| Experimental validation of a novel methodology for electromigration assessment in on-chip power grids V Sukharev, A Kteyan, FN Najm, YH Yi, CH Kim, JH Choy, S Torosyan, ... IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2021 | 7 | 2021 |
| On-Chip Heater Design and Control Methodology for Reliability Testing Applications Requiring Over 300° C Local Temperatures H Yu, YH Yi, N Pande, CH Kim IEEE Transactions on Device and Materials Reliability 23 (2), 233-240, 2023 | 3 | 2023 |
| Electromigration assessment in power grids with account of redundancy and non-uniform temperature distribution A Kteyan, V Sukharev, A Volkov, JH Choy, FN Najm, YH Yi, CH Kim, ... Proceedings of the 2023 International Symposium on Physical Design, 124-132, 2023 | 2 | 2023 |
| Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation A Kteyan, V Sukharev, Y Yi, C Kim 2022 IEEE International Reliability Physics Symposium (IRPS), 1-10, 2022 | 2 | 2022 |
| Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis YH Yi, C Kim, A Kteyan, A Volkov, S Moreau, V Sukharev 2024 IEEE International Reliability Physics Symposium (IRPS), 01-06, 2024 | | 2024 |
| Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters YH Yi, C Kim, C Zhou, A Kteyan, V Sukharev 2023 IEEE International Reliability Physics Symposium (IRPS), 1-5, 2023 | | 2023 |
