| Nanosecond laser textured superhydrophobic metallic surfaces and their chemical sensing applications DV Ta, A Dunn, TJ Wasley, RW Kay, J Stringer, PJ Smith, C Connaughton, ... Applied Surface Science 357, 248-254, 2015 | 378 | 2015 |
| A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing NJ Wilkinson, MAA Smith, RW Kay, RA Harris The International Journal of Advanced Manufacturing Technology 105, 4599-4619, 2019 | 370 | 2019 |
| Laser textured superhydrophobic surfaces and their applications for homogeneous spot deposition A Dunn, TJ Wasley, J Li, RW Kay, J Stringer, PJ Smith, E Esenturk, ... Applied Surface Science 365, 153-159, 2016 | 314 | 2016 |
| Baricitinib in patients admitted to hospital with COVID-19 (RECOVERY): a randomised, controlled, open-label, platform trial and updated meta-analysis O Abani, A Abbas, F Abbas, J Abbas, K Abbas, M Abbas, S Abbasi, ... The Lancet 400 (10349), 359-368, 2022 | 236 | 2022 |
| Laser textured surface gradients A Dunn, TJ Wasley, J Li, RW Kay, J Stringer, PJ Smith, E Esenturk, ... Applied Surface Science 371, 583-589, 2016 | 110 | 2016 |
| Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing J Li, T Monaghan, TT Nguyen, RW Kay, RJ Friel, RA Harris Composites Part B: Engineering 113, 342-354, 2017 | 102 | 2017 |
| Hybrid additive manufacturing of 3D electronic systems J Li, T Wasley, TT Nguyen, VD Ta, JD Shephard, J Stringer, P Smith, ... Journal of Micromechanics and Microengineering 26 (10), 105005, 2016 | 70 | 2016 |
| A review of stencil printing for microelectronic packaging R Kay, M Desmulliez Soldering & Surface Mount Technology 24 (1), 38-50, 2012 | 61 | 2012 |
| A rapid photopatterning method for selective plating of 2D and 3D microcircuitry on polyetherimide J Marques‐Hueso, TDA Jones, DE Watson, A Ryspayeva, MN Esfahani, ... Advanced Functional Materials 28 (6), 1704451, 2018 | 46 | 2018 |
| Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality J Stringer, TM Althagathi, CCW Tse, VD Ta, JD Shephard, E Esenturk, ... EDP Open, 2016 | 46 | 2016 |
| Dynamically controlled deposition of colloidal nanoparticle suspension in evaporating drops using laser radiation VD Ta, RM Carter, E Esenturk, C Connaughton, TJ Wasley, J Li, RW Kay, ... Soft Matter 12 (20), 4530-4536, 2016 | 43 | 2016 |
| Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process RW Kay, S Stoyanov, GP Glinski, C Bailey, MPY Desmulliez IEEE Transactions on Components and packaging technologies 30 (1), 129-136, 2007 | 42 | 2007 |
| Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications GJ Jackson, MW Hendriksen, RW Kay, M Desmulliez, RK Durairaj, ... Soldering & Surface Mount Technology 17 (1), 24-32, 2005 | 31 | 2005 |
| Additively manufactured heterogeneous substrates for three‐dimensional control of local permittivity J Tribe, WG Whittow, RW Kay, JC Vardaxoglou Electronics Letters 50 (10), 745-746, 2014 | 30 | 2014 |
| A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications A Ryspayeva, TDA Jones, MN Esfahani, MP Shuttleworth, RA Harris, ... Microelectronic Engineering 209, 35-40, 2019 | 29 | 2019 |
| Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation S Costello, N Strusevich, D Flynn, RW Kay, MK Patel, C Bailey, D Price, ... Microsystem technologies 19, 783-790, 2013 | 29 | 2013 |
| Electrohydrodynamic and aerosol jet printing for the copatterning of polydimethylsiloxane and graphene platelet inks NJ Wilkinson, RW Kay, RA Harris Advanced Materials Technologies 5 (6), 2000148, 2020 | 25 | 2020 |
| Optimization and characterization of drop-on-demand inkjet printing process for platinum organometallic inks G Cummins, R Kay, J Terry, MPY Desmulliez, AJ Walton 2011 IEEE 13th Electronics Packaging Technology Conference, 256-261, 2011 | 25 | 2011 |
| Selective electroless copper deposition by using photolithographic polymer/Ag nanocomposite A Ryspayeva, TDA Jones, MN Esfahani, MP Shuttleworth, RA Harris, ... IEEE Transactions on Electron Devices 66 (4), 1843-1848, 2019 | 24 | 2019 |
| Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys RW Kay, E De Gourcuff, MPY Desmulliez, GJ Jackson, HAH Steen, C Liu, ... Proceedings Electronic Components and Technology, 2005. ECTC'05., 848-854, 2005 | 23 | 2005 |
Marc DesmulliezHeriot-Watt University, School of Engineering & Physical Sciences, Edinburgh EH14 4AS在 hw.ac.uk 的电子邮件经过验证
