| Handbook of wafer bonding P Ramm, JJQ Lu, MMV Taklo John Wiley & Sons, 2012 | 166 | 2012 |
| Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold MMV Taklo, P Storås, K Schjølberg-Henriksen, HK Hasting, H Jakobsen Journal of Micromechanics and Microengineering 14 (7), 884, 2004 | 119 | 2004 |
| 3D integration technology: Status and application development P Ramm, A Klumpp, J Weber, N Lietaer, M Taklo, W De Raedt, T Fritzsch, ... 2010 Proceedings of ESSCIRC, 9-16, 2010 | 100 | 2010 |
| Design, process and characterisation of a high-performance vibration sensor for wireless condition monitoring A Vogl, DT Wang, P Storås, T Bakke, MMV Taklo, A Thomson, L Balgård Sensors and actuators a: physical 153 (2), 155-161, 2009 | 79 | 2009 |
| 3D System-on-Chip technologies for More than Moore systems P Ramm, A Klumpp, J Weber, MMV Taklo Microsystem technologies 16, 1051-1055, 2010 | 77 | 2010 |
| AlAl thermocompression bonding for wafer-level MEMS sealing N Malik, K Schjølberg-Henriksen, E Poppe, MMV Taklo, TG Finstad Sensors and Actuators A: Physical 211, 115-120, 2014 | 63 | 2014 |
| Characterization and failure analysis of 3D integrated systems using a novel plasma‐FIB system L Kwakman, G Franz, MMV Taklo, A Klumpp, P Ramm AIP Conference Proceedings 1395 (1), 269-273, 2011 | 51 | 2011 |
| Au-Sn SLID bonding: A reliable HT interconnect and die attach technology TA Tollefsen, A Larsson, MMV Taklo, A Neels, X Maeder, K Høydalsvik, ... Metallurgical and Materials Transactions B 44, 406-413, 2013 | 50 | 2013 |
| Nanoparticle assembly and sintering towards all-copper flip chip interconnects J Zürcher, K Yu, G Schlottig, M Baum, MMV Taklo, B Wunderle, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1115-1121, 2015 | 46 | 2015 |
| Wafer‐Level Solid–Liquid Interdiffusion Bonding N Hoivik, K Aasmundtveit Handbook of wafer bonding, 181-214, 2012 | 35 | 2012 |
| All-copper flip chip interconnects by pressureless and low temperature nanoparticle sintering J Zürcher, L Del Carro, G Schlottig, DN Wright, ASB Vardøy, MMV Taklo, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 343-349, 2016 | 33 | 2016 |
| Wafer-level Au–Au bonding in the 350–450 C temperature range HR Tofteberg, K Schjølberg-Henriksen, EJ Fasting, AS Moen, MMV Taklo, ... Journal of Micromechanics and Microengineering 24 (8), 084002, 2014 | 33 | 2014 |
| Anodic bonding of glass to aluminium K Schjølberg-Henriksen, E Poppe, S Moe, P Storås, MMV Taklo, DT Wang, ... Microsystem technologies 12, 441-449, 2006 | 33 | 2006 |
| Bonding and TSV in 3D IC integration: physical analysis with a plasma FIB MMV Taklo, A Klumpp, P Ramm, L Kwakman, G Franz, MMV Taklo Microscopy and Analysis-UK, 9, 2012 | 29 | 2012 |
| Use of conductive adhesive for MEMS interconnection in ammunition fuze applications J Gakkestad, P Dalsjo, H Kristiansen, R Johannessen, MMV Taklo Journal of Micro/Nanolithography, MEMS and MOEMS 9 (4), 041108-041108-10, 2010 | 27 | 2010 |
| Impact of SiO2 on Al–Al thermocompression wafer bonding N Malik, K Schjølberg-Henriksen, EU Poppe, MMV Taklo, TG Finstad Journal of Micromechanics and Microengineering 25 (3), 035025, 2015 | 26 | 2015 |
| Low-temperature plasma activated bonding for a variable optical attenuator K Schjølberg-Henriksen, S Moe, MMV Taklo, P Storås, JH Ulvensøen Sensors and Actuators A: Physical 142 (1), 413-420, 2008 | 20 | 2008 |
| Characterization of hermetic wafer-level Cu-Sn SLID bonding HJ Van de Wiel, ASB Vardøy, G Hayes, HR Fischer, A Lapadatu, ... 2012 4th Electronic System-Integration Technology Conference, 1-7, 2012 | 17 | 2012 |
| Bending machine for testing reliability of flexible electronics DN Wright, ASB Vardøy, BD Belle, MMV Taklo, O Hagel, L Xie, ... 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 47-52, 2017 | 16 | 2017 |
| Cost-efficient wafer-level capping for MEMS and imaging sensors by adhesive wafer bonding SJ Bleiker, MM Visser Taklo, N Lietaer, A Vogl, T Bakke, F Niklaus Micromachines 7 (10), 192, 2016 | 14 | 2016 |
