| Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology Y Zhang, CR King, J Zaveri, YJ Kim, V Sahu, Y Joshi, MS Bakir 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2037-2044, 2011 | 63 | 2011 |
| Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge Y Zhang, Y Zhang, M Bakir Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014 | 62 | 2014 |
| Silicon micropin-fin heat sink with integrated TSVs for 3-D ICs: tradeoff analysis and experimental testing Y Zhang, A Dembla, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 60 | 2013 |
| 3D stacked microfluidic cooling for high-performance 3D ICs Y Zhang, A Dembla, Y Joshi, MS Bakir 2012 IEEE 62nd Electronic Components and Technology Conference, 1644-1650, 2012 | 56 | 2012 |
| Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs Y Zhang, H Oh, MS Bakir 3D Systems Integration Conference (3DIC), 2013 IEEE International, 1-6, 2013 | 42 | 2013 |
| Novel electrical and fluidic microbumps for silicon interposer and 3-D ICs L Zheng, Y Zhang, G Huang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (5 …, 2014 | 35 | 2014 |
| 3-D stacked tier-specific microfluidic cooling for heterogeneous 3-D ICs Y Zhang, L Zheng, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 35 | 2013 |
| Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems TE Sarvey, Y Zhang, Y Zhang, H Oh, MS Bakir Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 …, 2014 | 32 | 2014 |
| Independent interlayer microfluidic cooling for heterogeneous 3D IC applications Y Zhang, MS Bakir Electronics Letters 49 (6), 404-406, 2013 | 32 | 2013 |
| Two-phase flow and heat transfer in pin-fin enhanced micro-gaps SA Isaacs, YJ Kim, AJ McNamara, Y Joshi, Y Zhang, MS Bakir Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 …, 2012 | 30 | 2012 |
| Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs A Dembla, Y Zhang, M Bakir Proc. IEEE International Interconnect Technology Conf, 2012 | 19 | 2012 |
| Thermal Isolation Using Air Gap and Mechanically Flexible Interconnects for Heterogeneous 3-D ICs Y Zhang, Y Zhang, T Sarvey, C Zhang, M Zia, M Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (1 …, 2016 | 15 | 2016 |
| Two-Phase Flow and Heat Transfer in Pin-Fin Enhanced Micro-Gaps With Non-Uniform Heating SA Isaacs, Y Joshi, Y Zhang, MS Bakir, YJ Kim ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass …, 2013 | 11 | 2013 |
| Design, fabrication and assembly of a novel electrical and microfluidic I/Os for 3-D chip stack and silicon interposer L Zheng, Y Zhang, MS Bakir 2013 IEEE 63rd Electronic Components and Technology Conference, 2243-2248, 2013 | 11 | 2013 |
| High aspect ratio TSVs in micropin-fin heat sinks for 3D ICs A Dembla, Y Zhang, MS Bakir Nanotechnology (IEEE-NANO), 2012 12th IEEE Conference on, 1-6, 2012 | 10 | 2012 |
| Fabrication and Characterization of Electrical Interconnects and Microfluidic Cooling for 3D ICS With Silicon Interposer H Oh, Y Zhang, L Zheng, GS May, MS Bakir Heat Transfer Engineering 37 (11), 903-911, 2016 | 7 | 2016 |
| Electrical Interconnect and Microfluidic Cooling Within 3D ICs and Silicon Interposer H Oh, Y Zhang, L Zheng, MS Bakir ASME 2014 12th International Conference on Nanochannels, Microchannels, and …, 2014 | 3 | 2014 |
| Tier-independent microfluidic cooling for heterogeneous 3D ICs with nonuniform power dissipation Y Zhang, L Zheng, MS Bakir 2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013 | 3 | 2013 |
| Revolutionary innovation in system interconnection: a new era for the IC MS Bakir, PA Thadesar, C King, J Zaveri, HS Yang, C Zhang, Y Zhang SPIE MOEMS-MEMS, 792803-792803-8, 2011 | 3 | 2011 |
| Numerical and experimental exploration of thermal isolation in 3D systems using air gap and mechanically flexible interconnects Y Zhang, TE Sarvey, Y Zhang, M Zia, MS Bakir 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | | 2016 |
Yogendra JoshiProfessor of Mechanical Engineering, Georgia Institute of Technology在 me.gatech.edu 的电子邮件经过验证
