| A comparative study for the junction temperature of green light-emitting diodes B Ozluk, AM Muslu, M Arik IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 15 | 2019 |
| Impact of junction temperature over forward voltage drop for red, blue and green high power light emitting diode chips AM Muslu, B Ozluk, E Tamdogan, M Arik 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 14 | 2017 |
| Enhanced thermal performance of high flux LED systems with two-phase immersion cooling C Cengiz, AM Muslu, M Arik, B Dogruoz 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 7 | 2020 |
| Discrete phase analysis of self heating particles over an immersion liquid cooled high power blue light-emitting diode with suspended phosphor particles C Cengiz, AM Muslu, M Azarifar, M Arik, B Dogruoz Journal of Heat Transfer 144 (10), 102101, 2022 | 6 | 2022 |
| A fundamental study of improving thermal interface connection by using silane modified, in-situ formed silver-graphene fillers in epoxy polymers for future semiconductor device … Z Sun, R Wong, Y Liu, M Yu, J Li, H Liu, D An, M Moran, AM Muslu, ... Composites Science and Technology 230, 109759, 2022 | 4 | 2022 |
| An investigation into the optothermal behavior of a high power red light emitting diode: impact of an optical path AM Muslu, B Ozluk, M Arik Journal of Electronic Packaging 143 (1), 011007, 2021 | 4 | 2021 |
| Heat spreading and heat removal needs of a novel power electronics package with integrated cooling AM Muslu, R Wong, V Smet, Y Joshi 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 3 | 2021 |
| Impact of electronics over localized hot spots in multi-chip white LED light engines AM Muslu, M Arik 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 3 | 2019 |
| Multi-physics modeling of a power electronics package with integrated cooling AM Muslu, V Smet, Y Joshi 2021 27th International Workshop on Thermal Investigations of ICs and …, 2021 | 1 | 2021 |
| SINGLE PHASE THERMAL AND HYDRAULIC PERFORMANCE OF A HYBRID PIN FIN AND SCHOEN-G TPMS ARCHITECTURE COLD PLATE FOR ELECTRONICS THERMAL MANAGEMENT AM Muslu, Y Joshi International Heat Transfer Conference Digital Library, 2023 | | 2023 |
| Compact SiC Power Module With Integrated Power Delivery and Cooling AM Muslu, V Smet, Y Joshi IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | | 2022 |
| System for measuring junction temperature of photonics devices M Arik, E Tamdogan, B Ozluk, AM Muslu US Patent App. 17/417,821, 2022 | | 2022 |
| Discrete Phase Analysis of Self Heating Particles Over an Immersion Liquid Cooled High Power Blue LED with Suspended Phosphor Particles C Cengiz, M Muslu, M Azarifar, M Arik, B Dogruoz Journal of Heat Transfer, 2022 | | 2022 |
| Rapid heating and cooling chamber for a photonics junction measurement system G Tarcin, A Saygin, M Muslu, M Budakli, M Arik 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | | 2020 |
| Challenges for Measuring Multichip LED Light Engines for Interior Lighting Applications AM Muslu LED Professional Magazine, Issue 78 (LpR78), March/April 2020, P 70, 2020 | | 2020 |
| New Approach for Fast and Accurate Measurement of Light Emitting Diodes Junction Temperatures AM Muslu, O Isil, M Arik LED Professional Magazine, Issue 73 (LpR73), May/June 2019, P 48, 2019 | | 2019 |
| Thermal and Optical Challenges for Solid State Automotive Lighting Applications UZ Uras, AM Muslu, M Arik, F Goren LED Professional Magazine, Issue 72 (LpR72), March/April 2019, P 50, 2019 | | 2019 |
| A novel approach for identification of thermal and optical characteristics for the active layer of high power photonic devices AM Muslu | | 2019 |
Mehmet ArikAssociate Professor, Auburn University在 auburn.edu 的电子邮件经过验证
