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Jong-Pil Im
Jong-Pil Im
在 etri.re.kr 的电子邮件经过验证
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引用次数
引用次数
年份
5.7 A 40mV transformer-reuse self-startup boost converter with MPPT control for thermoelectric energy harvesting
JP Im, SW Wang, KH Lee, YJ Woo, YS Yuk, TH Kong, SW Hong, ST Ryu, ...
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 …, 2012
2992012
23.5 An energy pile-up resonance circuit extracting maximum 422% energy from piezoelectric material in a dual-source energy-harvesting interface
YS Yuk, S Jung, HD Gwon, S Choi, SD Sung, TH Kong, SW Hong, ...
2014 IEEE International Solid-State Circuits Conference Digest of Technical …, 2014
492014
17.3 A 0.9 V 6.3 μW multistage amplifier driving 500pF capacitive load with 1.34 MHz GBW
W Qu, JP Im, HS Kim, GH Cho
2014 IEEE International Solid-State Circuits Conference Digest of Technical …, 2014
382014
Artificial perspiration membrane by programmed deformation of thermoresponsive hydrogels
J Kim, S Im, JH Kim, SM Kim, SM Lee, J Lee, JP Im, J Woo, SE Moon
Advanced materials 32 (6), 1905901, 2020
272020
Improved Ferroelectric Switching in Sputtered HfZrOx Device Enabled by High Pressure Annealing
J Woo, Y Goh, S Im, JH Hwang, Y Kim, JH Kim, JP Im, SM Yoon, SE Moon, ...
IEEE Electron Device Letters 41 (2), 232-235, 2019
232019
Recent advancements in emerging neuromorphic device technologies
J Woo, JH Kim, JP Im, SE Moon
Advanced Intelligent Systems 2 (10), 2000111, 2020
172020
Self-powered autonomous wireless sensor node by using silicon-based 3D thermoelectric energy generator for environmental monitoring application
JP Im, JH Kim, JW Lee, JY Woo, SY Im, Y Kim, YS Eom, WC Choi, JS Kim, ...
Energies 13 (3), 674, 2020
172020
Optimized annealing conditions to enhance stability of polarization in sputtered HfZrOx layers for non-volatile memory applications
Y Kim, J Woo, S Im, Y Lee, JH Kim, JP Im, D Suh, SM Yang, SM Yoon, ...
Current Applied Physics 20 (12), 1441-1446, 2020
162020
Exploiting defective RRAM array as synapses of HTM spatial pooler with boost-factor adjustment scheme for defect-tolerant neuromorphic systems
J Woo, T Van Nguyen, JH Kim, JP Im, S Im, Y Kim, KS Min, SE Moon
Scientific Reports 10 (1), 11703, 2020
142020
Ferroelectric Switching in Trilayer Al2O3/HfZrOx/Al2O3 Structure
S Im, SY Kang, Y Kim, JH Kim, JP Im, SM Yoon, SE Moon, J Woo
micromachines 11 (10), 910, 2020
92020
Dual-input dual-output energy harvesting DC-DC boost converter for wireless body area network
SW Wang, JP Im, GH Cho
2011 IEEE Biomedical Circuits and Systems Conference (BioCAS), 217-220, 2011
72011
Battery module for correcting current difference between batteries connected in parallel and electronic device including the battery module
J Oh, JH Suk, YS Yang, JP Im
US Patent 10,497,988, 2019
62019
Transformer‐reuse reconfigurable synchronous boost converter with 20 mV MPPT‐input, 88% efficiency, and 37 mW maximum output power
JP Im, SE Moon, CG Lyuh
ETRI Journal 38 (4), 654-664, 2016
52016
Dc-dc boost converter for power generation element
JP IM, KD Kim, TM Roh, MG Jang
US Patent App. 14/453,436, 2015
52015
Interrelation between ferroelectric properties and defects based on low-frequency noise analysis of HZO ferroelectric capacitor
S Jin, J Jeon, MJ Kim, K Heo, JH Kim, JP Im, SM Yoon, SE Moon, J Woo, ...
Applied Physics Letters 122 (16), 2023
42023
Impedance spectroscopy-based electrical equivalent model of a thermoelectric module for the figure of merit (ZT)
J Lee, JH Kim, JP Im, SY Lim, EB Jeon, SE Moon
Solid-State Electronics 163, 107663, 2020
42020
High area-efficient DC-DC converter using time-mode miller compensation (TMMC)
SW Hong, TH Kong, S Jung, SW Lee, SW Wang, JP Im, GH Cho
2012 Symposium on VLSI Circuits (VLSIC), 180-181, 2012
42012
Capillary-Induced Clustering of Thermoresponsive Micropillars
JS Choi, S Lim, J Kim, SS Chung, SE Moon, JP Im, JH Kim, SM Kang
ACS Applied Materials & Interfaces 13 (48), 58201-58208, 2021
32021
CMOS-compatible mid-infrared MEMS thermopile integrated with an RTD for flame sensing in IoT application
J Lee, M Kwak, K Kim, J Im, JH Kim, SE Moon
2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS …, 2019
32019
Equivalent circuit-based open-circuit sensitivity modelling of a capacitive-type MEMS acoustic sensor on wafer level
J Lee, JP Im, JH Kim, SY Lim, SE Moon
Proceedings 2 (1), 725, 2018
32018
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