| Microscopic lock-in thermography investigation of leakage sites in integrated circuits O Breitenstein, M Langenkamp, F Altmann, D Katzer, A Lindner, H Eggers Review of scientific instruments 71 (11), 4155-4160, 2000 | 127 | 2000 |
| Lock-in IR-thermography-A novel tool for material and device characterization ST Huth, O Breitenstein, A Huber, D Dantz, U Lambert, F Altmann diffusion and defect data part B solid state phenomena, 741-746, 2002 | 99 | 2002 |
| Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography C Schmidt, F Altmann, R Schlangen, H Deslandes 2010 17th IEEE International Symposium on the Physical and Failure Analysis …, 2010 | 75 | 2010 |
| Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis C Schmidt, F Altmann, O Breitenstein Materials Science and Engineering: B 177 (15), 1261-1267, 2012 | 65 | 2012 |
| Surface amorphization, sputter rate, and intrinsic stresses of silicon during low energy Ga+ focused-ion beam milling L Pastewka, R Salzer, A Graff, F Altmann, M Moseler Nuclear Instruments and Methods in Physics Research Section B: Beam …, 2009 | 65 | 2009 |
| Lock-in-Thermography for 3-dimensional localization of electrical defects inside complex packaged devices C Schmidt, F Altmann, C Grosse, A Lindner, V Gottschalk International Symposium for Testing and Failure Analysis 30910, 102-107, 2008 | 53 | 2008 |
| 3D sensor application with open through silicon via technology J Kraft, F Schrank, J Teva, J Siegert, G Koppitsch, C Cassidy, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 560-566, 2011 | 52 | 2011 |
| New developments in IR lock-in thermography O Breitenstein, JP Rakotoniaina, MH Al Rifai, M Gradhand, F Altmann, ... International Symposium for Testing and Failure Analysis 30873, 595-599, 2004 | 50 | 2004 |
| Improved AlScN/GaN heterostructures grown by metal-organic chemical vapor deposition C Manz, S Leone, L Kirste, J Ligl, K Frei, T Fuchs, M Prescher, P Waltereit, ... Semiconductor Science and Technology 36 (3), 034003, 2021 | 46 | 2021 |
| Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs D Malta, C Gregory, M Lueck, D Temple, M Krause, F Altmann, M Petzold, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1815-1821, 2011 | 42 | 2011 |
| Fault localization and functional testing of ICs by lock-in thermography O Breitenstein, JP Rakotoniaina, F Altmann, J Schulz, G Linse International Symposium for Testing and Failure Analysis 30774, 29-36, 2002 | 42 | 2002 |
| Thermal failure analysis by IR lock-in thermography O Breitenstein, C Schmidt, F Altmann, D Karg Microelectronics failure analysis desk reference 6, 2011 | 41 | 2011 |
| Lock-in thermal IR imaging using a solid immersion lens O Breitenstein, F Altmann, T Riediger, D Karg, V Gottschalk Microelectronics Reliability 46 (9-11), 1508-1513, 2006 | 34 | 2006 |
| Innovative failure analysis techniques for 3-D packaging developments F Altmann, M Petzold IEEE Design & Test 33 (3), 46-55, 2016 | 33 | 2016 |
| Dynamic lock-in thermography for operation mode-dependent thermally active fault localization R Schlangen, H Deslandes, T Lundquist, C Schmidt, F Altmann, K Yu, ... Microelectronics Reliability 50 (9-11), 1454-1458, 2010 | 31 | 2010 |
| Use of lock-in thermography for non-destructive 3D defect localization on system in package and stacked-die technology R Schlangen, S Motegi, T Nagatomo, C Schmidt, F Altmann, H Murakami, ... International Symposium for Testing and Failure Analysis 38268, 68-73, 2011 | 29 | 2011 |
| Fast and distributed thermal model for thermal modeling of GaN power devices V Sodan, S Stoffels, H Oprins, S Decoutere, F Altmann, M Baelmans, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 28 | 2018 |
| Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution M Krause, F Altmann, C Schmidt, M Petzold, D Malta, D Temple 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1452-1458, 2011 | 27 | 2011 |
| Micro structure analysis for system in package components―Novel tools for fault isolation, target preparation, and high-resolution material diagnostics M Petzold, F Altmann, M Krause, R Salzer, C Schmidt, S Martens, W Mack, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 27 | 2010 |
| Advanced FIB sample preparation techniques for high resolution TEM investigations of HEMT structures M Simon-Najasek, S Huebner, F Altmann, A Graff Microelectronics Reliability 54 (9-10), 1785-1789, 2014 | 26 | 2014 |
