| Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging J Arab, DK Mishra, HK Kannojia, P Adhale, P Dixit Journal of Materials Processing Technology 271, 542-553, 2019 | 74 | 2019 |
| Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM J Arab, HK Kannojia, P Dixit Precision Engineering 60, 437-447, 2019 | 65 | 2019 |
| Fabrication and characterization of through-glass vias by the ECDM process HK Kannojia, J Arab, BJ Pegu, P Dixit Journal of the Electrochemical Society 166 (13), D531, 2019 | 53 | 2019 |
| Influence of tool electrode feed rate in the electrochemical discharge drilling of a glass substrate J Arab, P Dixit Materials and Manufacturing Processes 35 (15), 1749-1760, 2020 | 46 | 2020 |
| Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining DK Mishra, AK Verma, J Arab, D Marla, P Dixit Journal of Micromechanics and Microengineering 29 (7), 075004, 2019 | 46 | 2019 |
| High aspect ratio glass micromachining by multi-pass electrochemical discharge based micromilling technique DK Mishra, J Arab, Y Magar, P Dixit ECS Journal of Solid State Science and Technology 8 (6), P322, 2019 | 40 | 2019 |
| Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining SK Patro, DK Mishra, J Arab, P Dixit Journal of Applied Electrochemistry 50, 169-184, 2020 | 33 | 2020 |
| Effect of tool-electrode material in through-hole formation using ECDM process J Arab, K Pawar, P Dixit Materials and Manufacturing Processes 36 (9), 1019-1027, 2021 | 32 | 2021 |
| Micro array hole formation in glass using electrochemical discharge machining J Arab, P Adhale, DK Mishra, P Dixit Procedia Manufacturing 34, 349-354, 2019 | 28 | 2019 |
| Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling J Arab, DK Mishra, P Dixit Measurement 168, 108463, 2020 | 27 | 2020 |
| A review on microholes formation in glass-based substrates by electrochemical discharge drilling for MEMS applications T Singh, J Arab, P Dixit Machining Science and Technology 26 (2), 276-337, 2022 | 23 | 2022 |
| Through-holes micromachining of alumina using a combined pulse-feed approach in ECDM P Sharma, J Arab, P Dixit Materials and Manufacturing Processes 36 (13), 1501-1512, 2021 | 23 | 2021 |
| Formation of macro-sized through-holes in glass using notch-shaped tubular electrodes in electrochemical discharge machining J Arab, P Dixit Journal of Manufacturing Processes 78, 92-106, 2022 | 19 | 2022 |
| Role of tool-substrate gap in the micro-holes formation by electrochemical discharge machining J Arab, DK Mishra, P Dixit Procedia Manufacturing 48, 492-497, 2020 | 13 | 2020 |
| Fabrication of deep microfeatures in glass substrate using electrochemical discharge machining for biomedical and microfluidic applications DK Mishra, J Arab, K Pawar, P Dixit 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 263-266, 2019 | 12 | 2019 |
| Fabrication and characterization of through-glass vias (TGV) based 3D spiral and toroidal inductors by cost-effective ECDM process HK Kannojia, J Arab, A Sidhique, DK Mishra, R Kumar, J Pednekar, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1192-1198, 2020 | 10 | 2020 |
| Electrochemical discharge machining of soda lime glass for MEMS applications J Arab, HS Chauhan, P Dixit International Journal of Precision Technology 8 (2-4), 220-236, 2019 | 10 | 2019 |
| Improvement on surface quality of Inconel-718 slits via laser cutting and wire electrochemical machining processes T Singh, J Arab, SC Chen Optics & Laser Technology 167, 109637, 2023 | 8 | 2023 |
| Gas bubbles entrapment mechanism in the electrochemical discharge machining involving multi-tip array electrodes J Arab, P Dixit Journal of Manufacturing Processes 99, 38-52, 2023 | 8 | 2023 |
| Formation of through-wafer 3-D interconnects in fused silica substrates by electrochemical discharge machining HK Kannojia, J Arab, R Kumar, J Pednekar, P Dixit 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 253-257, 2019 | 4 | 2019 |
Pradeep DixitIIT Bombay India, NTU Singapore, VTT Finland在 iitb.ac.in 的电子邮件经过验证
