Atomic-beam alignment of inorganic materials for liquid-crystal displays P Chaudhari, J Lacey, J Doyle, E Galligan, SCA Lien, A Callegari, ... Nature 411 (6833), 56-59, 2001 | 490 | 2001 |
Fluoropolymers 2 G Hougham, PE Cassidy, K Johns, T Davidson Springer Science & Business Media, 2002 | 349 | 2002 |
Polarization effects of fluorine on the relative permittivity in polyimides G Hougham, G Tesoro, A Viehbeck, JD Chapple-Sokol Macromolecules 27 (21), 5964-5971, 1994 | 295 | 1994 |
Synthesis and properties of highly fluorinated polyimides G Hougham, G Tesoro, J Shaw Macromolecules 27 (13), 3642-3649, 1994 | 267 | 1994 |
Silicon chip carrier with conductive through-vias and method for fabricating same DC Edelstein, PS Andry, LP Buchwalter, JA Casey, SA Goma, RR Horton, ... US Patent 7,276,787, 2007 | 266 | 2007 |
Influence of free volume change on the relative permittivity and refractive index in fluoropolyimides G Hougham, G Tesoro, A Viehbeck Macromolecules 29 (10), 3453-3456, 1996 | 257 | 1996 |
Synthesis and properties of some new fluorine-containing polyimides AC Misra, G Tesoro, G Hougham, SM Pendharkar Polymer 33 (5), 1078-1082, 1992 | 126 | 1992 |
Electronic structure and ultraviolet absorption spectrum of polyimide JP LaFemina, G Arjavalingam, G Hougham The Journal of chemical physics 90 (9), 5154-5160, 1989 | 116 | 1989 |
Optics for high-performance servers and supercomputers AF Benner, DM Kuchta, PK Pepeljugoski, RA Budd, G Hougham, ... 2010 Conference on Optical Fiber Communication (OFC/NFOEC), collocated …, 2010 | 103 | 2010 |
Is 25 Gb/s on-board signaling viable? DG Kam, MB Ritter, TJ Beukema, JF Bulzacchelli, PK Pepeljugoski, ... IEEE Transactions on advanced packaging 32 (2), 328-344, 2009 | 97 | 2009 |
Silicon chip carrier with conductive through-vias and method for fabricating same D Edelstein, P Andry, L Buchwalter, J Casey, S Goma, R Horton, ... US Patent App. 11/242,221, 2006 | 92 | 2006 |
Electronic component cooling using a heat transfer buffering capability GLT Chiu, GG Hougham, LS Mok US Patent 5,987,890, 1999 | 85 | 1999 |
The evolution of build-up package technology and its design challenges ED Blackshear, M Cases, E Klink, SR Engle, RS Malfatt, DN de Araujo, ... IBM journal of research and development 49 (4.5), 641-661, 2005 | 80 | 2005 |
Fluoropolymers: synthesis and applications G Hougham, PE Cassidy, K Johns, J Davidson Plenum Press, New York 1, 2, 1999 | 76 | 1999 |
Fluoropolymers 1 G Hougham Springer Science & Business Media, 1999 | 70 | 1999 |
Process of fabricating a precision microcontact printing stamp G Hougham, P Fryer, R Nunes US Patent 6,656,308, 2003 | 64 | 2003 |
Method for forming alignment layer by ion beam surface modification AC Callegari, P Chaudhari, FE Doany, JP Doyle, EA Galligan, JH Glownia, ... US Patent 6,665,033, 2003 | 57 | 2003 |
Heat transfer in electronic apparatus GG Hougham, LS Mok US Patent 6,109,039, 2000 | 52 | 2000 |
The synthesis and properties of polyimides made from perfluoro aromatic diamines G Hougham, G Tesoro, J Shaw ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY 198, 79-PMSE, 1989 | 50 | 1989 |
Emission mechanism in polyimide G Arjavalingam, G Hougham, JP LaFemina Polymer 31 (5), 840-844, 1990 | 47 | 1990 |