| Photonic–plasmonic mode coupling in on-chip integrated optoplasmonic molecules W Ahn, SV Boriskina, Y Hong, BM Reinhard ACS nano 6 (1), 951-960, 2012 | 91 | 2012 |
| Enhanced Light Focusing in Self‐Assembled Optoplasmonic Clusters with Subwavelength Dimensions Y Hong, M Pourmand, SV Boriskina, BM Reinhard Advanced Materials 25 (1), 115-119, 2013 | 67 | 2013 |
| Computational analysis and experimental evidence of two typical levelers for acid copper electroplating Z Lai, S Wang, C Wang, Y Hong, Y Chen, H Zhang, G Zhou, W He, K Ai, ... Electrochimica Acta 273, 318-326, 2018 | 66 | 2018 |
| A comparison of typical additives for copper electroplating based on theoretical computation Z Lai, S Wang, C Wang, Y Hong, G Zhou, Y Chen, W He, Y Peng, D Xiao Computational Materials Science 147, 95-102, 2018 | 65 | 2018 |
| Label‐free diagnosis for colorectal cancer through coffee ring‐assisted surface‐enhanced Raman spectroscopy on blood serum Y Hong, Y Li, L Huang, W He, S Wang, C Wang, G Zhou, Y Chen, X Zhou, ... Journal of Biophotonics 13 (4), e201960176, 2020 | 63 | 2020 |
| Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole L Zheng, W He, K Zhu, C Wang, S Wang, Y Hong, Y Chen, G Zhou, ... Electrochimica Acta 283, 560-567, 2018 | 59 | 2018 |
| Probing DNA stiffness through optical fluctuation analysis of Plasmon rulers T Chen, Y Hong, BM Reinhard Nano letters 15 (8), 5349-5357, 2015 | 55 | 2015 |
| Copolymer of pyrrole and 1, 4-butanediol diglycidyl as an efficient additive leveler for through-hole copper electroplating J Li, G Zhou, Y Hong, C Wang, W He, S Wang, Y Chen, Z Wen, Q Wang ACS omega 5 (10), 4868-4874, 2020 | 53 | 2020 |
| Electromagnetic field enhancement and spectrum shaping through plasmonically integrated optical vortices W Ahn, SV Boriskina, Y Hong, BM Reinhard Nano letters 12 (1), 219-227, 2012 | 52 | 2012 |
| Optoplasmonic hybrid materials for trace detection of methamphetamine in biological fluids through SERS Y Hong, X Zhou, B Xu, Y Huang, W He, S Wang, C Wang, G Zhou, Y Chen, ... ACS Applied Materials & Interfaces 12 (21), 24192-24200, 2020 | 45 | 2020 |
| Rational Assembly of Optoplasmonic Hetero‐nanoparticle Arrays with Tunable Photonic–Plasmonic Resonances Y Hong, Y Qiu, T Chen, BM Reinhard Advanced Functional Materials 24 (6), 739-746, 2014 | 43 | 2014 |
| Compatible Ag+ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing Y Wang, Y Hong, G Zhou, W He, Z Gao, S Wang, C Wang, Y Chen, ... ACS applied materials & interfaces 11 (47), 44811-44819, 2019 | 39 | 2019 |
| Optoplasmonics: basic principles and applications Y Hong, BM Reinhard Journal of Optics 21 (11), 113001, 2019 | 39 | 2019 |
| Directed assembly of optoplasmonic hybrid materials with tunable photonic–plasmonic properties Y Hong, W Ahn, SV Boriskina, X Zhao, BM Reinhard The journal of physical chemistry letters 6 (11), 2056-2064, 2015 | 36 | 2015 |
| Demonstration of efficient on-chip photon transfer in self-assembled optoplasmonic networks W Ahn, Y Hong, SV Boriskina, BM Reinhard ACS nano 7 (5), 4470-4478, 2013 | 35 | 2013 |
| Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence Z Lai, C Wang, Y Huang, Y Chen, S Wang, Y Hong, G Zhou, W He, X Su, ... Materials Today Communications 24, 100973, 2020 | 26 | 2020 |
| Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board Y Hong, X You, Y Zeng, Y Chen, Y Huang, W He, S Wang, C Wang, ... Vacuum 170, 108967, 2019 | 26 | 2019 |
| Plasmonic nanotrough networks for scalable bacterial Raman biosensing R Zhang, Y Hong, BM Reinhard, P Liu, R Wang, L Dal Negro ACS applied materials & interfaces 10 (33), 27928-27935, 2018 | 24 | 2018 |
| Collective photonic-plasmonic resonances in noble metal-dielectric nanoparticle hybrid arrays Y Hong, BM Reinhard Optical Materials Express 4 (11), 2409-2422, 2014 | 22 | 2014 |
| Whisker inhibited Sn–Bi alloy coating on copper surface to increase copper bonding strength for signal loss reduction of PCB in high-frequency G Zhou, Y Tao, W He, S Wang, Y Hong, CY Chen, Y Chen, C Wang, C Ma, ... Applied Surface Science 513, 145718, 2020 | 21 | 2020 |
Yuanming ChenUniversity of Electronic Science and Technology of China在 uestc.edu.cn 的电子邮件经过验证
