| A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints Z Liu, YA Huang, Z Yin, S Bennati, PS Valvo International Journal of Adhesion and Adhesives 54, 112-123, 2014 | 72 | 2014 |
| Reliable Peeling of Ultrathin Die With Multineedle Ejector Z Liu, YA Huang, H Liu, J Chen, Z Yin Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014 | 37 | 2014 |
| Tunable peeling technique and mechanism of thin chip from compliant adhesive tapes Z Liu, YA Huang, J Chen, Z Yin IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (4 …, 2014 | 34 | 2014 |
| Cohesive failure analysis of an array of IC chips bonded to a stretched substrate Z Liu, PS Valvo, YA Huang, Z Yin International Journal of Solids and Structures 50 (22-23), 3528-3538, 2013 | 30 | 2013 |
| Nonlinear characteristics in fracture strength test of ultrathin silicon die Z Liu, YA Huang, L Xiao, P Tang, Z Yin Semiconductor Science and Technology 30 (4), 045005, 2015 | 26 | 2015 |
| Theoretical and experimental studies of competing fracture for flexible chip-adhesive-substrate composite structure Z Liu, X Wan, YA Huang, J Chen, Z Yin IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (1 …, 2017 | 17 | 2017 |
| Vacuum-based picking-up of thin chip from adhesive tape Z Xu, Z Liu, YA Huang, J Chen, H Liu, Z Yin Journal of Adhesion Science and Technology 29 (13), 1315-1329, 2015 | 17 | 2015 |
| Experimental estimation of adhesive fracture energy of compliant adhesive tape Z Liu, P Tang, YA Huang, Z Yin 2014 15th international conference on electronic packaging technology, 842-846, 2014 | 14 | 2014 |
| Competing fracture of thin-chip transferring from/onto prestrained compliant substrate H Liu, Z Liu, Z Xu, Z Yin, YA Huang, J Chen Journal of Applied Mechanics 82 (10), 101012, 2015 | 11 | 2015 |
| Analytical Evaluation of Interfacial Crack Propagation in Vacuum-Based Picking-up Process Z Xu, Z Liu, H Liu, Z Yin, Y Huang, J Chen IEEE, 2015 | 11 | 2015 |
| Mechanical stability analysis of organic thin film transistors considering interfacial delamination Z Xu, B Tao, Z Liu The 8th Annual IEEE International Conference on Nano/Micro Engineered and …, 2013 | | 2013 |
YongAn HuangProfessor of Mechanical Engineering, Huazhong University of Science and Technology在 hust.edu.cn 的电子邮件经过验证
