Block copolymer nanocomposites with high refractive index contrast for one-step photonics DP Song, C Li, W Li, JJ Watkins Acs Nano 10 (1), 1216-1223, 2016 | 130 | 2016 |
Ordered Nanoporous Carbons with Broadly Tunable Pore Size using Bottlebrush Block Copolymer Templates HF Fei*, W Li*, A Bhardwaj, S Nuguri, A Ribbe, JJ Watkins Journal of the American Chemical Society, 2019 | 74 | 2019 |
High-power lithium-ion microbatteries from imprinted 3D electrodes of sub-10 nm LiMn2O4/Li4Ti5O12 nanocrystals and a copolymer gel electrolyte W Li, TL Christiansen, C Li, Y Zhou, H Fei, A Mamakhel, BB Iversen, ... Nano Energy 52, 431-440, 2018 | 42 | 2018 |
Copolymer solid-state electrolytes for 3D microbatteries via initiated chemical vapor deposition W Li, LC Bradley, JJ Watkins ACS applied materials & interfaces 11 (6), 5668-5674, 2019 | 33 | 2019 |
Direct imprinting of scalable, high-performance woodpile electrodes for three-dimensional lithium-ion nanobatteries W Li, Y Zhou, IR Howell, Y Gai, AR Naik, S Li, KR Carter, JJ Watkins ACS applied materials & interfaces 10 (6), 5447-5454, 2018 | 30 | 2018 |
Enabling next generation 3D heterogeneous integration architectures on intel process A Elsherbini, K Jun, S Liff, T Talukdar, J Bielefeld, W Li, R Vreeland, ... 2022 International Electron Devices Meeting (IEDM), 27.3. 1-27.3. 4, 2022 | 28 | 2022 |
Three-Dimensional CeO2 Woodpile Nanostructures To Enhance Performance of Enzymatic Glucose Biosensors Y Zhou, SD Uzun, NJ Watkins, S Li, W Li, AL Briseno, KR Carter, ... ACS applied materials & interfaces 11 (2), 1821-1828, 2018 | 26 | 2018 |
One-Step Synthesis of Hierarchical, Bimodal Nanoporous Carbons via Co-Templating with Bottlebrush and Linear Block Copolymers HF Fei*, W Li*, S Nuguri, HJ Yu, BM Yavitt, W Fan, JJ Watkins Chemistry of Materials, 2020 | 19 | 2020 |
Millisecond photothermal carbonization for in-situ fabrication of mesoporous graphitic carbon nanocomposite electrode films DP Song, W Li, J Park, HF Fei, AR Naik, S Li, Y Zhou, Y Gai, JJ Watkins Carbon 174, 439-444, 2021 | 10 | 2021 |
Fluidic Self Alignment for Hybrid Bonding Using Intel Process F Eid, Y Shi, G Naderi, SB Sinha, R Jordan, W Li, C El Helou, F Bedoya, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2037-2041, 2024 | | 2024 |
Nanoporous structures and assemblies incorporating the same JJ Watkins, DP Song, W Li US Patent 11,964,920, 2024 | | 2024 |
Template structure for quasi-monolithic die architectures FE Omkar G Karhade, Tomita YOSHIHIRO, Adel A Elsherbini, Bhaskar Jyoti ... US Patent App. 17/891,665, 2024 | | 2024 |
Die crack mitigation in multi-chip composite ic structures JS Adel Elsherbini, Wenhao Li, Bhaskar Jyoti Krishnatreya, Tushar TALUKDAR ... US Patent App. 17/891,666, 2024 | | 2024 |
Thermally enhanced structural member and/or bond layer for multichip composite devices US Patent App. 17/891,735, 2024 | | 2024 |
Photonic quasi-monolithic die architectures FE Adel A Elsherbini, David Hui, Haris Khan Niazi, Wenhao Li, Bhaskar Jyoti ... US Patent App. 17/821,019, 2024 | | 2024 |
Thermal management of base dies in multichip composite devices FE Adel Elsherbini, Wenhao Li, Bhaskar Jyoti Krishnatreya, Debendra Mallik ... US Patent App. 17/891,738, 2024 | | 2024 |
Porous mesh structures for the thermal management of integrated circuit devices F Eid, W Li, P Diglio, X Brun, J Swan US Patent App. 17/709,064, 2023 | | 2023 |
Bond head design for thermal compression bonding M Baker, F Eid, W Li, Z Li, LIU Pilin US Patent App. 17/711,926, 2023 | | 2023 |
Package structures with non-uniform interconnect features Z Li, F Eid, M Baker, W Li, LIU Pilin, J Swan US Patent App. 17/710,518, 2023 | | 2023 |
Package structures with collapse control features W Li, F Eid, M Baker, LIU Pilin, Z Li US Patent App. 17/710,502, 2023 | | 2023 |