| The effect of solder paste volume on solder joint shape and self-alignment of passive components K Pan, JH Ha, H Wang, J Xu, SB Park 2020 IEEE 70th Electronic components and Technology conference (EcTc), 1289-1297, 2020 | 28 | 2020 |
| An analysis of solder joint formation and self-alignment of chip capacitors K Pan, JH Ha, H Wang, J Xu, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 25 | 2020 |
| The effect of misaligned passive component on fatigue life of solder joints and solder shape J Ha, K Pan, H Wang, DH Won, SB Park 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 23 | 2020 |
| The effect of solder paste volume on chip resistor solder joint fatigue life H Wang, K Pan, J Ha, C Cai, J Xu, S Park Procedia Manufacturing 38, 1372-1380, 2019 | 22 | 2019 |
| The effect of solder paste volume on surface mount assembly self-alignment K Pan, JH Ha, HY Wang, V Veeraraghavan, SB Park Procedia Manufacturing 38, 1381-1393, 2019 | 19 | 2019 |
| Reflow recipe establishment based on CFD-Informed machine learning model Y Lai, JH Ha, KA Deo, J Yang, P Yin, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 13 | 2023 |
| Shape dependency of fatigue life in solder joints of chip resistors J Ha, C Cai, P Yin, Y Lai, K Pan, J Yang, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1489-1494, 2022 | 13 | 2022 |
| A deep learning approach for reflow profile prediction Y Lai, J Kataoka, K Pan, J Ha, J Yang, KA Deo, J Xu, P Yin, C Cai, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2269-2274, 2022 | 12 | 2022 |
| Thermomechanical reliability of BGA packages with different underfill reinforcement methods Y Lai, C Cai, K Pan, J Yang, J Ha, P Yin, K Deo, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 11 | 2022 |
| The optimal solution of reflow oven recipe based on physics-guided machine learning model Y Lai, K Pan, J Ha, C Cai, J Yang, P Yin, J Xu, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 11 | 2022 |
| Parametric study of the geometry design of through-silicon via in silicon interposer K Pan, Y Lai, J Xu, P Yin, J Ha, C Cai, J Yang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 10 | 2022 |
| Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life J Ha, Y Lai, J Yang, P Yin, S Park Journal of Electronic Packaging 146 (2), 2024 | 5 | 2024 |
| Enhanced solder fatigue life of chip resistor by optimizing solder shape J Ha, Y Lai, J Yang, P Yin, S Park Microelectronics Reliability 145, 114994, 2023 | 4 | 2023 |
| A Technical Review on State of the Art In-Plane and Out-of-Plane Deformation Measurement Techniques for Microelectronic Packages KA Deo, P Yin, J Yang, JH Ha, SB Park 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 907-913, 2023 | 4 | 2023 |
| Ionic Sensor Package Design for the Survivability in a Drop/Impact During Deployment P Yin, J Ha, J Yang, Y Lai, S Park, B Jacob 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1085-1090, 2023 | 3 | 2023 |
| Residual stress measurement of build-up layer in silicon wafers J Yang, C Cai, Y Lai, J Ha, H Wang, S Park, G Refai-Ahmed, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 303-309, 2023 | 3 | 2023 |
| Reflow Oven Zone Temperature Advisor using the AI-Driven Smart Recipe Generator Y Lai, P Yin, J Yang, J Ha, KA Deo, S Park 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1773-1778, 2023 | 2 | 2023 |
| Investigation on Fatigue Life of Non-Symmetric Solder Joints in Chip Resistors J Ha, J Yang, P Yin, KA Deo, C Cai, S Park 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 840-845, 2023 | 1 | 2023 |
| Influence of Stiffener Design on Co-Packaged Optics (CPO) 2.5 D Heterogeneous Packages KA Deo, Y Lai, J Yang, JH Ha, S Park 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1814-1819, 2024 | | 2024 |
| Bond-line Thickness Prediction for Thermal Interface Material under Usage Conditions Y Lai, X Jiefeng, J Ha, KA Deo, J Yang, S Park 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1538-1542, 2024 | | 2024 |
