Ambipolar electrical transport in semiconducting single-wall carbon nanotubes R Martel, V Derycke, C Lavoie, J Appenzeller, KK Chan, J Tersoff, ... Physical review letters 87 (25), 256805, 2001 | 1072 | 2001 |
Self-aligned process for nanotube/nanowire FETs P Avouris, RA Carruthers, J Chen, CGMM Detavernier, C Lavoie, ... US Patent 8,119,466, 2012 | 527 | 2012 |
Towards implementation of a nickel silicide process for CMOS technologies C Lavoie, FM d’Heurle, C Detavernier, C Cabral Jr Microelectronic Engineering 70 (2-4), 144-157, 2003 | 499 | 2003 |
Sharp reduction of contact resistivities by effective Schottky barrier lowering with silicides as diffusion sources Z Zhang, F Pagette, C D'emic, B Yang, C Lavoie, Y Zhu, M Hopstaken, ... IEEE Electron Device Letters 31 (7), 731-733, 2010 | 295 | 2010 |
Metal-gate FinFET and fully-depleted SOI devices using total gate silicidation J Kedzierski, E Nowak, T Kanarsky, Y Zhang, D Boyd, R Carruthers, ... Digest. International Electron Devices Meeting,, 247-250, 2002 | 281 | 2002 |
Thin film reaction of transition metals with germanium S Gaudet, C Detavernier, AJ Kellock, P Desjardins, C Lavoie Journal of Vacuum Science & Technology A 24 (3), 474-485, 2006 | 278 | 2006 |
High-/Metal-Gate Fully Depleted SOI CMOS With Single-Silicide Schottky Source/Drain With Sub-30-nm Gate Length MH Khater, Z Zhang, J Cai, C Lavoie, C D'Emic, Q Yang, B Yang, ... IEEE Electron Device Letters 31 (4), 275-277, 2010 | 249 | 2010 |
Field-emission SEM imaging of compositional and doping layer semiconductor superlattices DD Perovic, MR Castell, A Howie, C Lavoie, T Tiedje, JSW Cole Ultramicroscopy 58 (1), 104-113, 1995 | 228 | 1995 |
An off-normal fibre-like texture in thin films on single-crystal substrates C Detavernier, AS Özcan, J Jordan-Sweet, EA Stach, J Tersoff, FM Ross, ... Nature 426 (6967), 641-645, 2003 | 224 | 2003 |
In-situ X-ray diffraction study of metal induced crystallization of amorphous silicon W Knaepen, C Detavernier, RL Van Meirhaeghe, JJ Sweet, C Lavoie Thin Solid Films 516 (15), 4946-4952, 2008 | 189 | 2008 |
Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition H Kim, C Cabral Jr, C Lavoie, SM Rossnagel Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2002 | 170 | 2002 |
Effects of additive elements on the phase formation and morphological stability of nickel monosilicide films C Lavoie, C Detavernier, C Cabral Jr, FM d’Heurle, AJ Kellock, ... Microelectronic engineering 83 (11-12), 2042-2054, 2006 | 151 | 2006 |
High-temperature degradation of NiSi films: Agglomeration versus NiSi2 nucleation D Deduytsche, C Detavernier, RL Van Meirhaeghe, C Lavoie Journal of applied physics 98 (3), 2005 | 133 | 2005 |
In situ x-ray diffraction study of metal induced crystallization of amorphous germanium W Knaepen, S Gaudet, C Detavernier, RL Van Meirhaeghe, JJ Sweet, ... Journal of Applied Physics 105 (8), 2009 | 122 | 2009 |
FinFET performance advantage at 22nm: An AC perspective M Guillorn, J Chang, A Bryant, N Fuller, O Dokumaci, X Wang, J Newbury, ... 2008 Symposium on VLSI Technology, 12-13, 2008 | 121 | 2008 |
Optical apparatus and method for measuring temperature of a substrate material with a temperature dependent band gap SR Johnson, C Lavoie, MK Nissen, JT Tiedje US Patent 5,388,909, 1995 | 120 | 1995 |
Influence of Pt addition on the texture of NiSi on Si (001) C Detavernier, C Lavoie applied physics letters 84 (18), 3549-3551, 2004 | 119 | 2004 |
Semiconductor substrate temperature measurement by diffuse reflectance spectroscopy in molecular beam epitaxy SR Johnson, C Lavoie, T Tiedje, JA Mackenzie Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1993 | 115 | 1993 |
Two gates are better than one [double-gate MOSFET process] PM Solomon, KW Guarini, Y Zhang, K Chan, EC Jones, GM Cohen, ... IEEE circuits and devices magazine 19 (1), 48-62, 2003 | 114 | 2003 |
IEDM Tech J Kedzierski, DM Fried, EJ Nowak, T Kanarsky, JH Rankin, H Hanafi, ... Dig 247 (441), 2003, 2002 | 112 | 2002 |