| Printed electronics for extreme high temperature environments M Alhendi, F Alshatnawi, EM Abbara, R Sivasubramony, G Khinda, ... Additive Manufacturing 54, 102709, 2022 | 40 | 2022 |
| Assessing Current‐Carrying Capacity of Aerosol Jet Printed Conductors M Alhendi, RS Sivasubramony, DL Weerawarne, J Iannotti, P Borgesen, ... Advanced Engineering Materials 22 (11), 2000520, 2020 | 26 | 2020 |
| Isothermal fatigue of interconnections in flexible hybrid electronics based human performance monitors RS Sivasubramony, N Adams, M Alhendi, GS Khinda, MZ Kokash, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 896-903, 2018 | 22 | 2018 |
| Flexible inkjet-printed Patch antenna array on mesoporous PET substrate for 5G applications with stable RF performance after mechanical stress cycling GS Khinda, A Umar, RJ Cadwell, M Alhendi, NC Stoffel, P Borgesen, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1824-1831, 2020 | 19 | 2020 |
| Effects of oven and laser sintering parameters on the electrical resistance of ijp nano-silver traces on mesoporous pet before and during fatigue cycling GS Khinda, MZ Kokash, M Alhendi, M Yadav, JP Lombardi, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1946-1951, 2019 | 18 | 2019 |
| Evaluation of an anisotropic conductive epoxy for interconnecting highly stretchable conductors to various surfaces R Al-Haidari, B Garakani, M Alhendi, US Somarathna, MD Poliks, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1422-1429, 2022 | 15 | 2022 |
| A study of electromechanical behaviors of printed conductive leads on stretchable textiles for smart clothing KUS Somarathna, B Garakani, M Alhendi, E Enakerakpo, P Borgesen, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2157-2166, 2020 | 14 | 2020 |
| Effect of substrate properties on isothermal fatigue of aerosol jet printed nano-Ag traces on flex R Muralidharan, A Raj, RS Sivasubramony, M Yadav, M Alhendi, ... Journal of Materials Research 34 (16), 2903-2910, 2019 | 12 | 2019 |
| A simulation-optimisation approach for production control strategies in perishable food supply chains A Gailan Qasem, F Aqlan, A Shamsan, M Alhendi Journal of Simulation 17 (2), 211-227, 2023 | 11 | 2023 |
| High Temperature Die Interconnection Approaches F Alshatnawi, M Alhendi, RA Al-Haidari, RS Sivasubramony, EM Abbara, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1539-1545, 2022 | 11 | 2022 |
| Fully additive manufacturing of passive circuit elements using aerosol jet printing E Enakerakpo, M Alhendi, GS Khinda, B Garakani, KUS Somarathna, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1138-1143, 2021 | 11 | 2021 |
| Fatigue cycling of electrical interconnects dispensed on flexible substrate M Alhendi, JP Lombardi III, GS Khinda, MZ Kokash, DL Weerawarne, ... International Symposium on Microelectronics 2018 (1), 000543-000548, 2018 | 11 | 2018 |
| Performance evaluation of RF novel microstrip lines printed on flexible substrates AS Obeidat, M Alhendi, MY Abdelatty, A Umar, E Enakerakpo, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1471-1477, 2023 | 10 | 2023 |
| Effects of process parameters and isothermal fatigue cycling on electromechanical properties of screen-printed interconnect on nonwovens for wearable electronics B Garakani, KUS Somarathna, GS Khinda, E Enakerakpo, M Alhendi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2167-2174, 2020 | 10 | 2020 |
| Development of next generation stretchable materials for flexible hybrid electronics (FHE) SM Ramkumar, A Stemmermann, BM Rajan, I Quelhas, M Alhendi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 829-834, 2020 | 10 | 2020 |
| Robustness and reliability of novel anisotropic conductive epoxy for stretchable wearable electronics A Stennermann, D Balder, M Stennermann, C Tabor, N Stoffel, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 762-768, 2022 | 8 | 2022 |
| A comparative study of aerosol jet printing on polyimide and liquid crystal polymer substrates for RF applications M Alhendi, A Umar, EM Abbara, R Cadwell, N Huang, DL Weerawarne, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1579-1585, 2020 | 7 | 2020 |
| Laser sintering of aerosol jet printed conductive interconnects on paper substrate M Alhendi, RS Sivasubramony, J Lombardi, DL Weerawarne, P Borgesen, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1581-1587, 2019 | 7 | 2019 |
| Aging and fatigue of aerosol jet-printed nano-Ag traces on flexible substrate A Raj, RS Sivasubramony, M Yadav, S Thekkut, GS Khinda, M Alhendi, ... Journal of Electronic Packaging 143 (2), 021006, 2021 | 6 | 2021 |
| Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing R Al-Haidari, M Alhendi, D Richmond, EM Abbara, A Obeidat, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 668-675, 2023 | 5 | 2023 |
Mark D PoliksSUNY Distinguished Professor, State University of New York at Binghamton在 binghamton.edu 的电子邮件经过验证
