| Electromechanical piezoresistive sensing in suspended graphene membranes AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ... Nano letters 13 (7), 3237-3242, 2013 | 425 | 2013 |
| Resistive graphene humidity sensors with rapid and direct electrical readout AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ... Nanoscale 7 (45), 19099-19109, 2015 | 332 | 2015 |
| Integrating mems and ics AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ... Microsystems & Nanoengineering 1 (1), 1-16, 2015 | 325 | 2015 |
| Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ... ACS nano 10 (11), 9879-9886, 2016 | 139 | 2016 |
| Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, H Rödjegård, ... Nature Electronics 2 (9), 394-404, 2019 | 92 | 2019 |
| Manufacture and characterization of graphene membranes with suspended silicon proof masses for MEMS and NEMS applications X Fan, AD Smith, F Forsberg, S Wagner, S Schröder, SSA Akbari, ... Microsystems & Nanoengineering 6 (1), 17, 2020 | 69 | 2020 |
| Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE (+) dual-cure polymer F Saharil, F Forsberg, Y Liu, P Bettotti, N Kumar, F Niklaus, T Haraldsson, ... Journal of Micromechanics and Microengineering 23 (2), 025021, 2013 | 66 | 2013 |
| Suspended graphene membranes with attached silicon proof masses as piezoresistive nanoelectromechanical systems accelerometers X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, M Östling, ... Nano letters 19 (10), 6788-6799, 2019 | 49 | 2019 |
| Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs F Niklaus, A Decharat, F Forsberg, N Roxhed, M Lapisa, M Populin, ... Sensors and Actuators A: Physical 154 (1), 180-186, 2009 | 49 | 2009 |
| CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-D integration F Forsberg, A Lapadatu, G Kittilsland, S Martinsen, N Roxhed, AC Fischer, ... IEEE Journal of Selected Topics in Quantum Electronics 21 (4), 30-40, 2014 | 41 | 2014 |
| Low-cost uncooled microbolometers for thermal imaging N Roxhed, F Niklaus, AC Fischer, F Forsberg, L Höglund, P Ericsson, ... Optical sensing and detection 7726, 315-324, 2010 | 31 | 2010 |
| Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays F Forsberg, N Roxhed, AC Fischer, B Samel, P Ericsson, N Hoivik, ... Infrared physics & technology 60, 251-259, 2013 | 22 | 2013 |
| High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers F Forsberg, N Roxhed, P Ericsson, S Wissmar, F Niklaus, G Stemme TRANSDUCERS 2009-2009 International Solid-State Sensors, Actuators and …, 2009 | 22 | 2009 |
| Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays P Ericsson, AC Fischer, F Forsberg, N Roxhed, B Samel, S Savage, ... Infrared Technology and Applications XXXVII 8012, 411-420, 2011 | 20 | 2011 |
| Far infrared low-cost uncooled bolometer for automotive use T Kvisterøy, H Jakobsen, C Vieider, S Wissmar, P Ericsson, U Halldin, ... Advanced Microsystems for Automotive Applications, 265-278, 2007 | 17 | 2007 |
| High-resolution micropatterning of off-stochiometric thiol-enes (OSTE) via a novel lithography mechanism F Carlborg, F Saharil, F Forsberg, F Niklaus, W van der Wijngaart, ... 16th International Conference on Miniaturized Systems for Chemistry and Life …, 2012 | 15 | 2012 |
| Wafer-level heterogeneous 3D integration for MEMS and NEMS F Niklaus, M Lapisa, SJ Bleiker, V Dubois, N Roxhed, AC Fischer, ... 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D …, 2012 | 14 | 2012 |
| A comparative study of the bonding energy in adhesive wafer bonding F Forsberg, F Saharil, T Haraldsson, N Roxhed, G Stemme, ... Journal of Micromechanics and Microengineering 23 (8), 085019, 2013 | 13 | 2013 |
| Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate F Forsberg, N Roxhed, G Stemme, F Niklaus 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems …, 2011 | 13 | 2011 |
| Batch transfer of radially expanded die arrays for heterogeneous integration using different wafer sizes F Forsberg, N Roxhed, T Haraldsson, Y Liu, G Stemme, F Niklaus Journal of microelectromechanical systems 21 (5), 1077-1083, 2012 | 12 | 2012 |
Frank NiklausProfessor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, Sweden在 kth.se 的电子邮件经过验证
