| Review of near-field wireless power and communication for biomedical applications HJ Kim, H Hirayama, S Kim, KJ Han, R Zhang, JW Choi IEEE Access 5, 21264 - 21285, 2017 | 263 | 2017 |
| Optimal core shape design for cogging torque reduction of brushless DC motor using genetic algorithm KJ Han, HS Cho, DH Cho, HK Jung IEEE transactions on magnetics 36 (4), 1927-1931, 2000 | 132 | 2000 |
| Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions KJ Han, M Swaminathan, T Bandyopadhyay Advanced Packaging, IEEE Transactions on 33 (4), 804-817, 2010 | 128 | 2010 |
| Rigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects T Bandyopadhyay, KJ Han, D Chung, R Chatterjee, M Swaminathan, ... Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 118 | 2011 |
| Analysis and design guide of active EMI filter in a compact package for reduction of common-mode conducted emissions D Shin, S Kim, G Jeong, J Park, J Park, KJ Han, J Kim Electromagnetic Compatibility, IEEE Transactions on 57 (4), 660-671, 2015 | 96 | 2015 |
| Adversarial attacks and defenses on AI in medical imaging informatics: A survey S Kaviani, KJ Han, I Sohn Expert Systems with Applications 198, 116815, 2022 | 85 | 2022 |
| Cybersecurity in the AI-Based Metaverse: A Survey M Pooyandeh, KJ Han, I Sohn Applied Sciences 12 (24), 12993, 2022 | 60 | 2022 |
| Design and modeling for 3D ICs and interposers M Swaminathan, KJ Han World Scientific, 2013 | 54 | 2013 |
| A design study on 40 MW synchronous motor with no-insulation HTS field winding U Bong, SB An, J Voccio, J Kim, JT Lee, J Lee, KJ Han, H Lee, S Hahn IEEE Transactions on Applied Superconductivity 29 (5), 5203706, 2019 | 43 | 2019 |
| Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems B Xie, M Swaminathan, KJ Han, J Xie 2011 IEEE International Symposium on Electromagnetic Compatibility, 16-21, 2011 | 43 | 2011 |
| Estimation of high-frequency parameters of AC machine from transmission line model Y Ryu, BR Park, KJ Han IEEE Transactions on Magnetics 51 (3), 8101404, 2015 | 37 | 2015 |
| Inductance and resistance calculations in three-dimensional packaging using cylindrical conduction-mode basis functions KJ Han, M Swaminathan Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions …, 2009 | 37 | 2009 |
| Combined circuit model to simulate post-quench behaviors of no-insulation HTS coil M Cho, S Noguchi, J Bang, J Kim, U Bong, JT Lee, SB An, KR Bhattarai, ... IEEE Transactions on Applied Superconductivity 29 (5), 4901605, 2019 | 36 | 2019 |
| Design optimization for the insulation of HVDC converter transformers under composite electric stresses M Yea, KJ Han, J Park, S Lee, J Choi IEEE Transactions on Dielectrics and Electrical Insulation 25 (1), 253-262, 2018 | 28 | 2018 |
| Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth KJ Han, X Gu, YH Kwark, L Shan, MB Ritter Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014 | 23 | 2014 |
| Design study on a 100-kA/20-K HTS cable for fusion magnets S Hahn, J Song, Y Kim, KJ Han, H Lee, Y Iwasa, Y Chu Applied Superconductivity, IEEE Transactions on 25 (3), 4801605, 2015 | 22 | 2015 |
| Modeling of through-silicon via (TSV) interposer considering depletion capacitance and substrate layer thickness effects KJ Han, M Swaminathan, J Jeong Components, Packaging and Manufacturing Technology, IEEE Transactions on 5 …, 2015 | 22 | 2015 |
| Modeling electrical interconnections in three-dimensional structures KJ Han, M Swaminathan US Patent 8,352,242, 2013 | 22 | 2013 |
| Electromagnetic modeling of interconnections in three-dimensional integration KJ Han Georgia Institute of Technology, 2009 | 21 | 2009 |
| A numerical method for spatially-distributed transient simulation to replicate nonlinear ‘defect-irrelevant’ behaviors of no-insulation HTS coil G Kim, A Musso, J Bang, JT Lee, C Im, K Choi, J Kim, M Breschi, KJ Han, ... Superconductor Science and Technology 34 (11), 115004, 2021 | 20 | 2021 |
Madhavan SwaminathanDept Head EE; William E. Leonhard Endowed Chair; Director CHIMES (an SRC JUMP 2.0 Center) Penn State在 psu.edu 的电子邮件经过验证
