| Handbook of silicon based MEMS materials and technologies M Tilli, M Paulasto-Kröckel, M Petzold, H Theuss, T Motooka, V Lindroos Elsevier, 2020 | 679 | 2020 |
| The influence of different fluoride compounds and treatment conditions on dental enamel: a descriptive in vitro study of the CaF2 precipitation and microstructure M Petzold Caries research 35 (Suppl. 1), 45-51, 2001 | 179 | 2001 |
| On the intermetallic corrosion of Cu-Al wire bonds T Boettcher, M Rother, S Liedtke, M Ullrich, M Bollmann, A Pinkernelle, ... 2010 12th Electronics Packaging Technology Conference, 585-590, 2010 | 107 | 2010 |
| Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology B Boettge, J Braeuer, M Wiemer, M Petzold, J Bagdahn, T Gessner Journal of Micromechanics and Microengineering 20 (6), 064018, 2010 | 85 | 2010 |
| Claudin‐16 deficiency impairs tight junction function in ameloblasts, leading to abnormal enamel formation C Bardet, F Courson, Y Wu, M Khaddam, B Salmon, S Ribes, J Thumfart, ... Journal of Bone and Mineral Research 31 (3), 498-513, 2016 | 64 | 2016 |
| Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy S Brand, P Czurratis, P Hoffrogge, M Petzold Microelectronics Reliability 50 (9-11), 1469-1473, 2010 | 58 | 2010 |
| 3D sensor application with open through silicon via technology J Kraft, F Schrank, J Teva, J Siegert, G Koppitsch, C Cassidy, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 560-566, 2011 | 53 | 2011 |
| Extending acoustic microscopy for comprehensive failure analysis applications S Brand, P Czurratis, P Hoffrogge, D Temple, D Malta, J Reed, M Petzold Journal of Materials Science: Materials in Electronics 22, 1580-1593, 2011 | 45 | 2011 |
| Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs D Malta, C Gregory, M Lueck, D Temple, M Krause, F Altmann, M Petzold, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1815-1821, 2011 | 42 | 2011 |
| Strain relaxation in nanopatterned strained silicon round pillars C Himcinschi, R Singh, I Radu, AP Milenin, W Erfurth, M Reiche, U Gösele, ... Applied physics letters 90 (2), 2007 | 42 | 2007 |
| Mechanical fatigue properties of heavy aluminium wire bonds for power applications L Merkle, T Kaden, M Sonner, A Gademann, J Turki, C Dresbach, ... 2008 2nd Electronics System-Integration Technology Conference, 1363-1368, 2008 | 41 | 2008 |
| Application of atomic force microscopy for microindentation testing M Petzold, J Landgraf, M Füting, JM Olaf Thin Solid Films 264 (2), 153-158, 1995 | 41 | 1995 |
| Surface oxide films on Aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness M Petzold, L Berthold, D Katzer, H Knoll, D Memhard, P Meier, KD Lang Microelectronics Reliability 40 (8-10), 1515-1520, 2000 | 40 | 2000 |
| Fracture toughness and fatigue investigations of polycrystalline silicon J Bagdahn, J Schischka, M Petzold, WN Sharpe Jr Reliability, testing, and characterization of MEMS/MOEMS 4558, 159-168, 2001 | 34 | 2001 |
| Innovative failure analysis techniques for 3-D packaging developments F Altmann, M Petzold IEEE Design & Test 33 (3), 46-55, 2016 | 33 | 2016 |
| Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies S Brand, A Lapadatu, T Djuric, P Czurratis, J Schischka, M Petzold Journal of Micro/Nanolithography, MEMS, and MOEMS 13 (1), 011207-011207, 2014 | 33 | 2014 |
| Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution M Krause, F Altmann, C Schmidt, M Petzold, D Malta, D Temple 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1452-1458, 2011 | 27 | 2011 |
| Micro structure analysis for system in package components―Novel tools for fault isolation, target preparation, and high-resolution material diagnostics M Petzold, F Altmann, M Krause, R Salzer, C Schmidt, S Martens, W Mack, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 27 | 2010 |
| Strength assessment of wafer-bonded micromechanical components using the micro-chevron test M Petzold, H Knoll, J Bagdahn Reliability, Testing, and Characterization of MEMS/MOEMS 4558, 133-142, 2001 | 26 | 2001 |
| Characterization of directly bonded silicon wafers by means of the double cantilever crack opening method J Bagdahn, M Petzold, M Reiche, K Gutjahr Proceedings of the Fourth International Symposium on Semiconductor Wafer …, 1998 | 25 | 1998 |
