| An instrumented indentation technique for estimating fracture toughness of ductile materials: A critical indentation energy model based on continuum damage mechanics JS Lee, J Jang, BW Lee, Y Choi, SG Lee, D Kwon Acta Materialia 54 (4), 1101-1109, 2006 | 179 | 2006 |
| Quantitative determination of contact depth during spherical indentation of metallic materials—A FEM study SH Kim, BW Lee, Y Choi, D Kwon Materials Science and Engineering: A 415 (1-2), 59-65, 2006 | 138 | 2006 |
| Embedded actives and discrete passives in a cavity within build-up layers BW Lee, C Yoon, V Sundaram, R Tummala US Patent 8,335,084, 2012 | 134 | 2012 |
| Effects of microstructural change on fracture characteristics in coarse-grained heat-affected zones of QLT-processed 9% Ni steel J Jang, JB Ju, BW Lee, D Kwon, WS Kim Materials Science and Engineering: A 340 (1-2), 68-79, 2003 | 112 | 2003 |
| Influence of tip bluntness on the size-dependent nanoindentation hardness JY Kim, BW Lee, DT Read, D Kwon Scripta materialia 52 (5), 353-358, 2005 | 81 | 2005 |
| Determining representative stress and representative strain in deriving indentation flow curves based on finite element analysis EC Jeon, MK Baik, SH Kim, BW Lee, DI Kwon Key Engineering Materials 297, 2152-2157, 2005 | 50 | 2005 |
| Nitride semiconductor based power converting device J Woo-Chul, BW Lee, JK Shin, J Oh US Patent 9,082,693, 2015 | 44 | 2015 |
| Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications F Liu, V Sundaram, S Min, V Sridharan, H Chan, N Kumbhat, BW Lee, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 36 | 2010 |
| Evaluation of fracture toughness using small notched specimens BW Lee, J Jang, D Kwon Materials Science and Engineering: A 334 (1-2), 207-214, 2002 | 35 | 2002 |
| Chip-last embedded active for system-on-package (SOP) BW Lee, V Sundaram, B Wiedenman, CK Yoon, V Kripesh, M Iyer, ... 2007 Proceedings 57th Electronic Components and Technology Conference, 292-298, 2007 | 32 | 2007 |
| Multilayer laminate package and method of manufacturing the same BW Lee, JH Lim, SW Booh US Patent 8,872,041, 2014 | 31 | 2014 |
| Experimental analysis of the practical LBZ effects on the brittle fracture performance of cryogenic steel HAZs with respect to crack arrest toughness near fusion line J Jang, BW Lee, JB Ju, D Kwon, W Kim Engineering Fracture Mechanics 70 (10), 1245-1257, 2003 | 31 | 2003 |
| Tailoring of temperature coefficient of capacitance (TCC) in nanocomposite capacitors BW Lee, IR Abothu, PM Raj, CK Yoon, RR Tummala Scripta materialia 54 (7), 1231-1234, 2006 | 27 | 2006 |
| Folded stacked package and method of manufacturing the same BW Lee US Patent 8,861,205, 2014 | 26 | 2014 |
| Determination of microstructural criterion for cryogenic toughness variation in actual HAZs using microstructure-distribution maps J Jang, JS Lee, JB Ju, BW Lee, D Kwon, WS Kim Materials Science and Engineering: A 351 (1-2), 183-189, 2003 | 26 | 2003 |
| Semiconductor device package including bonding layer having Ag3Sn JW Yoon, BW Lee, SW Booh, C Jeong US Patent 9,520,377, 2016 | 24 | 2016 |
| Deformation characteristics of electroplated MEMS cantilever beams released by plasma ashing TJ Kang, JG Kim, JH Kim, KC Hwang, BW Lee, CW Baek, YK Kim, ... Sensors and actuators a: physical 148 (2), 407-415, 2008 | 23 | 2008 |
| Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages BW Lee, W Jang, DW Kim, J Jeong, JW Nah, KW Paik, D Kwon Materials Science and Engineering: A 380 (1-2), 231-236, 2004 | 21 | 2004 |
| Leakage current analysis of hydrothermal BaTiO3 thin films PM Raj, BW Lee, D Balaraman, RR Tummala Journal of electroceramics 27, 169-175, 2011 | 18 | 2011 |
| Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materials BW Lee, M Pulugurtha, C Yoon, R Tummala, I Abothu, S Bhattacharya US Patent App. 11/429,780, 2006 | 16 | 2006 |
