| Design and fabrication of screen-printed silver circuits for stretchable electronics KS Kim, KH Jung, SB Jung Microelectronic engineering 120, 216-220, 2014 | 74 | 2014 |
| Photo-induced healing of stretchable transparent electrodes based on thermoplastic polyurethane with embedded metallic nanowires KS Kim, SB Choi, DU Kim, CR Lee, JW Kim Journal of Materials Chemistry A 6 (26), 12420-12429, 2018 | 40 | 2018 |
| Microstructure, electrical properties, and electrochemical migration of a directly printed Ag pattern BI Noh, JW Yoon, KS Kim, YC Lee, SB Jung Journal of Electronic Materials 40, 35-41, 2011 | 37 | 2011 |
| The characteristics of Cu nanopaste sintered by atmospheric-pressure plasma KS Kim, JO Bang, YH Choa, SB Jung Microelectronic engineering 107, 121-124, 2013 | 36 | 2013 |
| Electrochemical migration behavior of silver nanopaste screen-printed for flexible and printable electronics KS Kim, JO Bang, SB Jung Current Applied Physics 13, S190-S194, 2013 | 33 | 2013 |
| Enhancing adhesion of screen‐printed silver nanopaste films JH Kim, KS Kim, KR Jang, SB Jung, TS Kim Advanced Materials Interfaces 2 (13), 1500283, 2015 | 29 | 2015 |
| Flexibility of silver conductive circuits screen-printed on a polyimide substrate KS Kim, YC Lee, JW Kim, SB Jung Journal of nanoscience and nanotechnology 11 (2), 1493-1498, 2011 | 29 | 2011 |
| Intense pulsed light sintering of vanadium dioxide nanoparticle films and their optical properties for thermochromic smart window KS Kim, EW Son, JW Youn, DU Kim Materials & Design 176, 107838, 2019 | 28 | 2019 |
| Effects of sintering conditions on microstructure and characteristics of screen-printed Ag thin film KS Kim, WR Myung, SB Jung Electronic Materials Letters 8, 309-314, 2012 | 26 | 2012 |
| Regulation in shear test method for BGA of flip-chip packages JH Ahn, KS Kim, YC Lee, YI Kim, SB Jung Journal of the Microelectronics and Packaging Society 17 (3), 1-9, 2010 | 25 | 2010 |
| Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder BI Noh, JW Yoon, KS Kim, S Kang, SB Jung Microelectronic engineering 103, 1-6, 2013 | 23 | 2013 |
| Microstructure and adhesion characteristics of a silver nanopaste screen-printed on Si substrate KS Kim, Y Kim, SB Jung Nanoscale research letters 7, 1-6, 2012 | 21 | 2012 |
| Fabrication of a bending-insensitive in-plane strain sensor from a reversible cross-linker-functionalized silicone polymer SO Kim, CJ Han, Y Kim, KS Kim, DU Kim, CR Lee, JW Kim ACS applied materials & interfaces 12 (5), 6516-6524, 2020 | 19 | 2020 |
| Revisiting the thickness reduction approach for near-foldable capacitive touch sensors based on a single layer of Ag nanowire-polymer composite structure KS Kim, SO Kim, CJ Han, DU Kim, JS Kim, YT Yu, CR Lee, JW Kim Composites Science and Technology 165, 58-65, 2018 | 19 | 2018 |
| Fabrication of Ag-MWNT nanocomposite paste for high-power LED package KS Kim, BG Park, H Kim, HS Lee, SB Jung Current Applied Physics 15, S36-S41, 2015 | 18 | 2015 |
| Adhesion characteristics of VO2 ink film sintered by intense pulsed light for smart window JW Youn, SJ Lee, KS Kim, DU Kim Applied Surface Science 441, 508-514, 2018 | 16 | 2018 |
| Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching KS Kim, YC Lee, JH Ahn, JY Song, CD Yoo, SB Jung Korean Journal of Metals and Materials 48 (11), 1028-1034, 2010 | 16 | 2010 |
| Overview on thermal management technology for high power device packaging KS Kim, DH Choi, SB Jung Journal of the Microelectronics and Packaging Society 21 (2), 13-21, 2014 | 15 | 2014 |
| Electrochemical migration of Ag nanoink patterns controlled by atmospheric-pressure plasma KS Kim, YT Kwon, YH Choa, SB Jung Microelectronic engineering 106, 27-32, 2013 | 14 | 2013 |
| Electrical characteristics of copper circuit using inkjet printing KS Kim, JM Koo, JW Joung, BS Kim, SB Jung Journal of the Microelectronics and Packaging Society 17 (3), 43-49, 2010 | 14 | 2010 |
