), 146-151, 2010
72010
Assembly yield characterization and void formation study on high I/O density and fine pitch flip chip in package using no-flow underfill
S Lee, MJ Yim, R Master, CP Wong, DF Baldwin
Surface Mount Technology Association International Conference, Orlando, FL …, 2008
72008
Translation solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid
B Fennell, S Lee, DF Baldwin
Journal of Electronic Packaging 132 (4), 041013, 2010
62010
Flipped die stack
R Katkar, S McGrath, AS Prabhu, S Lee, L Wang, H Shen
US Patent 9,825,002, 2017
52017
Fundamental study of underfill void formation in flip chip assembly
S Lee
Georgia Institute of Technology, 2009
52009
Wetting dynamics of eutectic and lead-free solders with various reflow conditions and surface finish metallizations
SC Kang, C Kim, J Muncy, M Schmidt, S Lee, D Baldwin
Electronic Components and Technology Conference, 2005. Proceedings. 55th …, 2005
52005
Microstructures of Pb-Free Solder Joints by Reflow and Thermo-Compression Bonding (TCB) Processes
Y Kim, J Hah, P Fernandez-Zelaia, S Lee, L Christie, P Houston, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2349-2358, 2019
42019
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