| MicroLED technologies and applications: characteristics, fabrication, progress, and challenges Z Chen, S Yan, C Danesh Journal of Physics D: Applied Physics 54 (12), 123001, 2021 | 207 | 2021 |
| Synaptic resistors for concurrent inference and learning with high energy efficiency CD Danesh, CM Shaffer, D Nathan, R Shenoy, A Tudor, M Tadayon, Y Lin, ... Advanced Materials 31 (18), 1808032, 2019 | 42 | 2019 |
| In situ study of dynamic conformational transitions of a water-soluble poly (3-hexylthiophene) derivative by surfactant complexation CD Danesh, NS Starkweather, S Zhang The Journal of Physical Chemistry B 116 (42), 12887-12894, 2012 | 37 | 2012 |
| Multi-scale assembly of polythiophene-surfactant supramolecular complexes for charge transport anisotropy D Bilger, A Sarkar, C Danesh, M Gopinadhan, G Braggin, J Figueroa, ... Macromolecules 50 (3), 1047-1055, 2017 | 22 | 2017 |
| Wide and parallel LED-based optical links using multi-core fiber for chip-to-chip communications B Pezeshki, A Tselikov, R Kalman, C Danesh Optical Fiber Communication Conference, F3A. 1, 2021 | 16 | 2021 |
| Anisotropic core–shell nanocomposites by direct covalent attachment of a side-functionalized poly (3-hexylthiophene) onto ZnO nanowires ND Redeker, CD Danesh, Y Ding, S Zhang Polymer 54 (26), 7004-7008, 2013 | 12 | 2013 |
| High speed light microLEDs for visible wavelength communication B Pezeshki, R Kalman, A Tselikov, C Danesh Light-Emitting Devices, Materials, and Applications XXV 11706, 44-50, 2021 | 9 | 2021 |
| MicroLED array-based optical links using imaging fiber for chip-to-chip communications B Pezeshki, F Khoeini, A Tselikov, R Kalman, C Danesh, E Afifi Optical Fiber Communication Conference, W1E. 1, 2022 | 8 | 2022 |
| Self‐programming synaptic resistor circuit for intelligent systems CM Shaffer, A Deo, A Tudor, R Shenoy, CD Danesh, D Nathan, ... Advanced Intelligent Systems 3 (8), 2100016, 2021 | 6 | 2021 |
| LED chip-to-chip vertically launched optical communications with optical fiber B Pezeshki, R Kalman, A Tselikov, C Danesh US Patent 11,764,878, 2023 | 5 | 2023 |
| 8x 2Gb/s LED-based optical link at 420nm for chip-to-chip applications B Pezeshki, A Tselikov, C Danesh, R Kalman 2021 European Conference on Optical Communication (ECOC), 1-3, 2021 | 5 | 2021 |
| Optically-enhanced multichip packaging R Kalman, B Pezeshki, A Tselikov, C Danesh US Patent 11,728,894, 2023 | 3 | 2023 |
| Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same WGM van den Hoek, TY Lau, C Danesh, F Danesh US Patent 11,444,065, 2022 | 3 | 2022 |
| Integration of OE devices with ICs R Kalman, B Pezeshki, C Danesh, A Tselikov US Patent 11,822,138, 2023 | 2 | 2023 |
| An Adaptive Intelligent System Based on Energy‐Efficient Synaptic Resistor Circuits with Fast Real‐Time Learning R Shenoy, A Tudor, D Nathan, A Deo, Z Rong, CM Shaffer, CD Danesh, ... Advanced Intelligent Systems 4 (10), 2200105, 2022 | 2 | 2022 |
| LED-array based optical interconnects for chip-to-chip communications with integrated CMOS drivers, detectors, and circuitry B Pezeshki, F Khoeini, A Tselikov, RF Kalman, C Danesh, E Afifi Optical Interconnects XXII 12007, 31-34, 2022 | 2 | 2022 |
| P-type doping in GaN LEDs for high speed operation at low current densities B Pezeshki, C Danesh US Patent 11,810,995, 2023 | 1 | 2023 |
| Surfactant Formulations for Water-based Processing of Polythiophene Derivatives CD Danesh California Polytechnic State University, 2013 | 1 | 2013 |
| Enhanced microLEDs for inter-chip communications B Pezeshki, R Kalman, A Tselikov, C Danesh US Patent 12,034,096, 2024 | | 2024 |
| Interconnect networks using microled-based optical links R Kalman, B Pezeshki, A Tselikov, C Danesh US Patent App. 18/495,689, 2024 | | 2024 |
