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Daniel Lorenzini
Daniel Lorenzini
在 gatech.edu 的电子邮件经过验证
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Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering
D Lorenzini, C Green, TE Sarvey, X Zhang, Y Hu, AG Fedorov, MS Bakir, ...
International Journal of Heat and Mass Transfer 103, 1359-1370, 2016
982016
CFD study of constructal microchannel networks for liquid-cooling of electronic devices
CA Rubio-Jimenez, A Hernandez-Guerrero, JG Cervantes, ...
Applied Thermal Engineering 95, 374-381, 2016
592016
Computational fluid dynamics modeling of flow boiling in microchannels with nonuniform heat flux
D Lorenzini, YK Joshi
Journal of Heat Transfer 140 (1), 011501, 2018
562018
Performance analysis of a proton exchange membrane fuel cell using tree-shaped designs for flow distribution
D Lorenzini-Gutierrez, A Hernandez-Guerrero, B Ramos-Alvarado, ...
International journal of hydrogen energy 38 (34), 14750-14763, 2013
442013
Variable fin density flow channels for effective cooling and mitigation of temperature nonuniformity in three-dimensional integrated circuits
D Lorenzini-Gutierrez, SG Kandlikar
Journal of Electronic Packaging 136 (2), 021007, 2014
422014
Numerical modeling and experimental validation of two-phase microfluidic cooling in silicon devices for vertical integration of microelectronics
D Lorenzini, Y Joshi
International Journal of Heat and Mass Transfer 138, 194-207, 2019
412019
Residence time of water film and slug flow features in fuel cell gas channels and their effect on instantaneous area coverage ratio
D Lorenzini-Gutierrez, SG Kandlikar, A Hernandez-Guerrero, ...
Journal of power sources 279, 567-580, 2015
382015
Numerical and experimental analysis of heat transfer enhancement in a grooved channel with curved flow deflectors
D Lorenzini-Gutierrez, A Hernandez-Guerrero, JL Luviano-Ortiz, ...
Applied Thermal Engineering 75, 800-808, 2015
362015
Flow boiling heat transfer in silicon microgaps with multiple hotspots and variable pin fin clustering
D Lorenzini, Y Joshi
Physics of Fluids 31 (10), 2019
332019
Comparison of the volume of fluid and CLSVOF methods for the assessment of flow boiling in silicon microgaps
D Lorenzini, Y Joshi
Journal of Heat Transfer 139 (11), 111506, 2017
212017
CFD study of flow boiling in silicon microgaps with staggered pin fins for the 3D-stacking of ICs
D Lorenzini, Y Joshi
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
122016
CFD analysis of flow boiling in a silicon microchannel with non-uniform heat flux
D Lorenzini, YK Joshi
International Conference on Nanochannels, Microchannels, and Minichannels …, 2015
82015
Mitigating hot spots in planar and three-dimensional (3D) heterogeneous microsystems using liquid cooling
Y Joshi, Y Hu, D Lorenzini
Proceedings of CHT-17 ICHMT International Symposium on Advances in …, 2017
72017
Effect of surface wettability on flow boiling in a microchannel
D Lorenzini, Y Joshi
Proceedings of CHT-15. 6 th International Symposium on ADVANCES IN …, 2015
42015
Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches
T Moreno-Torres, D Lorenzini, Y Joshi, A Hernandez-Guerrero, ...
Journal of Heat Transfer 143 (4), 044502, 2021
32021
Numerical analysis of a PEM fuel cell performance using a tree-shaped vascular design for flow distribution
D Lorenzini-Gutierrez, A Hernandez-Guerrero, BR Alvarado, ...
24th International Conference on Efficiency, Cost, Optimization, Simulation …, 2011
22011
Heat sink performance improvement by way of nanofluids
JL Zúñiga-Cerroblanco, CU Gonzalez-Valle, D Lorenzini-Gutierrez, ...
Heat Transfer Summer Conference 50336, V002T21A001, 2016
12016
Numerical and experimental analysis of heat transfer enhancement in a grooved channel with curved flow deflectors
D Lorenzini-Gutierrez, A Hernandez-Guerrero, JL Luviano-Ortiz, ...
Applied Thermal Engineering 30, 1-9, 2014
12014
2024 World Scientific Publishing Company
D Lorenzini, Y Joshi
Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single …, 2024
2024
Numerical Modeling of Embedded Two-Phase Cooling in Silicon Microelectronics
D Lorenzini, Y Joshi
Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single …, 2024
2024
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