| Long Term Aging Effects on The Reliability of Lead Free Solder Joints in Ball Grid Array Packages With Various Pitch Sizes and Ball Arrangement JE Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, MJ Bozack Journal of Surface Mount Technology 29 (2), 37-46, 2016 | 68* | 2016 |
| Effect of surface finish and high bi solder alloy on component reliability in thermal cycling F Akkara, M Abueed, M Rababah, C Zhao, S Su, J Suhling, J Evans 2018 IEEE 68th electronic components and technology conference (ECTC), 2032-2040, 2018 | 39 | 2018 |
| Packaging reliability effect of ENIG and ENEPIG surface finishes in board level thermal test under long-term aging and cycling C Shen, Z Hai, C Zhao, J Zhang, JL Evans, MJ Bozack, JC Suhling Materials 10 (5), 451, 2017 | 29 | 2017 |
| Effect of solder sphere alloys and surface finishes on the reliability of lead-free solder joints in accelerated thermal cycling FJ Akkara, C Zhao, R Athamenh, S Su, M Abueed, S Hamasha, J Suhling, ... 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 26 | 2018 |
| Board level reliability of lead-free solder interconnections with solder doping under harsh environment C Zhao Auburn University, 2017 | 17 | 2017 |
| Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment C Zhao, T Sanders, Z Hai, C Shen, JL Evans International Symposium on Microelectronics 2016 (1), 000117-000122, 2016 | 15 | 2016 |
| Effects of mixing solder sphere alloys with bismuth-based pastes on the component reliability in harsh thermal cycling FJ Akkara, C Zhao, S Su, S Hamasha, J Suhling SMTA International, 2018 | 13 | 2018 |
| Reliability of micro-alloyed SnAgCu based solder interconnections for various harsh applications S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019 | 12 | 2019 |
| Effect of Aging on Component Reliability in Harsh Thermal Cycling FJ Akkara, C Zhao, S Gordon, S Su, M Abueed, J Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 8 | 2019 |
| Thermal cycling reliability of newly developed lead-free solders for harsh environments FJ Akkara, C Zhao, S Ahmed, M Abueed, S Su, SD Hamasha, J Suhling, ... Proc. SMTA Int, 2019 | 6 | 2019 |
| Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling C Shen, C Zhao, Z Hai, J Zhang, MJ Bozack, JC Suhling, JL Evans International Symposium on Microelectronics 2015 (1), 000135-000140, 2015 | 6 | 2015 |
| Effects on the reliability of lead-free solder joints under harsh environment Z Hai, J Zhang, C Shen, C Zhao, JL Evans, MJ Bozack International Symposium on Microelectronics 2014 (1), 000471-000476, 2014 | 5 | 2014 |
| Packaging reliability effect of ENIG and ENEPIG surface finishes in board level thermal test under long-term aging and cycling. Materials, 2017, 10 (5): 451-464 CB Shen, Z Hai, C Zhao, JW Zhang, JL Evans, MJ Bozack, JC Suhling ed, 0 | 5 | |
| Reliability analysis of aging in joint microstructures for Sn-Ag-Cu solder joints during thermal cycling C Shen, Z Hai, C Zhao, J Zhang, MJ Bozack, JC Suhling, JL Evans International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 3 | 2015 |
| The Effect of Isothermal Aging on the Reliability of Sn-Ag-Cu Solder Joints Using Various Surface Finishes MJB Chaobo Shen Zhou Hai, Cong Zhao, Jiawei Zhang, John L. Evans SMTA International 2014, 2014 | 3* | 2014 |
| Reliability Study and Failure Analysis for Surface Finishes on Sn–Ag–Cu Solder Joints During Thermal Cycling C Shen, Z Hai, C Zhao, J Zhang, JL Evans, MJ Bozack, JC Suhling Journal of Mechatronics 3 (4), 269-275, 2016 | 1 | 2016 |
| RELIABILITY OF DOPED LEAD-FREE SOLDER JOINTS UNDER ISOTHERMAL AGING AND THERMAL CYCLING C Zhao, T Sanders, C Shen, Z Hai, JL Evans, MJ Bozack, J Suhling | 1 | |
| Effect of Combining Solder Pastes with SAC305 Spheres on Component Reliability in Harsh Thermal Cycling FJ Akkara, C Zhao, A Sreenivasan, S Su, M Abueed, H Ali, J Suhling, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | | 2020 |
| RELIABILITY OF DOPED LEAD-FREE SOLDER JOINTS UNDER ISOTHERMAL AGING AND THERMAL CYCLING JS Cong Zhao, Thomas Sanders, Chaobo Shen, Zhou Hai, John L. Evans, Ph.D., M ... SMTA International 2016, 599-605, 2016 | | 2016 |
Jeffrey C. SuhlingAuburn University, Department of Mechanical Engineering在 auburn.edu 的电子邮件经过验证
