The complete genome sequence of the Gram-positive bacterium Bacillus subtilis FJ Kunst, N Ogasawara, I Moszer, AM Albertini, G Alloni, V Azevedo, ... Nature 390 (6657), 249-256, 1997 | 4801 | 1997 |
Essential Bacillus subtilis genes K Kobayashi, SD Ehrlich, A Albertini, G Amati, KK Andersen, M Arnaud, ... Proceedings of the National Academy of Sciences 100 (8), 4678-4683, 2003 | 1733 | 2003 |
Scaling theory for double-gate SOI MOSFET's K Suzuki, T Tanaka, Y Tosaka, H Horie, Y Arimoto IEEE Transactions on Electron Devices 40 (12), 2326-2329, 1993 | 717 | 1993 |
Efficacy of catheter-based renal denervation in the absence of antihypertensive medications (SPYRAL HTN-OFF MED Pivotal): a multicentre, randomised, sham-controlled trial M Böhm, K Kario, DE Kandzari, F Mahfoud, MA Weber, RE Schmieder, ... The Lancet 395 (10234), 1444-1451, 2020 | 484 | 2020 |
High-density through silicon vias for 3-D LSIs M Koyanagi, T Fukushima, T Tanaka Proceedings of the IEEE 97 (1), 49-59, 2009 | 375 | 2009 |
A comparative study of advanced MOSFET concepts CH Wann, K Noda, T Tanaka, M Yoshida, C Hu IEEE Transactions on Electron Devices 43 (10), 1742-1753, 1996 | 302 | 1996 |
Three-dimensional integration technology based on wafer bonding with vertical buried interconnections M Koyanagi, T Nakamura, Y Yamada, H Kikuchi, T Fukushima, T Tanaka, ... IEEE Transactions on Electron Devices 53 (11), 2799-2808, 2006 | 282 | 2006 |
Dental pulp cells for induced pluripotent stem cell banking N Tamaoki, K Takahashi, T Tanaka, T Ichisaka, H Aoki, ... Journal of dental research 89 (8), 773-778, 2010 | 274 | 2010 |
Three-dimensional integration technology and integrated systems M Koyanagi, T Fukushima, T Tanaka 2009 Asia and South Pacific Design Automation Conference, 409-415, 2009 | 266 | 2009 |
A capacitorless 1T-DRAM technology using gate-induced drain-leakage (GIDL) current for low-power and high-speed embedded memory E Yoshida, T Tanaka IEEE Transactions on Electron Devices 53 (4), 692-697, 2006 | 209 | 2006 |
Theory and optimum design of PM Vernier motor A Ishizaki, T Tanaka, K Takasaki, S Nishikata 1995 Seventh International Conference on Electrical Machines and Drives …, 1995 | 208 | 1995 |
Scalability study on a capacitorless 1T-DRAM: From single-gate PD-SOI to double-gate FinDRAM T Tanaka, E Yoshida, T Miyashita IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004 | 155 | 2004 |
Memory cell array, method of producing the same, and semiconductor memory device using the same E Yoshida, T Tanaka, T Miyashita US Patent 7,671,417, 2010 | 153 | 2010 |
Behavioral response to humans in individually handled weanling pigs H Tanida, A Miura, T Tanaka, T Yoshimoto Applied Animal Behaviour Science 42 (4), 249-259, 1995 | 139 | 1995 |
Three-dimensional hybrid integration technology of CMOS, MEMS, and photonics circuits for optoelectronic heterogeneous integrated systems KW Lee, A Noriki, K Kiyoyama, T Fukushima, T Tanaka, M Koyanagi IEEE Transactions on Electron Devices 58 (3), 748-757, 2010 | 129 | 2010 |
DNA typing of HLA class II genes (HLA‐DR,‐DQ and‐DP) in Japanese patients with histiocytic necrotizing lymphadenitis (Kikuchi’s disease) T Tanaka, M Ohmori, S Yasunaga, K Ohshima, M Kikuchi, T Sasazuki Tissue Antigens 54 (3), 246-253, 1999 | 124 | 1999 |
New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique T Fukushima, H Kikuchi, Y Yamada, T Konno, J Liang, K Sasaki, ... 2007 IEEE International Electron Devices Meeting, 985-988, 2007 | 123 | 2007 |
Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias M Murugesan, H Kino, H Nohira, JC Bea, A Horibe, F Yamada, ... 2010 International Electron Devices Meeting, 2.3. 1-2.3. 4, 2010 | 119 | 2010 |
Ultrafast operation of V/sub th/-adjusted p/sup+/-n/sup+/double-gate SOI MOSFET's T Tanaka, K Suzuki, H Horie, T Sugii IEEE Electron Device Letters 15 (10), 386-388, 1994 | 113 | 1994 |
Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits T Fukushima, E Iwata, T Konno, JC Bea, KW Lee, T Tanaka, M Koyanagi Applied Physics Letters 96 (15), 2010 | 101 | 2010 |