| Introduction of discrete phase model (DPM) in fluid flow: a review NM Zahari, MH Zawawi, LM Sidek, D Mohamad, Z Itam, MZ Ramli, ... AIP Conference Proceedings 2030 (1), 2018 | 73 | 2018 |
| Effects of the preheat layer thickness on surface/submerged flame during porous media combustion of micro burner AA Janvekar, MA Miskam, A Abas, ZA Ahmad, T Juntakan, MZ Abdullah Energy 122, 103-110, 2017 | 73 | 2017 |
| Lattice Boltzmann method study of bga bump arrangements on void formation A Abas, MHH Ishak, MZ Abdullah, FC Ani, SF Khor Microelectronics Reliability 56, 170-181, 2016 | 45 | 2016 |
| Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches FC Ng, A Abas, MZ Abdullah Microelectronics Reliability 81, 41-63, 2018 | 36 | 2018 |
| Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings FC Ng, A Abas, ZL Gan, MZ Abdullah, FC Ani, MYT Ali Microelectronics Reliability 72, 45-64, 2017 | 36 | 2017 |
| Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process A Abas, MS Haslinda, MHH Ishak, AS Nurfatin, MZ Abdullah, FC Ani Microelectronic Engineering 163, 83-97, 2016 | 36 | 2016 |
| SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ... Soldering & Surface Mount Technology 30 (1), 1-13, 2018 | 35 | 2018 |
| Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array FC Ng, A Abas, MHH Ishak, MZ Abdullah, A Aziz Microelectronics Reliability 66, 143-160, 2016 | 34 | 2016 |
| Underfill flow in flip-chip encapsulation process: a review FC Ng, MA Abas Journal of Electronic Packaging 144 (1), 010803, 2022 | 24 | 2022 |
| Numerical study of composite fiberglass cross arms under statics loading and improvement with sleeve installation D Mohamad, A Syamsir, S Beddu, A Abas, FC Ng, MF Razali, S Seman IOP Conference Series: Materials Science and Engineering 530 (1), 012027, 2019 | 24 | 2019 |
| Regional segregation with spatial considerations-based analytical filling time model for non-Newtonian power-law underfill fluid in flip-chip encapsulation FC Ng, A Abas, MZ Abdullah Journal of Electronic Packaging 141 (4), 041009, 2019 | 23 | 2019 |
| Characterization of SAC–x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly F Che Ani, A Jalar, AA Saad, CY Khor, MA Abas, Z Bachok, NK Othman Soldering & Surface Mount Technology 31 (2), 109-124, 2019 | 23 | 2019 |
| Lattice Boltzmann method of different BGA orientations on I-type dispensing method A Abas, ZL Gan, MHH Ishak, MZ Abdullah, SF Khor PloS one 11 (7), e0159357, 2016 | 23 | 2016 |
| Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA A Abas, FC Ng, ZL Gan, MHH Ishak, MZ Abdullah, GY Chong Sādhanā 43, 1-14, 2018 | 22 | 2018 |
| Numerical simulation on the statics deformation study of composite cross arms of different materials and configurations D Mohamad, A Syamsir, Z Itam, HA Bakar, A Abas, FC Ng, MF Razali, ... IOP Conference Series: Materials Science and Engineering 530 (1), 012028, 2019 | 21 | 2019 |
| Effect of laminate properties on the failure of cross arm structure under multi-axial load D Mohamad, A Syamsir, S Beddu, NLM Kamal, MM Zainoodin, MF Razali, ... IOP Conference Series: Materials Science and Engineering 530 (1), 012029, 2019 | 21 | 2019 |
| The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ... The International Journal of Advanced Manufacturing Technology 96, 717-733, 2018 | 21 | 2018 |
| CUF scaling effect on contact angle and threshold pressure FC Ng, MA Abas, MZ Abdullah, MHH Ishak, GY Chong Soldering & Surface Mount Technology 29 (4), 173-190, 2017 | 21 | 2017 |
| Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process MHH Ishak, MZ Abdullah, A Abas Microelectronics reliability 65, 205-216, 2016 | 21 | 2016 |
| Effect of different stent configurations using Lattice Boltzmann method and particles image velocimetry on artery bifurcation aneurysm problem NH Mokhtar, A Abas, NA Razak, MNA Hamid, SL Teong Journal of theoretical biology 433, 73-84, 2017 | 20 | 2017 |
