Soft subdermal implant capable of wireless battery charging and programmable controls for applications in optogenetics CY Kim, MJ Ku, R Qazi, HJ Nam, JW Park, KS Nam, S Oh, I Kang, ... Nature communications 12 (1), 535, 2021 | 129 | 2021 |
Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly MAN Calderon, S Oh, JR Brescia, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | 1 | 2024 |
Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader A Victor, M Manley, S Oh, MS Bakir 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1767-1772, 2023 | 1 | 2023 |
Electrical-Thermal Co-analysis of Through-Silicon Vias (TSVs) Integrated within Micropin-fin Heatsink for 3D Heterogeneous Integration (HI) E Chung, G Yan, S Oh, B Ramakrishnan, H Alissa, V Oruganti, C Belady, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
Silicon Nitride-based CMOS-photonic Devices Using High-Q Resonators R Krishna, Z Peng, A Hosseinnia, S Oh, M Bakir, A Adibi CLEO: Applications and Technology, AW3J. 5, 2024 | | 2024 |
Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications S Oh, T Zheng, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
Opto-Myomatrix: μLED integrated microelectrode arrays for optogenetic activation and electrical recording in muscle tissue J Lu, M Zia, DA Baig, G Yan, JJ Kim, K Nagapudi, P Anschutz, S Oh, ... bioRxiv, 2024.07. 01.601601, 2024 | | 2024 |