| Is 25 Gb/s on-board signaling viable? DG Kam, MB Ritter, TJ Beukema, JF Bulzacchelli, PK Pepeljugoski, ... IEEE Transactions on advanced packaging 32 (2), 328-344, 2009 | 97 | 2009 |
| Application of the Foldy–Lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards CJ Ong, D Miller, L Tsang, B Wu, CC Huang Microwave and optical technology letters 49 (1), 225-231, 2007 | 57 | 2007 |
| Signal integrity analysis of package and printed circuit board with multiple vias in substrate of layered dielectrics B Wu, L Tsang IEEE Transactions on Advanced Packaging 33 (2), 510-516, 2009 | 54 | 2009 |
| Modeling multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits B Wu, L Tsang IEEE microwave and wireless components letters 19 (1), 12-14, 2008 | 52 | 2008 |
| Full-wave solver for microstrip trace and through-hole via in layered media CJ Ong, B Wu, L Tsang, X Gu IEEE Transactions on Advanced Packaging 31 (2), 292-302, 2008 | 46 | 2008 |
| Full-wave modeling of multiple vias using differential signaling and shared antipad in multilayered high speed vertical interconnects B Wu, L Tsang Progress In Electromagnetics Research 97, 129-139, 2009 | 44 | 2009 |
| Fast computation of layered medium Green's functions of multilayers and lossy media using fast all-modes method and numerical modified steepest descent path method B Wu, L Tsang IEEE transactions on microwave theory and techniques 56 (6), 1446-1454, 2008 | 42 | 2008 |
| Electromagnetic fields of Hertzian dipoles in layered media of moderate thickness including the effects of all modes L Tsang, B Wu IEEE Antennas and Wireless Propagation Letters 6, 316-319, 2007 | 31 | 2007 |
| Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects B Wu, X Gu, L Tsang, MB Ritter Microwave and Optical Technology Letters 53 (6), 1204-1206, 2011 | 30 | 2011 |
| Methods and designs for improving the signal integrity of vertical interconnects in high performance packaging B Wu, HL Lo Progress In Electromagnetics Research 123, 1-11, 2012 | 24 | 2012 |
| Efficient full-wave modeling of high density TSVs for 3D integration X Gu, B Wu, M Ritter, L Tsang 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 23 | 2010 |
| Fast all modes (FAM) method combined with NMSP for evaluating spatial domain layered medium Green's functions of moderate thickness B Wu, L Tsang, CJ Ong Microwave and Optical Technology Letters 49 (12), 3112-3118, 2007 | 16 | 2007 |
| Electromagnetic fields of Hertzian dipoles in thin-layered media L Tsang, CJ Ong, B Wu IEEE Antennas and Wireless Propagation Letters 5, 537-540, 2006 | 14 | 2006 |
| High-density interconnect board design for wafer-level packaging B Wu, B Brown, E Warner Electronics letters 47 (20), 1137-1138, 2011 | 13 | 2011 |
| Micro-via structure design for high performance integrated circuits C Ye, B Wu US Patent 7,649,265, 2010 | 12 | 2010 |
| Fast full wave analysis of PCB via arrays with model-to-hardware correlation X Gu, B Wu, C Baks, L Tsang 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging …, 2009 | 12 | 2009 |
| Passive equalizer design on high density interconnects for 25Gbps high speed IO and beyond B Wu, T Mo 2014 15th International Conference on Electronic Packaging Technology, 39-42, 2014 | 9 | 2014 |
| Barbed transmission lines for crosstalk suppression B Wu, T Mo 2012 Asia-Pacific Symposium on Electromagnetic Compatibility, 621-624, 2012 | 8 | 2012 |
| The viability of 25 Gb/s on-board signalling MB Ritter, P Pepeljugoski, X Gu, Y Kwark, D Kam, R Rimolo-Donadio, ... 2008 58th Electronic Components and Technology Conference, 1121-1127, 2008 | 7 | 2008 |
| Electrical devices and methods for forming electrical devices S Chigullapalli, L Fitch, B Wu US Patent 10,763,218, 2020 | 6 | 2020 |
Mark RitterIBM T.J. Watson Research Center在 us.ibm.com 的电子邮件经过验证
