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Dr. Vineet Srivastava
Dr. Vineet Srivastava
Thapar Institute of Engineering and Technology, Patiala
在 thapar.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
Effect of process parameters on the performance of EDM process with ultrasonic assisted cryogenically cooled electrode
V Srivastava, PM Pandey
Journal of Manufacturing Processes 14 (3), 393-402, 2012
1832012
Performance evaluation of electrical discharge machining (EDM) process using cryogenically cooled electrode
V Srivastava, PM Pandey
Materials and Manufacturing Processes 27 (6), 683-688, 2012
1392012
Study of ultrasonic assisted cryogenically cooled EDM process using sintered (Cu–TiC) tooltip
V Srivastava, PM Pandey
Journal of Manufacturing Processes 15 (1), 158-166, 2013
602013
Enhanced tribological properties of SiC reinforced copper metal matrix composites
N Somani, YK Tyagi, P Kumar, V Srivastava, H Bhowmick
Materials Research Express 6 (1), 016549, 2018
442018
Effect of Process Parameters on Mechanical Properties of Solidified PLA Parts Fabricated by 3D Printing Process
J Khatwani, V Srivastava
3D Printing and Additive Manufacturing Technologies, 95-104, 2018
362018
Experimental investigation on electrical discharge machining process with ultrasonic-assisted cryogenically cooled electrode
V Srivastava, PM Pandey
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2013
362013
Experimental investigations and modeling of temperature in the work-brush interface during ultrasonic assisted magnetic abrasive finishing process
RS Mulik, V Srivastava, PM Pandey
Materials and Manufacturing Processes 27 (1), 1-9, 2012
352012
Modeling of Linear Shrinkage in PLA Parts Fabricated by 3D Printing Using TOPSIS Method
J Mago, R Kumar, R Agrawal, A Singh, V Srivastava
Advances in Additive Manufacturing and Joining, 267-276, 2020
282020
Prediction of Tool Shape in Electrical Discharge Machining of EN31 Steel Using Machine Learning Techniques
AS Walia, V Srivastava, PS Rana, N Somani, NK Gupta, G Singh, ...
Metals 11 (11), 1668, 2021
232021
Study of the cryogenically cooled electrode shape in electric discharge machining process
V Srivastava, PM Pandey
World Academy of Science, Engineering and Technology 5, 2004-22, 2011
202011
Statistical modeling and material removal mechanism of electrical discharge machining process with cryogenically cooled electrode
V Srivastava, PM Pandey
Procedia Materials Science 5, 2004-2013, 2014
162014
Development and performance evaluation of sintered tool tip while EDMing of hardened steel
AS Walia, V Jain, V Srivastava
Materials Research Express 6 (8), 086520, 2019
132019
Effect of Tic reinforcement in the copper tool on roundness during EDM process
AS Walia, V Srivastava, V Jain, SA Bansal
Advances in Materials Science and Engineering: Select Proceedings of ICFMMP …, 2020
112020
Surface roughness studies in selective laser sintering of glass filled polyamide
V Srivastava, SK Parida, PM Pandey
Proceedings of the 36th International MATADOR Conference, 495-499, 2010
112010
Surface Roughness Analysis of H13 Steel during Electrical Discharge Machining Process Using Cu–TiC Sintered Electrode
AS Walia, V Srivastava, M Garg, N Somani, NK Gupta, C Prakash, ...
Materials 14 (20), 5943, 2021
92021
Impact of copper-titanium carbide tooltip on machined surface integrity during Electrical Discharge Machining of EN31 steel
AS Walia, V Srivastava, V Jain
Materials Research Express 6 (10), 106582, 2019
62019
Modelling of Surface Roughness and Change in Out‐of‐Roundness of Tool during Electrical Discharge Machining with Cermet Tool Tip Using Machine Learning
AS Walia, V Srivastava, K Verma
Processes 10, 252, 2022
22022
Effect of Shod Walking on Plantar Pressure with Varying Insole
K Sandhu, V Srivastava, M Pal
22020
Modelling and Analysis of Change in Shape of sintered Cu–TiC tool tip during Electrical Discharge Machining process
AS Walia, V Srivastava, V Jain, M Garg
Advances in Unconventional Machining and Composites: Proceedings of AIMTDR …, 2019
22019
Fabrication and Application of Composite Electrodes in Electrical Discharge Machining-A Review
AS Walia, V Srivastava, V Jain
International Journal of Computer Applications, 1-5, 2018
22018
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