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Tetsu TANAKA
Tetsu TANAKA
Tohoku University (2005-), Fujitsu laboratories (1990-2005)
在 lbc.mech.tohoku.ac.jp 的电子邮件经过验证 - 首页
标题
引用次数
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年份
The complete genome sequence of the Gram-positive bacterium Bacillus subtilis
FJ Kunst, N Ogasawara, I Moszer, AM Albertini, G Alloni, V Azevedo, ...
Nature 390 (6657), 249-256, 1997
48011997
Essential Bacillus subtilis genes
K Kobayashi, SD Ehrlich, A Albertini, G Amati, KK Andersen, M Arnaud, ...
Proceedings of the National Academy of Sciences 100 (8), 4678-4683, 2003
17332003
Scaling theory for double-gate SOI MOSFET's
K Suzuki, T Tanaka, Y Tosaka, H Horie, Y Arimoto
IEEE Transactions on Electron Devices 40 (12), 2326-2329, 1993
7171993
Efficacy of catheter-based renal denervation in the absence of antihypertensive medications (SPYRAL HTN-OFF MED Pivotal): a multicentre, randomised, sham-controlled trial
M Böhm, K Kario, DE Kandzari, F Mahfoud, MA Weber, RE Schmieder, ...
The Lancet 395 (10234), 1444-1451, 2020
4842020
High-density through silicon vias for 3-D LSIs
M Koyanagi, T Fukushima, T Tanaka
Proceedings of the IEEE 97 (1), 49-59, 2009
3752009
A comparative study of advanced MOSFET concepts
CH Wann, K Noda, T Tanaka, M Yoshida, C Hu
IEEE Transactions on Electron Devices 43 (10), 1742-1753, 1996
3021996
Three-dimensional integration technology based on wafer bonding with vertical buried interconnections
M Koyanagi, T Nakamura, Y Yamada, H Kikuchi, T Fukushima, T Tanaka, ...
IEEE Transactions on Electron Devices 53 (11), 2799-2808, 2006
2822006
Dental pulp cells for induced pluripotent stem cell banking
N Tamaoki, K Takahashi, T Tanaka, T Ichisaka, H Aoki, ...
Journal of dental research 89 (8), 773-778, 2010
2742010
Three-dimensional integration technology and integrated systems
M Koyanagi, T Fukushima, T Tanaka
2009 Asia and South Pacific Design Automation Conference, 409-415, 2009
2662009
A capacitorless 1T-DRAM technology using gate-induced drain-leakage (GIDL) current for low-power and high-speed embedded memory
E Yoshida, T Tanaka
IEEE Transactions on Electron Devices 53 (4), 692-697, 2006
2092006
Theory and optimum design of PM Vernier motor
A Ishizaki, T Tanaka, K Takasaki, S Nishikata
1995 Seventh International Conference on Electrical Machines and Drives …, 1995
2081995
Scalability study on a capacitorless 1T-DRAM: From single-gate PD-SOI to double-gate FinDRAM
T Tanaka, E Yoshida, T Miyashita
IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004
1552004
Memory cell array, method of producing the same, and semiconductor memory device using the same
E Yoshida, T Tanaka, T Miyashita
US Patent 7,671,417, 2010
1532010
Behavioral response to humans in individually handled weanling pigs
H Tanida, A Miura, T Tanaka, T Yoshimoto
Applied Animal Behaviour Science 42 (4), 249-259, 1995
1391995
Three-dimensional hybrid integration technology of CMOS, MEMS, and photonics circuits for optoelectronic heterogeneous integrated systems
KW Lee, A Noriki, K Kiyoyama, T Fukushima, T Tanaka, M Koyanagi
IEEE Transactions on Electron Devices 58 (3), 748-757, 2010
1292010
DNA typing of HLA class II genes (HLA‐DR,‐DQ and‐DP) in Japanese patients with histiocytic necrotizing lymphadenitis (Kikuchi’s disease)
T Tanaka, M Ohmori, S Yasunaga, K Ohshima, M Kikuchi, T Sasazuki
Tissue Antigens 54 (3), 246-253, 1999
1241999
New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique
T Fukushima, H Kikuchi, Y Yamada, T Konno, J Liang, K Sasaki, ...
2007 IEEE International Electron Devices Meeting, 985-988, 2007
1232007
Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias
M Murugesan, H Kino, H Nohira, JC Bea, A Horibe, F Yamada, ...
2010 International Electron Devices Meeting, 2.3. 1-2.3. 4, 2010
1192010
Ultrafast operation of V/sub th/-adjusted p/sup+/-n/sup+/double-gate SOI MOSFET's
T Tanaka, K Suzuki, H Horie, T Sugii
IEEE Electron Device Letters 15 (10), 386-388, 1994
1131994
Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits
T Fukushima, E Iwata, T Konno, JC Bea, KW Lee, T Tanaka, M Koyanagi
Applied Physics Letters 96 (15), 2010
1012010
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