| Experimental investigation of multilayer particle deposition and resuspension between periodic steps in turbulent flows T Barth, M Reiche, M Banowski, M Oppermann, U Hampel Journal of Aerosol Science 64, 111-124, 2013 | 52 | 2013 |
| Optimization of quality costs M Oppermann, W Sauer, H Wohlrabe Robotics and Computer-Integrated Manufacturing 19 (1-2), 135-140, 2003 | 35 | 2003 |
| New quality cost models to optimize inspection strategies M Oppermann, W Sauer, H Wohlrabe, T Zerna IEEE Transactions on Electronics Packaging Manufacturing 26 (4), 328-337, 2003 | 21 | 2003 |
| X-ray computed tomography on miniaturized solder joints for nano packaging M Oppermann, T Zerna, KJ Wolter 2009 11th Electronics Packaging Technology Conference, 70-75, 2009 | 17 | 2009 |
| Electronics process technology: Production modelling, simulation and optimisation W Sauer, M Oppermann, G Weigert, S Werner, H Wohlrabe, KJ Wolter, ... Springer Science & Business Media, 2007 | 14 | 2007 |
| Optimization of inspection strategies by use of quality cost models M Oppermann, W Sauer, H Wohlrabe, T Zerna 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat …, 2001 | 14 | 2001 |
| Nano Packaging-A challenge for Non-destructive Testing KJ Wolter, M Oppermann, T Zema 2008 10th Electronics Packaging Technology Conference, 873-878, 2008 | 10 | 2008 |
| In-situ-X-Ray investigation on pressure release during conventional and diffusion soldering A Klemm, P Jähngen, M Oppermann, T Zerna 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 821-826, 2013 | 9 | 2013 |
| Simulation of manufacturing processes W Sauer, M Oppermann, S Werner, H Wohlrabe, T Zerna, G Weigert, ... Electronics Process Technology: Production Modelling, Simulation and …, 2006 | 9 | 2006 |
| Analysis of soldering processes using in-situ X-Ray observations A Klemm, M Oppermann, T Zerna 2015 European Microelectronics Packaging Conference (EMPC), 1-6, 2015 | 8 | 2015 |
| Micro-and Nano-NDE for Micro-Electronics (back end) KJ Wolter, M Oppermann, H Heuer, B Köhler, F Schubert, U Netzelmann, ... IV Conferencia Panamericana de Ensayos No Destructivos, 2007 | 8 | 2007 |
| X-ray computed tomography for nano packaging-a progressive NDE method M Oppermann, T Zerna, KJ Wolter 2010 12th Electronics Packaging Technology Conference, 853-858, 2010 | 7 | 2010 |
| Thermographic inspection method for quality assessment of power semiconductors in the manufacture of power electronics modules M Schaulin, M Oppermann, T Zerna 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-7, 2018 | 6 | 2018 |
| Multi-scale radiographic applications in microelectronic industry J Gluch, M Löffler, N Meyendorf, M Oppermann, M Röllig, P Sättler, ... AIP Conference Proceedings 1706 (1), 2016 | 6 | 2016 |
| In-situ-X-ray investigation on vacuum soldering processes for conventional and diffusion soldering A Klemm, M Oppermann, T Zerna Proceedings of the 5th Electronics System-integration Technology Conference …, 2014 | 5 | 2014 |
| Zerstörungsfreie Analyse-und Prüfverfahren zur Detektion von Fehlern und Ausfällen in elektronischen Baugruppen M Oppermann Detert, 2014 | 5 | 2014 |
| What's inside my USB drive?—X-ray microscopy and X-ray nano CT for 3D packaging M Oppermann, H Roth, T Neubrand, T Zerna 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 88-92, 2013 | 5 | 2013 |
| Nano evaluation in electronics packaging M Oppermann, H Heuer, N Meyendorf, KJ Wolter 2008 2nd Electronics System-Integration Technology Conference, 1029-1034, 2008 | 5 | 2008 |
| Analysis and optimization of manufacturing and test process arrangements with new cost models M Oppermann, W Sauer, H Wohlrabe Proc. SMTA-I 1999, 1999 | 5 | 1999 |
| Packaging development for GaAs X-ray line detectors M Oppermann, O Albrecht, T Lohse, R Metasch, T Zerna, KJ Wolter 2011 IEEE 13th Electronics Packaging Technology Conference, 203-206, 2011 | 4 | 2011 |
Thomas ZernaTechnische Universität Dresden在 tu-dresden.de 的电子邮件经过验证
