| High performance low-dimensional perovskite solar cells based on a one dimensional lead iodide perovskite C Ma, D Shen, B Huang, X Li, WC Chen, MF Lo, P Wang, MHW Lam, Y Lu, ... Journal of Materials Chemistry A 7 (15), 8811-8817, 2019 | 65 | 2019 |
| Highly Active Core–Shell Carbon/NiCo2O4 Double Microtubes for Efficient Oxygen Evolution Reaction: Ultralow Overpotential and Superior Cycling Stability X Zhang, X Li, R Li, Y Lu, S Song, Y Wang Small 15 (42), 1903297, 2019 | 45 | 2019 |
| Microalloyed medium-entropy alloy (MEA) composite nanolattices with ultrahigh toughness and cyclability X Feng, JU Surjadi, R Fan, X Li, W Zhou, S Zhao, Y Lu Materials Today 42, 10-16, 2021 | 37 | 2021 |
| Hollow medium-entropy alloy nanolattices with ultrahigh energy absorption and resilience JU Surjadi, X Feng, R Fan, W Lin, X Li, Y Lu NPG Asia Materials 13 (1), 36, 2021 | 35 | 2021 |
| Enhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries C Dang, W Lin, F Meng, H Zhang, S Fan, X Li, K Cao, H Yang, W Zhou, ... Journal of Materials Science & Technology 95, 193-202, 2021 | 26 | 2021 |
| Armoring SiO x with a conformal LiF layer to boost lithium storage T Kang, J Tan, X Li, J Liang, H Wang, D Shen, Y Wu, Z Huang, Y Lu, ... Journal of Materials Chemistry A 9 (12), 7807-7816, 2021 | 26 | 2021 |
| Formation mechanism of hydride precipitation in commercially pure titanium J Li, X Li, M Sui Journal of Materials Science & Technology 81, 108-116, 2021 | 22 | 2021 |
| High elasticity of CsPbBr3 perovskite nanowires for flexible electronics X Li, Y Meng, R Fan, S Fan, C Dang, X Feng, JC Ho, Y Lu Nano Research 14, 4033-4037, 2021 | 21 | 2021 |
| Three dimensional architected thermoelectric devices with high toughness and power conversion efficiency V Karthikeyan, JU Surjadi, X Li, R Fan, VCS Theja, WJ Li, Y Lu, VAL Roy Nature Communications 14 (1), 2069, 2023 | 20 | 2023 |
| Orientation-dependent large plasticity of single-crystalline gallium selenide H Wang, H Wu, W Lin, B Zhang, X Li, Y Zhang, S Fan, C Dang, Y Zhu, ... Cell Reports Physical Science 3 (4), 2022 | 20 | 2022 |
| Interaction of {112¯ 2} twin variants in hexagonal close-packed titanium X Li, J Li, B Zhou, M Yu, M Sui Journal of materials science & technology 35 (4), 660-666, 2019 | 20 | 2019 |
| Boosting hydrogen evolution electrocatalysis through defect engineering: A strategy of heat and cool shock X Zhang, X Li, Z Pan, Y Lai, Y Lu, Y Wang, S Song Chemical Engineering Journal 426, 131524, 2021 | 19 | 2021 |
| Lightweight, ultra-tough, 3D-architected hybrid carbon microlattices JU Surjadi, Y Zhou, S Huang, L Wang, M Li, S Fan, X Li, J Zhou, ... Matter 5 (11), 4029-4046, 2022 | 17 | 2022 |
| Size dependency in stacking fault-mediated ultrahard high-entropy alloy thin films X Feng, JU Surjadi, X Li, Y Lu Journal of Alloys and Compounds 844, 156187, 2020 | 16 | 2020 |
| Van der Waals nanomesh electronics on arbitrary surfaces Y Meng, X Li, X Kang, W Li, W Wang, Z Lai, W Wang, Q Quan, X Bu, ... Nature communications 14 (1), 2431, 2023 | 14 | 2023 |
| Defect engineering boosted ultrahigh thermoelectric power conversion efficiency in polycrystalline SnSe V Karthikeyan, SL Oo, JU Surjadi, X Li, VCS Theja, V Kannan, SC Lau, ... ACS Applied Materials & Interfaces 13 (49), 58701-58711, 2021 | 13 | 2021 |
| Nucleation mechanism of {101 2} twin with low Schmid factor in hexagonal close-packed metals J Li, X Li, M Yu, M Sui Materials Science and Engineering: A 791, 139542, 2020 | 13 | 2020 |
| Multislip-enabled morphing of all-inorganic perovskites X Li, Y Meng, W Li, J Zhang, C Dang, H Wang, SW Hung, R Fan, FR Chen, ... Nature Materials 22 (10), 1175-1181, 2023 | 11 | 2023 |
| Size-dependent fracture behavior of GaN pillars under room temperature compression S Fan, X Li, R Fan, Y Lu Nanoscale 12 (45), 23241-23247, 2020 | 8 | 2020 |
| Extreme mechanics of nanoscale diamond towards functional device applications C Dang, A Lu, H Wang, L Yang, X Li, H Zhang, Y Lu Extreme Mechanics Letters 58, 101931, 2023 | 4 | 2023 |
Yang LuDept of Mechanical Engineering, the University of Hong Kong在 hku.hk 的电子邮件经过验证
