| A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs C Cai, J Xu, H Wang, SB Park Microelectronics Reliability 119, 114065, 2021 | 58 | 2021 |
| A comprehensive study of electromigration in lead-free solder joint J Xu, C Cai, V Pham, K Pan, H Wang, S Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 284-289, 2020 | 33 | 2020 |
| An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model Y Lai, K Pan, Y Cen, J Yang, C Cai, P Yin, S Park Soldering & Surface Mount Technology 34 (5), 266-276, 2022 | 32 | 2022 |
| Comparative analysis of package warpage using confocal method and digital image correlation C Cai, K Pan, J Yang, S Park 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 24 | 2020 |
| The effect of solder paste volume on chip resistor solder joint fatigue life H Wang, K Pan, J Ha, C Cai, J Xu, S Park Procedia Manufacturing 38, 1372-1380, 2019 | 22 | 2019 |
| Smarter temperature setup for reflow oven to minimize temperature variation among components Y Lai, K Pan, C Cai, P Yin, J Yang, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 21 | 2022 |
| Shape dependency of fatigue life in solder joints of chip resistors J Ha, C Cai, P Yin, Y Lai, K Pan, J Yang, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1489-1494, 2022 | 13 | 2022 |
| Reliability of homogeneous Sn-Bi and hybrid Sn-Bi/SAC BGAs C Cai, J Xu, H Wang, S Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1496-1501, 2020 | 13 | 2020 |
| A deep learning approach for reflow profile prediction Y Lai, J Kataoka, K Pan, J Ha, J Yang, KA Deo, J Xu, P Yin, C Cai, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2269-2274, 2022 | 12 | 2022 |
| Thermomechanical reliability of BGA packages with different underfill reinforcement methods Y Lai, C Cai, K Pan, J Yang, J Ha, P Yin, K Deo, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 11 | 2022 |
| The optimal solution of reflow oven recipe based on physics-guided machine learning model Y Lai, K Pan, J Ha, C Cai, J Yang, P Yin, J Xu, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 11 | 2022 |
| Optimal thermo-mechanical reliability design of 2.5 D lidless package J Yang, C Cai, P Yin, K Pan, Y Lai, J Wang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 11 | 2022 |
| A study on parameters that impact the thermal fatigue life of BGA solder joints K Arun Deo, RN Kono, C Cai, J Yang, Y Lai, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 10 | 2022 |
| Parametric study of the geometry design of through-silicon via in silicon interposer K Pan, Y Lai, J Xu, P Yin, J Ha, C Cai, J Yang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 10 | 2022 |
| Characterization of constitutive equation of Sn-Bi by studying creep behavior of flip chip solder joints C Cai, K Pan, K Deo, Y Lai, J Yang, J Wang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 5 | 2022 |
| Residual stress measurement of build-up layer in silicon wafers J Yang, C Cai, Y Lai, J Ha, H Wang, S Park, G Refai-Ahmed, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 303-309, 2023 | 3 | 2023 |
| Evaluation of electromigration coupling different physics fields in numerical simulation C Cai, J Xu, Y Lai, J Yang, H Wang, S Ramalingam, G Refai-Ahmed, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 3 | 2022 |
| Solid-State Spalling of Ag3Sn in an Eutectic SnPb Solder Joint with an Ag Thin Film/Ge Cell X Ji, R An, C Wang, C Cai Journal of Electronic Materials 47, 5625-5631, 2018 | 3 | 2018 |
| A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage C Cai, H Wang, J Yang, P Yin, SB Park Journal of Electronic Packaging 146 (2), 2024 | 2 | 2024 |
| Electromigration Risk Assessment and Circuit Optimization Using Innovative Multiphysics Modeling C Cai, Z Yang, Y Li, P Jain, T Kang, K Mellachervu Journal of Microelectronics and Electronic Packaging 20 (1), 9-16, 2023 | 2 | 2023 |
