| Microsphere-assisted, nanospot, non-destructive metrology for semiconductor devices S Kwon, J Park, K Kim, Y Cho, M Lee Light: Science & Applications 11 (1), 32, 2022 | 41 | 2022 |
| Volumetric thin film thickness measurement using spectroscopic imaging reflectometer and compensation of reflectance modeling error K Kim, S Kim, S Kwon, HJ Pahk International Journal of Precision Engineering and Manufacturing 15, 1817-1822, 2014 | 31 | 2014 |
| Fast analysis of film thickness in spectroscopic reflectometry using direct phase extraction K Kim, S Kwon, HJ Pahk Current Optics and Photonics 1 (1), 29-33, 2017 | 27 | 2017 |
| Critical dimension measurement of transparent film layers by multispectral imaging S Kwon, N Kim, T Jo, HJ Pahk Optics Express 22 (14), 17370-17381, 2014 | 14 | 2014 |
| Correction of PZT scanner errors using a phase compensation method in white-light phase-shifting interferometry N Kim, S Kwon Applied Optics 60 (30), 9311-9318, 2021 | 6 | 2021 |
| Microsphere-assisted ultra-small spot spectral reflectometry technique for semiconductor device metrology S Kwon, K Kim, J Park, Y Cho, M Lee Metrology, Inspection, and Process Control for Semiconductor Manufacturing …, 2021 | 4 | 2021 |
| Spectroscopic measuring apparatus and method, and method for fabricating semiconductor device using the measuring method K Kim, S Kwon, J Park, CHO Yunje US Patent 11,320,259, 2022 | 1 | 2022 |
| Microsphere-assisted hyperspectral imaging: super-resolution, non-destructive metrology for semiconductor devices J Park, Y Choi, S Kwon, Y Lee, J Kim, J Kim, J Lee, J Ahn, H Kwak, ... Light: Science & Applications 13 (1), 122, 2024 | | 2024 |
| Snapshot Mueller spectropolarimeter imager T Dai, T Phan, EW Wang, S Kwon, J Son, M Lee, JA Fan Microsystems & Nanoengineering 9 (1), 125, 2023 | | 2023 |
| Microsphere-assisted Hybrid Spectroscopic Reflectometry Using Hyperspectral Imaging for Nanospot 3D Semiconductor Metrology S Kwon, J Park, Y Choi, K Kim, J Kim, Y Lee, M Lee, C Choi CLEO: Applications and Technology, AM2M. 4, 2023 | | 2023 |
| Method for measuring thin film thickness K Kim, S Kwon, HJ Pahk KR Patent 101,655,096, 2016 | | 2016 |
| Method and Apparatus for measuring thickness using color camera K Kim, S Kwon, J Kim, H Pahk KR Patent 101,650,319, 2016 | | 2016 |
| Focus control method for spectroscopic measuring apparatus, inspection method for semiconductor device, and spectroscopic measuring apparatus for performing the same Y Choi, S Kwon, K Kim, J Kim, J Park, M Lee US Patent App. 18/340,394, 0 | | |
| Apparatus for inspecting substrate and method for fabricating semiconductor device using the same J Park, S Kwon, K Kim, M Lee, S Jang US Patent App. 17/684,052, 0 | | |
Taeyong JoSeoul National University在 samsung.com 的电子邮件经过验证
Taeyong JoSeoul National University在 samsung.com 的电子邮件经过验证
Jang Ryul ParkKAIST在 kaist.ac.kr 的电子邮件经过验证