| Characterization of HYPRES'4.5 kA/cm/sup 2/& 8 kA/cm/sup 2/Nb/AlO/sub x//Nb fabrication processes D Yohannes, S Sarwana, SK Tolpygo, A Sahu, YA Polyakov, ... IEEE Transactions on Applied Superconductivity 15 (2), 90-93, 2005 | 94 | 2005 |
| 20 Process Development for Superconducting Integrated Circuits With 80 GHz Clock Frequency SK Tolpygo, D Yohannes, RT Hunt, JA Vivalda, D Donnelly, D Amparo, ... IEEE transactions on applied superconductivity 17 (2), 946-951, 2007 | 85 | 2007 |
| System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits SK Tolpygo, D Amparo, R Hunt, J Vivalda, D Yohannes US Patent 8,437,818, 2013 | 58 | 2013 |
| ERSFQ 8-bit parallel adders as a process benchmark AF Kirichenko, IV Vernik, JA Vivalda, RT Hunt, DT Yohannes IEEE Transactions on Applied Superconductivity 25 (3), 1-5, 2014 | 48 | 2014 |
| Cryogenic memory architecture integrating spin Hall effect based magnetic memory and superconductive cryotron devices MH Nguyen, GJ Ribeill, MV Gustafsson, S Shi, SV Aradhya, AP Wagner, ... Scientific reports 10 (1), 248, 2020 | 47 | 2020 |
| System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits SK Tolpygo, D Amparo, R Hunt, J Vivalda, D Yohannes US Patent 8,301,214, 2012 | 41 | 2012 |
| Parametric testing of HYPRES superconducting integrated circuit fabrication processes D Yohannes, A Kirichenko, S Sarwana, SK Tolpygo IEEE transactions on applied superconductivity 17 (2), 181-186, 2007 | 38 | 2007 |
| Planarized, extendible, multilayer fabrication process for superconducting electronics DT Yohannes, RT Hunt, JA Vivalda, D Amparo, A Cohen, IV Vernik, ... IEEE Transactions on Applied Superconductivity 25 (3), 1-5, 2014 | 33 | 2014 |
| Superconductor digital receiver components A Kirichenko, S Sarwana, D Gupta, D Yohannes IEEE transactions on applied superconductivity 15 (2), 249-254, 2005 | 32 | 2005 |
| Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit D Yohannes, AF Kirichenko, J Vivalda, R Hunt US Patent 9,741,918, 2017 | 30 | 2017 |
| Plasma process-induced damage to Josephson tunnel junctions in superconducting integrated circuits SK Tolpygo, D Amparo, A Kirichenko, D Yohannes Superconductor Science and Technology 20 (11), S341, 2007 | 28 | 2007 |
| Characterization of transition edge sensors for the Simons observatory JR Stevens, NF Cothard, EM Vavagiakis, A Ali, K Arnold, JE Austermann, ... Journal of Low Temperature Physics 199, 672-680, 2020 | 19 | 2020 |
| Diffusion stop-layers for superconducting integrated circuits and qubits with Nb-based Josephson junctions SK Tolpygo, D Amparo, RT Hunt, JA Vivalda, DT Yohannes IEEE transactions on applied superconductivity 21 (3), 119-125, 2010 | 19 | 2010 |
| Process-Induced Variability ofJunctions in Superconductor IntegratedCircuits and Protection Against It SK Tolpygo, D Amparo, DT Yohannes, M Meckbach, AF Kirichenko IEEE transactions on applied superconductivity 19 (3), 135-139, 2009 | 18 | 2009 |
| Development toward high-speed integrated circuits and SQUID qubits with Nb/AlO/sub x//Nb Josephson junctions W Chen, V Patel, SK Tolpygo, D Yohannes, S Pottorf, JE Lukens IEEE transactions on applied superconductivity 13 (2), 103-106, 2003 | 16 | 2003 |
| Multi- (Josephson Critical Current Density) Process for Superconductor Integrated Circuits DT Yohannes, A Inamdar, SK Tolpygo IEEE transactions on applied superconductivity 19 (3), 149-153, 2009 | 14 | 2009 |
| Subgap Leakage in - Josephson Junctions and Run-to-Run Reproducibility: Effects of Oxidation Chamber and Film Stress SK Tolpygo, DJC Amparo, RT Hunt, JA Vivalda, DT Yohannes IEEE transactions on applied superconductivity 23 (3), 1100305-1100305, 2012 | 13 | 2012 |
| Critical current gain in high-jc superconducting-ferromagnetic transistors IP Nevirkovets, SE Shafraniuk, O Chernyashevskyy, DT Yohannes, ... IEEE Transactions on Applied Superconductivity 26 (8), 1-7, 2016 | 10 | 2016 |
| System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits SK Tolpygo, D Amparo, R Hunt, J Vivalda, D Yohannes US Patent 9,130,116, 2015 | 10 | 2015 |
| Commercially fabricated antenna-coupled transition edge sensor bolometer detectors for next-generation cosmic microwave background polarimetry experiment A Suzuki, N Cothard, AT Lee, MD Niemack, C Raum, M Renzullo, T Sasse, ... Journal of Low Temperature Physics 199, 1158-1166, 2020 | 9 | 2020 |
Sergey K. TolpygoLincoln Laboratory, Massachusetts Institute of Technology在 ll.mit.edu 的电子邮件经过验证
