| Experimental investigation of the failure mechanism of Cu–Sn intermetallic compounds in SAC solder joints C Yang, F Le, SWR Lee Microelectronics Reliability 62, 130-140, 2016 | 34 | 2016 |
| An uninterrupted bird repeller on transmission line F Le, J Luo, G Wu 2009 IEEE International Conference on Robotics and Biomimetics (ROBIO), 1983 …, 2009 | 16 | 2009 |
| 3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing F Le, SWR Lee, Q Zhang Journal of Micromechanics and Microengineering 27 (4), 045012, 2017 | 15 | 2017 |
| Through silicon underfill dispensing for 3D die/interposer stacking F Le, SWR Lee, KM Lau, CP Yue, JKO Sin, PKT Mok, WH Ki, HW Choi 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 919-924, 2014 | 7 | 2014 |
| Underfill dispensing for 3D die stacking with through silicon vias F Le, SWR Lee, J Wu, MMF Yuen International Symposium on Microelectronics 2012 (1), 000548-000553, 2012 | 5 | 2012 |
| Evaluation of Emerging High Melting Point Lead-free Solder and Hybrid Sinter Paste as Attaching Material for Clip Bond Package FF Le, R van der Meulen, YK Leong, M Balakrishnan, Z Guan International Symposium on Microelectronics 2020 (1), 000235-000241, 2020 | 4 | 2020 |
| Failure analysis and experimental verification for through-silicon-via underfill dispensing on 3-D chip stack package F Le, SWR Lee, JCC Lo, C Yang IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 4 | 2015 |
| An implantable medical device for transcorneal electrical stimulation: Packaging structure, process flow, and toxicology test F Le, JCC Lo, X Qiu, SWR Lee, X Li, CY Tsui, WH Ki IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (8 …, 2016 | 3 | 2016 |
| Parameter correlation and computational modeling for the flow of encapsulant in through-silicon-via underfill dispensing F Le, SWR Lee, C Yang, JCC Lo IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (8 …, 2015 | 3 | 2015 |
| Thermal Stability Characterization of High-Temperature Solders in Power Surface Mount Devices FF Le, Z Guan, H Chen, WO Chaw, H Santican 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 580-584, 2022 | 1 | 2022 |
| Void-free underfill encapsulation for flip chip high voltage LED packaging AW Shang, X Qiu, JCC Lo, SWR Lee, FF Le 2016 China Semiconductor Technology International Conference (CSTIC), 1-4, 2016 | 1 | 2016 |
| Fluxless packaging of an implantable medical device for transcorneal electrical stimulation F Le, JCC Lo, X Qiu, SWR Lee, X Li, CY Tsui, WH Ki 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-5, 2015 | 1 | 2015 |
| A humanoid mini-walking robot with a stick F Le, X Wu, S Yu, B Zhang, Y Xu 2009 International Conference on Information and Automation, 72-77, 2009 | 1 | 2009 |
| Reflow Soldering Using Flux-sprayed Solder Preforms FF Le, Z Guan, H Chen, H Santican, VAP Ramalingam 2023 24th International Conference on Electronic Packaging Technology (ICEPT …, 2023 | | 2023 |
| Die Tilt Improvement Through Copper Spacers in Solder Paste Printing H Santican, I Dchar, D Yandoc, FF Le, L Latido 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 1-5, 2022 | | 2022 |
| Assessment of Solder Flux Corrosivity and Flux Residue Level in Clip Bonding Assembly FF Le, H Chen, Z Guan, FL Fajardo 54th International Symposium on Microelectronics 2021 (1), 000314-000320, 2021 | | 2021 |
| Influence of Porosity on the Mechanical Properties of Hybrid Silver Sintered Joint Z Guan, FF Le, J Wu, J Yang, R Van Der Meulen, H Chen 2021 22nd International Conference on Electronic Packaging Technology (ICEPT …, 2021 | | 2021 |
| Effect of Material Properties and Bump Parameters on Capillary Filling in Through-Silicon-Via Underfill Dispensing F Le, SWR Lee, M Tao, JCC Lo 2018 20th International Conference on Electronic Materials and Packaging …, 2018 | | 2018 |
| Silver Sintering Conceptual Study as a Lead-Free Solution for Clip Bond Power Packages YKL Fitri Rafzanjani Mat, Fred Le Nexperia Technical Forum 2018, 2018 | | 2018 |
| Characterization of Copper Diffusion in Through Silicon Vias X Zhang, SWR Lee, F Le Materials for Advanced Packaging, 923-951, 2017 | | 2017 |
