| Enhanced strength and temperature dependence of mechanical properties of Li at small scales and its implications for Li metal anodes C Xu, Z Ahmad, A Aryanfar, V Viswanathan, JR Greer Proceedings of the National Academy of Sciences 114 (1), 57-61, 2017 | 254 | 2017 |
| Three-Dimensional Au Microlattices as Positive Electrodes for Li–O2 Batteries C Xu, BM Gallant, PU Wunderlich, T Lohmann, JR Greer ACS nano 9 (6), 5876-5883, 2015 | 95 | 2015 |
| Atomic layer deposition and etch in a single plasma chamber for critical dimension control X Zhou, Y Kimura, D Zhang, C Xu, G Upadhyaya, M Brooks US Patent 10,734,238, 2020 | 16 | 2020 |
| Molecular structure of highly excited resonant states in and the corresponding and decays C Xu, C Qi, RJ Liotta, R Wyss, SM Wang, FR Xu, DX Jiang Physical Review C—Nuclear Physics 81 (5), 054319, 2010 | 15 | 2010 |
| Atomic layer deposition and etch for reducing roughness US Patent 20,190,157,066, 2019 | 10* | 2019 |
| Alpha-particle decays from excited states in 24Mg SM Wang, C Xu, RJ Liotta, C Qi, FR Xu, DX Jiang Science China Physics, Mechanics and Astronomy 54, 130-135, 2011 | 5 | 2011 |
| Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP method X Zhou, TA Kamp, Y Kimura, D Zhang, C Xu, J Drewery, A Paterson US Patent 10,950,454, 2021 | 2 | 2021 |
| Atomic layer deposition and etch in a single plasma chamber for critical dimension control X Zhou, Y Kimura, D Zhang, C Xu, G Upadhyaya, M Brooks US Patent 11,211,253, 2021 | 1 | 2021 |
| Atomic layer deposition and etch for reducing roughness X Zhou, N Ansari, Y Kimura, SYY Li, K Sultana, R Mani, D Zhang, H Kazi, ... US Patent 11,170,997, 2021 | | 2021 |
| Integrated atomic layer passivation in tcp etch chamber and in-situ etch-alp method X Zhou, TA Kamp, Y Kimura, D Zhang, C Xu, J Drewery, A Paterson US Patent App. 17/200,526, 2021 | | 2021 |
| INTEGRATED ATOMIC LAYER PASSIVATION IN TCP ETCHING CHAMBER AND ALP IN SITU ETCHING METHOD X Zhou, TA Kamp, Y Kimura, D ZHANG, C Xu, J Drewery, A Paterson | | 2019 |
