| Earthquake damage analysis of arch dams considering dam–water–foundation interaction JT Wang, DD Lyu, F Jin, CH Zhang Soil Dynamics and Earthquake Engineering 49, 64-74, 2013 | 73 | 2013 |
| Failure modes and mechanisms for rechargeable Lithium-based batteries: A state-of-the-art review D Lyu, B Ren, S Li Acta Mechanica 230, 701-727, 2019 | 70 | 2019 |
| Accuracy of the half-power bandwidth method with a third-order correction for estimating damping in multi-DOF systems J Wang, D Lyu, F Jin, C Zhang Earthquake Engineering and Engineering Vibration 12 (1), 33-38, 2013 | 35 | 2013 |
| Mesoscale computational modeling of concrete-like particle-reinforced composites with non-convex aggregates YL Qingxiang Meng, Dandan Lyu Computers and Structures 240, 106349, 2020 | 32 | 2020 |
| A peridynamic failure analysis of fiber-reinforced composite laminates using finite element discontinuous Galerkin approximations B Ren, CT Wu, P Seleson, D Zeng, D Lyu International Journal of Fracture 214, 49-68, 2018 | 31 | 2018 |
| A hierarchical multiscale cohesive zone model and simulation of dynamic fracture in metals D Lyu, H Fan, S Li Engineering Fracture Mechanics 163, 327-347, 2016 | 28 | 2016 |
| The momentum-consistent smoothed particle Galerkin (MC-SPG) method for simulating the extreme thread forming in the flow drill screw-driving process CT Wu, Y Wu, D Lyu, X Pan, W Hu Computational Particle Mechanics 7 (2), 177-191, 2020 | 27 | 2020 |
| Reflection and transmission of plane waves at a water–porous sediment interface with a double-porosity substrate DD Lyu, JT Wang, F Jin, CH Zhang Transport in porous media 103, 25-45, 2014 | 27 | 2014 |
| A multiscale dislocation pattern dynamics: Towards an atomistic-informed crystal plasticity theory D Lyu, S Li Journal of the Mechanics and Physics of Solids 122, 613-632, 2019 | 24 | 2019 |
| Multiscale crystal defect dynamics: A coarse-grained lattice defect model based on crystal microstructure D Lyu, S Li Journal of the Mechanics and Physics of Solids 107, 379-410, 2017 | 23 | 2017 |
| Multiscale modeling of dislocation patterns and simulation of nanoscale plasticity in body-centered cubic (BCC) single crystals LW Zhang, Y Xie, D Lyu, S Li Journal of the Mechanics and Physics of Solids 130, 297-319, 2019 | 18 | 2019 |
| A generalized Bayesian regularization network approach on characterization of geometric defects in lattice structures for topology optimization in preliminary design of 3D printing Y Xie, S Li, CT Wu, D Lyu, C Wang, D Zeng Computational Mechanics 69 (5), 1191-1212, 2022 | 16 | 2022 |
| Numerical prediction of residual deformation and failure for powder bed fusion additive manufacturing of metal parts DD Lyu, W Hu, B Ren, XF Pan, CT Wu Journal of Mechanics 36 (5), 623-636, 2020 | 11 | 2020 |
| Recent Developments in Dislocation Pattern Dynamics: Current Opinions and Perspectives D Lyu, S Li Journal of Micromechanics and Molecular Physics 3 (3), 31, 2018 | 8 | 2018 |
| An h-adaptive meshfree-enriched finite element method based on convex approximations for the three-dimensional ductile crack propagation simulation B Ren, CT Wu, D Lyu Computer Aided Geometric Design 76, 101795, 2020 | 7 | 2020 |
| Multiscale simulation of short-fiber-reinforced composites: From computational homogenization to mechanistic machine learning in LS-DYNA H Wei, CT Wu, D Lyu, W Hu, FH Rouet, K Zhang, P Ho, H Oura, M Nishi, ... Proc., 13th European LS-DYNA Conf. Baden-Württemberg, Germany: Dynamore, 2021 | 4 | 2021 |
| RVE analysis in LS-DYNA for high-fidelity multiscale material modeling H Wei, D Lyu, W Hu, CT Wu arXiv preprint arXiv:2210.11761, 2022 | 3 | 2022 |
| A Two-scale Approach for the Drop Shock Simulation of a Printed Circuit Board Package Considering Reflowed Solder Ball Geometries W Hu, X Pan, D Lyu, A Srivastava, S Shah, CT Wu International Journal for Multiscale Computational Engineering 18 (4), 2020 | 3 | 2020 |
| Multiscale Cohesive Zone Modeling and Simulation of High-speed Impact, Penetration, and Fragmentation C Wang, D Lyu Journal of Micromechanics and Molecular Physics 3 (01n02), 2018 | 3 | 2018 |
| Integrated Process-Mechanical Stress Analysis of 2.5 D/3D ICs with Two Types of Interconnections in Advanced Packaging B Ren, CT Wu, W Hu, X Pan, D Lyu, N Chang 2023 IEEE International Integrated Reliability Workshop (IIRW), 1-4, 2023 | | 2023 |
Shaofan LiProfessor of Applied and Computational Mechanics, University of California-Berkeley在 berkeley.edu 的电子邮件经过验证
