| Assessment of a chip backside protection E Amini, A Beyreuther, N Herfurth, A Steigert, B Szyszka, C Boit Journal of Hardware and Systems Security 2, 345-352, 2018 | 33 | 2018 |
| Photon Emission in Silicon Based Integrated Circuits C Boit, A Beyreuther, N Herfurth Microelectronics Failure Analysis Desk Reference, 180, 2019 | 16 | 2019 |
| IC security and quality improvement by protection of chip backside against hardware attacks E Amini, A Beyreuther, N Herfurth, A Steigert, R Muydinov, B Szyszka, ... Microelectronics Reliability 88, 22-25, 2018 | 11 | 2018 |
| Second generation of optical IC-backside protection structure E Amini, T Kiyan, N Herfurth, A Beyreuther, C Boit, JP Seifert 2020 IEEE International Symposium on the Physical and Failure Analysis of …, 2020 | 6 | 2020 |
| Special session: Physical attacks through the chip backside: Threats, challenges, and opportunities E Amini, K Bartels, C Boit, M Eggert, N Herfurth, T Kiyan, T Krachenfels, ... 2021 IEEE 39th VLSI Test Symposium (VTS), 1-12, 2021 | 5 | 2021 |
| Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission A Beyreuther, I Vogt, N Herfurth, T Nakamura, GG Fischer, B Motamedi, ... Microelectronics Reliability 92, 143-148, 2019 | 5 | 2019 |
| Photon emission as a characterization tool for bipolar parasitics in FinFET technology A Beyreuther, N Herfurth, E Amini, T Nakamura, I De Wolf, C Boit Microelectronics Reliability 88, 273-276, 2018 | 5 | 2018 |
| EOFM for contactless parameter extraction of low k dielectric MIS structures N Herfurth, E Amini, A Beyreuther, T Nakamura, S Keil, C Boit 2019 IEEE 26th International Symposium on Physical and Failure Analysis of …, 2019 | 4 | 2019 |
| Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation N Herfurth, C Wu, A Beyreuther, T Nakamura, I De Wolf, M Simon-Najasek, ... Microelectronics Reliability 92, 73-78, 2019 | 4 | 2019 |
| Contactless device characterization of transistor structures in silicon using electro optical frequency mapping (EOFM) A Beyreuther, N Herfurth, T Nakamura, GG Fischer, S Keil, C Boit Microelectronics Reliability 106, 113583, 2020 | 3 | 2020 |
| Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials–An adaptive calibration algorithm P Scholz, N Herfurth, M Sadowski, T Lundquist, U Kerst, C Boit Microelectronics Reliability 54 (9-10), 1794-1797, 2014 | 3 | 2014 |
| A scalable & comprehensive resilience concept against optical & physical IC backside attacks N Herfurth, E Amini, M Lisker, JP Seifert, C Boit 2022 IEEE International Symposium on the Physical and Failure Analysis of …, 2022 | 2 | 2022 |
| Generation and Tracking of Optical Signals inside the IC to Improve Device Security and Failure Analysis E Amini, N Herfurth, A Beyreuther, JP Seifert, C Boit 2019 IEEE 26th International Symposium on Physical and Failure Analysis of …, 2019 | 2 | 2019 |
| EOFM measurements of lateral and vertical Bipolar Transistors in Silicon and SiGe: C Technologies A Beyreuther, N Herfurth, E Amini, T Nakamura, GG Fischer, S Keil, C Boit 2019 IEEE 26th International Symposium on Physical and Failure Analysis of …, 2019 | 2 | 2019 |
| Contactless Fault Isolation of Ultra Low k Dielectrics in Soft Breakdown Condition N Herfurth, C Wu, T Nakamura, I De Wolf, K Croes, C Boit 2018 IEEE International Symposium on the Physical and Failure Analysis of …, 2018 | 2 | 2018 |
| On the versatility of the ihp bicmos open source and manufacturable pdk: A step towards the future where anybody can design and build a chip K Herman, N Herfurth, T Henkes, S Andreev, R Scholz, M Müller, ... IEEE Solid-State Circuits Magazine 16 (2), 30-38, 2024 | 1 | 2024 |
| Adhesive-free bonding for hetero-integration of InP based coupons micro-transfer printed on SiO2 into Complementary Metal-Oxide-Semiconductor backend for Si photonics … K Anand, P Steglich, J Kreissl, CA Chavarin, D Spirito, M Franck, G Lecci, ... Thin Solid Films, 140399, 2024 | 1 | 2024 |
| Verified value chains, innovation and competition A Weber, S Guilley, R Rathfelder, M Stöttinger, C Lüth, M Malenko, ... 2023 IEEE International Conference on Cyber Security and Resilience (CSR …, 2023 | 1 | 2023 |
| Prototyping Reconfigurable RRAM-Based AI Accelerators Using the RISC-V Ecosystem and Digital Twins M Fritscher, A Veronesi, A Baroni, J Wen, T Spätling, MK Mahadevaiah, ... International Conference on High Performance Computing, 500-514, 2023 | 1 | 2023 |
| The IC Ultra-Thin Back Surface-A Field of Real Nanoscale Fault Isolation Opportunities Requiring a Skillful Sample Preparation C Boit, J Jatzkowski, F Altmann, M DiBattista, S Silverman, G Zwicker, ... 2022 IEEE International Symposium on the Physical and Failure Analysis of …, 2022 | 1 | 2022 |
Christian BoitProfessor für Halbleiterbauelemente, TU Berlin在 tu-berlin.de 的电子邮件经过验证
